Patents by Inventor Ming-Ta Tei

Ming-Ta Tei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of rectifying a wafer thickness
    Publication number: 20030099907
    Abstract: A process of rectifying a wafer thickness includes the following steps. A wafer is first provided with an active side. Next, a lithography process is performed to form a photoresist at the active side and to pattern at least a opening therein. Subsequently, a welding material is formed in the openings. Afterward, an adhesive carrier is attached over the patterned photoresist. Next, rectification operation is performed to reduce the wafer thickness. Subsequently, the adhesive carrier is removed and then the patterned photoresist is removed.
    Type: Application
    Filed: November 29, 2001
    Publication date: May 29, 2003
    Inventors: Ming-Ta Tei, Chuen-Jye Lin, Hei-Mei Chen