Abstract: A fiber optic connector for connecting one or more optical fibers to a fiber optic component includes: a ferrule configured to receive the one or more optical fibers; a ferrule holder configured to be coupled to the ferrule, wherein the ferrule and ferrule holder forms a ferrule support assembly when coupled together; and a shroud configured to be positioned about the ferrule support assembly and connectable to the fiber optic component. The ferrule support assembly and the shroud are configured so that the ferrule support assembly is movable relative to the shroud to positions outside the shroud when the shroud is disconnected from the fiber optic component, and the ferrule support assembly is confined within the shroud when the shroud is connected to the fiber optic component. A method of forming a fiber optic assembly using such a fiber optic connector is also disclosed.

Abstract: A fiber optic connector for connecting one or more optical fibers to a fiber optic component includes: a ferrule configured to receive the one or more optical fibers; a ferrule holder configured to be coupled to the ferrule, wherein the ferrule and ferrule holder forms a ferrule support assembly when coupled together; and a shroud configured to be positioned about the ferrule support assembly and connectable to the fiber optic component. The ferrule support assembly and the shroud are configured so that the ferrule support assembly is movable relative to the shroud to positions outside the shroud when the shroud is disconnected from the fiber optic component, and the ferrule support assembly is confined within the shroud when the shroud is connected to the fiber optic component. A method of forming a fiber optic assembly using such a fiber optic connector is also disclosed.

Abstract: A method for fabricating a pattern on a semiconductor substrate, comprising the steps of: (a) providing the semiconductor substrate having a photosensitive layer thereon; (b) transmitting the semiconductor substrate to an exposure apparatus including several tubes; (c) providing the supporting assembly to support the tubes, where the supporting assembly includes a first supporting rod having several first parallel recesses, a second supporting rod disposed opposite to the first supporting rod, a bridging member connected to one end of the first supporting rod or one end of the second supporting rod; and a rolling member received by the bridging member; (d) providing a photomask to the exposure apparatus; and (e) transferring the pattern from the photomask to the photosensitive layer.

Abstract: The present disclosure relates to a two-dimensional fiber array structure including a base which includes a baseboard, a cover board and a spacer layer, and an optical fiber cable is positioned between the baseboard and the cover board, positioning fibers are positioned at two external sides of the optical fiber cable, the spacer layer is abutted with two adjacent fiber layers of the optical fiber cable to reduce the position tolerance along X axis for further improving accuracy, whereby ensuring quality and stability of transmitting optical signal.

Abstract: A method for fabricating a pattern on a semiconductor substrate, comprising the steps of: (a) providing the semiconductor substrate having a photosensitive layer thereon; (b) transmitting the semiconductor substrate to an exposure apparatus including several tubes; (c) providing the supporting assembly to support the tubes, where the supporting assembly includes a first supporting rod having several first parallel recesses, a second supporting rod disposed opposite to the first supporting rod, a bridging member connected to one end of the first supporting rod or one end of the second supporting rod; and a rolling member received by the bridging member; (d) providing a photomask to the exposure apparatus; and (e) transferring the pattern from the photomask to the photosensitive layer.

Abstract: A supporting assembly configured to support a plurality of tubes includes a first supporting rod, a second supporting rod opposite to the first supporting rod, a bridging member, and a rolling member. The first supporting rod includes several first parallel recesses. The bridging member is connected to one end of the first supporting rod or one end of the second supporting rod. The rolling member is received by the bridging member.

Abstract: A supporting assembly configured to support a plurality of tubes includes a first supporting rod, a second supporting rod opposite to the first supporting rod, a bridging member, and a rolling member. The first supporting rod includes several first parallel recesses. The bridging member is connected to one end of the first supporting rod or one end of the second supporting rod. The rolling member is received by the bridging member.

Abstract: A processing module positioning system for window blind slats utilizes a position adjustment assembly to move plural processing modules to predetermined positions. The position adjustment assembly includes a servo motor employed to drive a connecting strap. A position control frame is fixed on the connecting strap, so that when the connecting strap is driven to move, the position control frame will be moved by the connecting strap to drive the processing modules connected on the position control frame to move. The position control frame can be connected to and disconnected from the processing modules.

Abstract: A processing module positioning system for window blind slats utilizes a position adjustment assembly to move plural processing modules to predetermined positions. The position adjustment assembly includes a servo motor employed to drive a connecting strap. A position control frame is fixed on the connecting strap, so that when the connecting strap is driven to move, the position control frame will be moved by the connecting strap to drive the processing modules connected on the position control frame to move. The position control frame can be connected to and disconnected from the processing modules.

Abstract: An exposure has at least two wafer pads for holding wafers at the same time to perform different tasks including exposing a wafer, aligning a wafer, and loading or unloading a wafer synchronously. The exposure of the invention includes an exposing unit, a wafer supporting unit and a alignment beam scan unit. The wafer-supporting unit contains at least two wafer pads for holding wafers. The alignment beam scan unit contains an interferometer for detecting the interference patterns formed by the alignment beams and the alignment marks on the wafers. The tasks of aligning a wafer, and exposing a wafer, or loading/unloading a wafer can be performed on the wafers placed on each individual wafer pad synchronously.