Patents by Inventor Ming-Tang Chen

Ming-Tang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11947914
    Abstract: In embodiments of the present disclosure, there is provided an approach for fact checking based on semantic graphs. According to embodiments of the present disclosure, after obtaining a text to be fact checked, a plurality of evidence sentences related to the text are retrieved from an evidence database. Then, semantic graphs of the text and the evidence sentences are constructed based on the semantic analysis, and a veracity of a statement in the text can be determined based on the semantic graphs. Embodiments of the present disclosure propose a graph-based reasoning approach for fact checking, and use the constructed semantic graphs to facilitate verification of the truthfulness of the text, thereby improving the accuracy for fact checking.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: April 2, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Duyu Tang, Nan Duan, Ming Zhou, Jiun-Hung Chen, Pengcheng Wang, Ying Qiao
  • Publication number: 20240069976
    Abstract: A serverless computing-based, continuous gateway watch of a data store for data change process is provided. The process includes the gateway interface of the computing environment receiving a watch request from a user system to monitor the data store for data change. Based on receiving the watch request, the gateway interface invokes a serverless setup service to establish a connection between the gateway interface and the data store of the computing environment to be monitored for data change. Based on receiving, at the gateway interface, a data change indication from the data store, the gateway interface invokes a serverless message process service to mutate the data change indication from the data store into a mutated data change message indicative of a data change at the data store for return to the user system pursuant to the watch request, with the serverless message process service terminating thereafter.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Inventors: Gang TANG, Peng Hui JIANG, Ming Shuang XIAN, Qin Yue CHEN
  • Publication number: 20240011016
    Abstract: A Saccharomyces cerevisiae antibody display system that simultaneously secrets and displays antibody fragments from a very large size synthetic nave human antibody library for therapeutic antibody lead discovery and engineering is described. A bait anchor complexed with a monovalent antibody fragment is tethered on the surface of the S. cerevisiae host cell, wherein the fragment can be assayed for antigen binding, while the full bivalent antibody is simultaneously secreted from the host cell. Methods of using the system for identifying antibodies from the library that bind specifically to an antigen of interest are also provided. Polypeptides, polynucleotides and host cells used for making the antibody display system are also provided along with methods of use thereof.
    Type: Application
    Filed: November 18, 2021
    Publication date: January 11, 2024
    Applicant: MERCK SHARP & DOHME LLC
    Inventors: Michelle Castor, Ming-Tang Chen, Chung-Ming Hsieh
  • Publication number: 20230365667
    Abstract: Binding proteins that bind amyloid beta (Abeta) are described, including heavy chain antibody variable domain (VHH) constructs comprising human-like VHH comprising three synthetically generated complementarity determining region (CDR) areas. Human-like VHHs identified using these libraries may be useful for the manufacture of therapeutics for treating diseases and disorders.
    Type: Application
    Filed: September 27, 2021
    Publication date: November 16, 2023
    Applicant: Merck Sharp & Dohme LLC
    Inventors: Alexander Mario Sevy, Ming-Tang Chen
  • Publication number: 20230352118
    Abstract: A computer-implemented method is disclosed for candidate antibody exploration. The method includes receiving sequence reads from a sequencing system, wherein each sequence read comprises a target gene for expressing a candidate antibody, wherein each sequence read is associated with a binding affinity to a target antigen. The method includes generating a sequence representation for each sequence read, representing the amino acid sequences of the sequence read. The method includes training a binding affinity prediction model with the sequence representations and the binding affinities. The method includes generating a synthetic candidate sequence read that is different from the sequence reads. The method includes generating a sequence representation for the synthetic candidate sequence read.
    Type: Application
    Filed: May 2, 2023
    Publication date: November 2, 2023
    Inventors: Yara Seif, Xiao Xiao, Kevin Teng, Ming-Tang Chen, Alan C. Cheng, BoRam Lee, Isha Verma
  • Publication number: 20230272056
    Abstract: Provided herein are anti-LAP antibodies (e.g., recombinant humanized, chimeric, and human anti-LAP antibodies) or antigen binding fragments thereof which have therapeutically beneficial properties, such as binding specifically to LAP-TGF?1 on cells but not to LAP-TGF?1 in extracellular matrix, as well as compositions including the same. Also provided are uses of these antibodies or antigen binding fragments in therapeutic applications, such as in the treatment of cancer, and diagnostic applications.
    Type: Application
    Filed: April 8, 2021
    Publication date: August 31, 2023
    Applicant: Merck Sharp & Dohme LLC
    Inventors: Chung-Ming Hsieh, Michelle Castor, Ming-Tang Chen, Alan C. Cheng, Scott A. Hollingsworth, Veronica M. Juan, Madhura Shidhore, Song Yang, Renee C.T. Moore
  • Publication number: 20230265175
    Abstract: Provided herein are high affinity antibodies or antigen binding fragments thereof that specifically bind to human tau-pS413. Also provided are compositions, kits, methods, and uses involving such antibodies or antigen binding fragments thereof.
