Patents by Inventor Ming-Tai Weng

Ming-Tai Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136420
    Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.
    Type: Application
    Filed: December 1, 2022
    Publication date: April 25, 2024
    Applicant: AUO Corporation
    Inventors: Kuo-Jui Chang, Wen-Tai Chen, Chi-Sheng Chiang, Yu-Chuan Liao, Chien-Sen Weng, Ming-Wei Sun
  • Patent number: 11516940
    Abstract: A middle bezel frame with heat dissipation structure includes a main body, which includes a frame portion and at least one heat-exchange portion. The frame portion is located around and connected to the heat-exchange portion. The heat-exchange portion internally has an airtight chamber, in which at least one wick structure and a working fluid are provided. With these arrangement, the middle bezel frame has enhanced structural strength while provides good heat dissipation effect.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: November 29, 2022
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Ming-Tai Weng
  • Publication number: 20200205316
    Abstract: A middle bezel frame with heat dissipation structure includes a main body, which includes a frame portion and at least one heat-exchange portion. The frame portion is located around and connected to the heat-exchange portion. The heat-exchange portion internally has an airtight chamber, in which at least one wick structure and a working fluid are provided. With these arrangement, the middle bezel frame has enhanced structural strength while provides good heat dissipation effect.
    Type: Application
    Filed: December 25, 2018
    Publication date: June 25, 2020
    Inventor: Ming-Tai Weng
  • Patent number: 9303927
    Abstract: A heat spreader structure and a manufacturing method thereof. The heat spreader structure includes a main body. The main body includes a first board body and a second board body corresponding to the first board body. The second board body is mated with the first board body to form the main body. The main body has a circulation area and a connection area. The circulation area is connected with the connection area to together define a chamber in which a working fluid is contained. The circulation area has a first capillary structure, while the connection area has a second capillary structure. In manufacturing, the heat spreader structure can be freely bent and shaped without damaging the internal capillary structures.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: April 5, 2016
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Patent number: 8997839
    Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: April 7, 2015
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Patent number: 8893384
    Abstract: A heat pipe manufacturing method includes the steps of preparing a pipe and a wick structure; placing the wick structure in the pipe, vacuuming the pipe, and filling a working fluid in the pipe; and sealing the pipe. By manufacturing a heat pipe with this method, the risk of damaging the wick structure in the pipe during bending or pressing the pipe can be avoided to thereby ensure increased good yield. Further, with this method, the pipe can be pressed to form a thin heat pipe to thereby provide increased flexibility in production.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: November 25, 2014
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Patent number: 8757247
    Abstract: A heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of first extended sections and a plurality of second extended sections. The first and the second extended sections are connected to and intersected with one another to thereby define a plurality of intersections and open spaces on the thin-sheet member. The bosses are provided on at least some of the intersections of the first and the second extended sections to provide supporting strength for the heat pipe structure as well as vapor-liquid circulation of the working fluid in the heat pipe structure.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: June 24, 2014
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Publication number: 20140082943
    Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.
    Type: Application
    Filed: November 26, 2013
    Publication date: March 27, 2014
    Applicant: Asia Vital Components Co., Ltd.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Publication number: 20130000122
    Abstract: A heat pipe manufacturing method includes the steps of preparing a pipe and a wick structure; placing the wick structure in the pipe, vacuuming the pipe, and filling a working fluid in the pipe; and sealing the pipe. By manufacturing a heat pipe with this method, the risk of damaging the wick structure in the pipe during bending or pressing the pipe can be avoided to thereby ensure increased good yield. Further, with this method, the pipe can be pressed to form a thin heat pipe to thereby provide increased flexibility in production.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 3, 2013
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Publication number: 20120305222
    Abstract: A heat spreader structure and a manufacturing method thereof. The heat spreader structure includes a main body. The main body includes a first board body and a second board body corresponding to the first board body. The second board body is mated with the first board body to form the main body. The main body has a circulation area and a connection area. The circulation area is connected with the connection area to together define a chamber in which a working fluid is contained. The circulation area has a first capillary structure, while the connection area has a second capillary structure. In manufacturing, the heat spreader structure can be freely bent and shaped without damaging the internal capillary structures.
    Type: Application
    Filed: July 6, 2011
    Publication date: December 6, 2012
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Publication number: 20120305223
    Abstract: A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a support body. The tubular body has at least one receiving space in which a working fluid is contained. The support body is disposed in the receiving space to partition the receiving space into a first chamber and a second chamber. By means of the manufacturing method of the thin heat pipe structure, the thin heat pipe structure can be made with greatly enhanced heat transfer efficiency. In addition, in the manufacturing process, the ratio of good products is increased to lower the manufacturing cost.
    Type: Application
    Filed: July 6, 2011
    Publication date: December 6, 2012
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Publication number: 20120180995
    Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.
    Type: Application
    Filed: March 9, 2011
    Publication date: July 19, 2012
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Publication number: 20120180994
    Abstract: A heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of first extended sections and a plurality of second extended sections. The first and the second extended sections are connected to and intersected with one another to thereby define a plurality of intersections and open spaces on the thin-sheet member. The bosses are provided on at least some of the intersections of the first and the second extended sections to enable increased supporting strength of the heat pipe structure as well as enhanced vapor-liquid circulation efficiency of the working fluid in the heat pipe structure.
    Type: Application
    Filed: March 9, 2011
    Publication date: July 19, 2012
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng