Abstract: A device includes a semiconductor substrate, a contact plug over the semiconductor substrate, and an Inter-Layer Dielectric (ILD) layer over the semiconductor substrate, with the contact plug being disposed in the ILD. An air gap is sealed by a portion of the ILD and the semiconductor substrate. The air gap forms a full air gap ring encircling a portion of the semiconductor substrate.

Abstract: A device includes a semiconductor substrate, a contact plug over the semiconductor substrate, and an Inter-Layer Dielectric (ILD) layer over the semiconductor substrate, with the contact plug being disposed in the ILD. An air gap is sealed by a portion of the ILD and the semiconductor substrate. The air gap forms a full air gap ring encircling a portion of the semiconductor substrate.

Abstract: A device includes a semiconductor substrate, a contact plug over the semiconductor substrate, and an Inter-Layer Dielectric (ILD) layer over the semiconductor substrate, with the contact plug being disposed in the ILD. An air gap is sealed by a portion of the ILD and the semiconductor substrate. The air gap forms a full air gap ring encircling a portion of the semiconductor substrate.

Abstract: An apparatus may include a vessel adapted to contain an organic solvent and a dehydration apparatus coupled with the vessel. The dehydration apparatus may be adapted to remove water from the organic solvent. The apparatus may further include a water content monitor coupled to the dehydration apparatus and the vessel, in which the water content monitor is adapted to determine a water content of the organic solvent. The apparatus may further include a wafer handler adapted to transfer at least one semiconductor wafer including a MEMS device into the vessel.

Abstract: Methods and apparatus for MEMS release are disclosed. A method is described including providing a substrate including at least one MEMS device supported by a sacrificial layer; performing an etch in solution to remove the sacrificial layer from at least one MEMS device; immersing the substrate including the at least one MEMS device in an organic solvent; and while the substrate is immersed in the organic solvent, removing water from the organic solvent until the water remaining in the organic solvent is less than a predetermined threshold. An apparatus is disclosed for performing the methods. Additional alternative methods are disclosed.

Abstract: Embodiments of mechanisms of an optical inspection system for inspecting an object are provided. The optical inspection system includes a light source emitting a coherent beam having a first width, and a beam expander increasing the first width to a second width. The optical inspection system also includes an polaroid module adjacent to the beam expander and polarizing the coherent beam. The object generates an inspection beam with an interference pattern by reflecting the polarized coherent beam. The optical inspection system further includes an image module capturing the inspection beam.

Abstract: A method and structure for preventing film delamination provide for forming a thick film then partitioning the thick film into a plurality of discrete portions prior to subsequent thermal processing operations. The partitioning alleviates the effects of film stress at the interface between the film and the underlying material and prevents delamination during the subsequent thermal cycling operations, that take place subsequent to the formation of the film. The partitioned film includes a pattern density of at least about 80 percent and the discrete portions do not individually serve as device structures.

Abstract: A device includes a semiconductor substrate, a contact plug over the semiconductor substrate, and an Inter-Layer Dielectric (ILD) layer over the semiconductor substrate, with the contact plug being disposed in the ILD. An air gap is sealed by a portion of the ILD and the semiconductor substrate. The air gap forms a full air gap ring encircling a portion of the semiconductor substrate.

Abstract: A method and structure for preventing film delamination provide for forming a thick film then partitioning the thick film into a plurality of discrete portions prior to subsequent thermal processing operations. The partitioning alleviates the effects of film stress at the interface between the film and the underlying material and prevents delamination during the subsequent thermal cycling operations, that take place subsequent to the formation of the film. The partitioned film includes a pattern density of at least about 80 percent and the discrete portions do not individually serve as device structures.