    Type: Application
    Filed: June 23, 2021
    Publication date: August 24, 2023
    Applicant: Merck Sharp & Dohme LLC
    Inventors: Jeanne E. Baker, Sophie Parmentier Batteur, Ming-Tang Chen, Alan C. Cheng, Chung-Ming Hsieh, Carl Mieczkowski, Sokreine Suon
  • Patent number: 11702467
    Abstract: Provided herein are high affinity antibodies or antigen binding fragments thereof that specifically bind to human tau-pS413. Also provided are compositions, kits, methods, and uses involving such antibodies or antigen binding fragments thereof.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: July 18, 2023
    Assignee: Merck Sharp & Dohme LLC
    Inventors: Jeanne E. Baker, Sophie Parmentier Batteur, Ming-Tang Chen, Alan C. Cheng, Chung-Ming Hsieh, Carl Mieczkowski, Sokreine Suon
  • Publication number: 20230167168
    Abstract: Provided herein are high affinity antibodies or antigen binding fragments thereof that specifically bind to human tau-pS413. Also provided are compositions, kits, methods, and uses involving such antibodies or antigen binding fragments thereof.
    Type: Application
    Filed: June 23, 2021
    Publication date: June 1, 2023
    Applicant: Merck Sharp & Dohme Corp.
    Inventors: Jeanne E. Baker, Sophie Parmentier Batteur, Ming-Tang Chen, Alan C. Cheng, Chung-Ming Hsieh, Carl Mieczkowski, Sokreine Suon
  • Publication number: 20230102101
    Abstract: Heavy chain antibody variable domain (VHH) display libraries are described comprising human-like VHH comprising three synthetically generated complementarity determining region (CDR) areas in which the amino acids at each of positions 44 and 45 or positions 37, 44, 45, and 47 comprise the amino acid at the corresponding position of a Camelid VHH, wherein the amino acid positions are according to Kabat numbering Human-like VHHs identified using these libraries may be useful for the manufacture of therapeutics for treating diseases and disorders.
    Type: Application
    Filed: March 1, 2021
    Publication date: March 30, 2023
    Applicant: Merck Sharp & Dohme LLC
    Inventors: Lei Chen, Ming-Tang Chen, Chung-Ming Hsieh, Alexander Mario Sevy
  • Patent number: 11411003
    Abstract: A DRAM device and its manufacturing method are provided. The DRAM device includes an interlayer dielectric layer and capacitor units framed on a substrate. The interlayer dielectric layer has capacitor unit accommodating through holes and includes a first support layer, a composite dielectric layer, and a second support layer sequentially formed on the substrate. The composite dielectric layer includes at least one first insulating layer and second insulating layer alternately stacked. Each capacitor unit accommodating through hole forms a first opening in the second insulating layer and forms a second opening communicating with the first opening in the first insulating layer. The second opening is wider than the first opening. The capacitor units are formed in the capacitor unit accommodating through holes. The top of the capacitor unit is higher than the top surface of the interlayer dielectric layer and defines a recessed region.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: August 9, 2022
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Cheol-Soo Park, Ming-Tang Chen
  • Patent number: 11251262
    Abstract: A capacitor and a manufacturing method thereof are provided. The capacitor includes a cup-shaped lower electrode, a capacitive dielectric layer, an upper electrode, and a support layer. The support layer includes an upper support layer surrounding an upper portion of the cup-shaped lower electrode, a middle support layer surrounding a middle portion of the cup-shaped lower electrode, and a lower support layer surrounding a lower portion of the cup-shaped lower electrode. Surfaces of the upper support layer, the middle support layer, and the lower support layer are covered by the capacitive dielectric layer.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: February 15, 2022
    Assignee: Winbond Electronics Corp.
    Inventors: Yu-Ping Hsiao, Wei-Chao Chou, Ming-Tang Chen, Cheol Soo Park
  • Publication number: 20210403541
    Abstract: Provided herein are high affinity antibodies or antigen binding fragments thereof that specifically bind to human tau-pS413. Also provided are compositions, kits, methods, and uses involving such antibodies or antigen binding fragments thereof.
    Type: Application
    Filed: June 23, 2021
    Publication date: December 30, 2021
    Applicant: Merck Sharp & Dohme Corp.
    Inventors: Jeanne E. Baker, Sophie Parmentier Batteur, Ming-Tang Chen, Alan C. Cheng, Chung-Ming Hsieh, Carl Mieczkowski, Sokreine Suon
  • Publication number: 20210242209
    Abstract: A DRAM device and its manufacturing method are provided. The DRAM device includes an interlayer dielectric layer and capacitor units framed on a substrate. The interlayer dielectric layer has capacitor unit accommodating through holes and includes a first support layer, a composite dielectric layer, and a second support layer sequentially formed on the substrate. The composite dielectric layer includes at least one first insulating layer and second insulating layer alternately stacked. Each capacitor unit accommodating through hole forms a first opening in the second insulating layer and forms a second opening communicating with the first opening in the first insulating layer. The second opening is wider than the first opening. The capacitor units are formed in the capacitor unit accommodating through holes. The top of the capacitor unit is higher than the top surface of the interlayer dielectric layer and defines a recessed region.
