Abstract: Disclosed are a novel zero-voltage switching control circuit and a control method. By a chip of a controller, a first switch unit is controlled to switch on-off of an input winding and a second switch unit is controlled to switch on-off between an auxiliary winding and a negative voltage level, wherein before the input winding is conducted, the auxiliary winding of a voltage converter is conducted with the negative voltage level in advance, and the input winding is forced to generates a negative current based on a coupling effect between the input winding and auxiliary winding, to release the energy of parasitic capacitance in the first switch unit cross voltages, so as to further enable a polarity inversion of the input winding, and the first switch unit cross-voltage decays to an expected low switching potential level.

Abstract: A method of manufacturing an isolation structure includes forming a laminate structure on a substrate. A plurality trenches is formed in the laminate structure. Subsequently a pre-processing is effected to form a hydrophilic thin film having oxygen ions on the inner wall of the trenches. Spin-on-dielectric (SOD) materials are filled into the trenches. The hydrophilic think film having oxygen ions changes the surface tension of the inner wall of the trenches and increases SOD material fluidity.

Abstract: A method of manufacturing an isolation structure includes forming a laminate structure on a substrate. A plurality trenches is formed in the laminate structure. Subsequently a pre-processing is effected to form a hydrophilic thin film having oxygen ions on the inner wall of the trenches. Spin-on-dielectric (SOD) materials are filled into the trenches. The hydrophilic think film having oxygen ions changes the surface tension of the inner wall of the trenches and increases SOD material fluidity.

Abstract: A Spin-On Dielectric (SOD) method with multi stage ramping temperature for coating a dielectric material onto a substrate, comprising the steps of: (a) placing the substrate on a chill plate to decrease the temperature; (b) fixing the chilled substrate on a spinning device; (c) rotating the spinning device to drive the substrate rotating; (d) injecting the dielectric material onto the center of the substrate; (e) spreading the dielectric material on the upper surface of the substrate by spinning; (f) baking the substrate and the dielectric material by a heat plate to achieve multi stages ramping temperature, where the temperature of each stage has a steady state temperature for a predetermined time and the posterior stage has higher temperature than the anterior stage; (g) placing the substrate on the chill plate for cooling down; (h) spreading a film of dielectric material and finishing the coating.