Patents by Inventor Ming T. Chiu

Ming T. Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of bending and soldering corners of a folding printed-circuit board
    Patent number: 5257718
    Abstract: A method of bending and soldering corners of a folding printed-circuit board in which holes are drilled on the printed-circuit board at points at where the circuits intersect the joints of segments of the folding printed-circuit board; V-shaped grooves are cut on the printed-circuit board along the joints of segments, permitting the printed-circuit board to be bent into a desired shape; and the drilled circuits are connected by soldering adequate amount of tin solder in the holes on the circuits.
    Type: Grant
    Filed: March 26, 1993
    Date of Patent: November 2, 1993
    Inventor: Ming T. Chiu