Patents by Inventor Ming-Tai Weng
Ming-Tai Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136420Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.Type: ApplicationFiled: December 1, 2022Publication date: April 25, 2024Applicant: AUO CorporationInventors: Kuo-Jui Chang, Wen-Tai Chen, Chi-Sheng Chiang, Yu-Chuan Liao, Chien-Sen Weng, Ming-Wei Sun
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Patent number: 11516940Abstract: A middle bezel frame with heat dissipation structure includes a main body, which includes a frame portion and at least one heat-exchange portion. The frame portion is located around and connected to the heat-exchange portion. The heat-exchange portion internally has an airtight chamber, in which at least one wick structure and a working fluid are provided. With these arrangement, the middle bezel frame has enhanced structural strength while provides good heat dissipation effect.Type: GrantFiled: December 25, 2018Date of Patent: November 29, 2022Assignee: Asia Vital Components Co., Ltd.Inventor: Ming-Tai Weng
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Publication number: 20200205316Abstract: A middle bezel frame with heat dissipation structure includes a main body, which includes a frame portion and at least one heat-exchange portion. The frame portion is located around and connected to the heat-exchange portion. The heat-exchange portion internally has an airtight chamber, in which at least one wick structure and a working fluid are provided. With these arrangement, the middle bezel frame has enhanced structural strength while provides good heat dissipation effect.Type: ApplicationFiled: December 25, 2018Publication date: June 25, 2020Inventor: Ming-Tai Weng
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Patent number: 9303927Abstract: A heat spreader structure and a manufacturing method thereof. The heat spreader structure includes a main body. The main body includes a first board body and a second board body corresponding to the first board body. The second board body is mated with the first board body to form the main body. The main body has a circulation area and a connection area. The circulation area is connected with the connection area to together define a chamber in which a working fluid is contained. The circulation area has a first capillary structure, while the connection area has a second capillary structure. In manufacturing, the heat spreader structure can be freely bent and shaped without damaging the internal capillary structures.Type: GrantFiled: July 6, 2011Date of Patent: April 5, 2016Assignee: Asia Vital Components Co., Ltd.Inventors: Hsiu-Wei Yang, Ming-Tai Weng
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Patent number: 8997839Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.Type: GrantFiled: March 9, 2011Date of Patent: April 7, 2015Assignee: Asia Vital Components Co., Ltd.Inventors: Hsiu-Wei Yang, Ming-Tai Weng
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Patent number: 8893384Abstract: A heat pipe manufacturing method includes the steps of preparing a pipe and a wick structure; placing the wick structure in the pipe, vacuuming the pipe, and filling a working fluid in the pipe; and sealing the pipe. By manufacturing a heat pipe with this method, the risk of damaging the wick structure in the pipe during bending or pressing the pipe can be avoided to thereby ensure increased good yield. Further, with this method, the pipe can be pressed to form a thin heat pipe to thereby provide increased flexibility in production.Type: GrantFiled: June 28, 2011Date of Patent: November 25, 2014Assignee: Asia Vital Components Co., Ltd.Inventors: Hsiu-Wei Yang, Ming-Tai Weng
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Patent number: 8757247Abstract: A heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of first extended sections and a plurality of second extended sections. The first and the second extended sections are connected to and intersected with one another to thereby define a plurality of intersections and open spaces on the thin-sheet member. The bosses are provided on at least some of the intersections of the first and the second extended sections to provide supporting strength for the heat pipe structure as well as vapor-liquid circulation of the working fluid in the heat pipe structure.Type: GrantFiled: March 9, 2011Date of Patent: June 24, 2014Assignee: Asia Vital Components Co., Ltd.Inventors: Hsiu-Wei Yang, Ming-Tai Weng
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Publication number: 20140082943Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.Type: ApplicationFiled: November 26, 2013Publication date: March 27, 2014Applicant: Asia Vital Components Co., Ltd.Inventors: Hsiu-Wei Yang, Ming-Tai Weng
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Publication number: 20130000122Abstract: A heat pipe manufacturing method includes the steps of preparing a pipe and a wick structure; placing the wick structure in the pipe, vacuuming the pipe, and filling a working fluid in the pipe; and sealing the pipe. By manufacturing a heat pipe with this method, the risk of damaging the wick structure in the pipe during bending or pressing the pipe can be avoided to thereby ensure increased good yield. Further, with this method, the pipe can be pressed to form a thin heat pipe to thereby provide increased flexibility in production.Type: ApplicationFiled: June 28, 2011Publication date: January 3, 2013Inventors: Hsiu-Wei Yang, Ming-Tai Weng
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Publication number: 20120305222Abstract: A heat spreader structure and a manufacturing method thereof. The heat spreader structure includes a main body. The main body includes a first board body and a second board body corresponding to the first board body. The second board body is mated with the first board body to form the main body. The main body has a circulation area and a connection area. The circulation area is connected with the connection area to together define a chamber in which a working fluid is contained. The circulation area has a first capillary structure, while the connection area has a second capillary structure. In manufacturing, the heat spreader structure can be freely bent and shaped without damaging the internal capillary structures.Type: ApplicationFiled: July 6, 2011Publication date: December 6, 2012Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Hsiu-Wei Yang, Ming-Tai Weng
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Publication number: 20120305223Abstract: A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a support body. The tubular body has at least one receiving space in which a working fluid is contained. The support body is disposed in the receiving space to partition the receiving space into a first chamber and a second chamber. By means of the manufacturing method of the thin heat pipe structure, the thin heat pipe structure can be made with greatly enhanced heat transfer efficiency. In addition, in the manufacturing process, the ratio of good products is increased to lower the manufacturing cost.Type: ApplicationFiled: July 6, 2011Publication date: December 6, 2012Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Hsiu-Wei Yang, Ming-Tai Weng
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Publication number: 20120180995Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.Type: ApplicationFiled: March 9, 2011Publication date: July 19, 2012Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Hsiu-Wei Yang, Ming-Tai Weng
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Publication number: 20120180994Abstract: A heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of first extended sections and a plurality of second extended sections. The first and the second extended sections are connected to and intersected with one another to thereby define a plurality of intersections and open spaces on the thin-sheet member. The bosses are provided on at least some of the intersections of the first and the second extended sections to enable increased supporting strength of the heat pipe structure as well as enhanced vapor-liquid circulation efficiency of the working fluid in the heat pipe structure.Type: ApplicationFiled: March 9, 2011Publication date: July 19, 2012Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Hsiu-Wei Yang, Ming-Tai Weng