    Type: Application
    Filed: February 3, 2021
    Publication date: August 5, 2021
    Inventors: Cheol-Soo PARK, Ming-Tang CHEN
  • Publication number: 20210151554
    Abstract: A capacitor and a manufacturing method thereof are provided. The capacitor includes a cup-shaped lower electrode, a capacitive dielectric layer, an upper electrode, and a support layer. The support layer includes an upper support layer surrounding an upper portion of the cup-shaped lower electrode, a middle support layer surrounding a middle portion of the cup-shaped lower electrode, and a lower support layer surrounding a lower portion of the cup-shaped lower electrode. Surfaces of the upper support layer, the middle support layer, and the lower support layer are covered by the capacitive dielectric layer.
    Type: Application
    Filed: September 25, 2020
    Publication date: May 20, 2021
    Applicant: Winbond Electronics Corp.
    Inventors: Yu-Ping Hsiao, Wei-Chao Chou, Ming-Tang Chen, CHEOL SOO PARK
  • Patent number: 10910468
    Abstract: Provided is a capacitor structure including a substrate, a cup-shaped lower electrode, a top supporting layer, a capacitor dielectric layer, and an upper electrode. The cup-shaped lower electrode is located on the substrate. The top supporting layer surrounds the upper portion of the cup-shaped lower electrode. The top supporting layer includes a high-k material. Surfaces of the cup-shaped lower electrode and the top supporting layer are covered by the capacitor dielectric layer. A surface of the capacitor dielectric layer is covered by the upper electrode.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: February 2, 2021
    Assignee: Winbond Electronics Corp.
    Inventors: Cheol Soo Park, Ming-Tang Chen, Chun-Chieh Wang
  • Patent number: 10734390
    Abstract: A method of manufacturing a memory device includes following steps. A first dielectric layer is formed on the substrate between bit-line structures. First trenches are formed in the first dielectric layer. A second dielectric layer is formed to fill in the first trenches. A portion of the first dielectric layer is removed, so that a top surface of the first dielectric layer is lower than a top surface of the second dielectric layer. A first mask layer is formed to cover the top surfaces of the first and second dielectric layers. A first etching process is performed to form second trenches in the first dielectric layer. A third dielectric layer is formed to fill the second trenches. The first dielectric layer is removed to form contact openings between the second and third dielectric layers. A conductive material is formed to fill in the contact openings.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: August 4, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Cheol Soo Park, Ming-Tang Chen, Shuen-Hsiang Ke
  • Publication number: 20200152732
    Abstract: Provided is a capacitor structure including a substrate, a cup-shaped lower electrode, a top supporting layer, a capacitor dielectric layer, and an upper electrode. The cup-shaped lower electrode is located on the substrate. The top supporting layer surrounds the upper portion of the cup-shaped lower electrode. The top supporting layer includes a high-k material. Surfaces of the cup-shaped lower electrode and the top supporting layer are covered by the capacitor dielectric layer. A surface of the capacitor dielectric layer is covered by the upper electrode.
    Type: Application
    Filed: January 10, 2020
    Publication date: May 14, 2020
    Applicant: Winbond Electronics Corp.
    Inventors: CHEOL SOO PARK, Ming-Tang Chen, Chun-Chieh Wang
  • Patent number: 10566415
    Abstract: Provided is a capacitor structure including a substrate, a cup-shaped lower electrode, a top supporting layer, a capacitor dielectric layer, and an upper electrode. The cup-shaped lower electrode is located on the substrate. The top supporting layer surrounds the upper portion of the cup-shaped lower electrode. The top supporting layer includes a high-k material. Surfaces of the cup-shaped lower electrode and the top supporting layer are covered by the capacitor dielectric layer. A surface of the capacitor dielectric layer is covered by the upper electrode.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: February 18, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Cheol Soo Park, Ming-Tang Chen, Chun-Chieh Wang
  • Publication number: 20180358428
    Abstract: Provided is a capacitor structure including a substrate, a cup-shaped lower electrode, a top supporting layer, a capacitor dielectric layer, and an upper electrode. The cup-shaped lower electrode is located on the substrate. The top supporting layer surrounds the upper portion of the cup-shaped lower electrode. The top supporting layer includes a high-k material. Surfaces of the cup-shaped lower electrode and the top supporting layer are covered by the capacitor dielectric layer. A surface of the capacitor dielectric layer is covered by the upper electrode.
    Type: Application
    Filed: May 23, 2018
    Publication date: December 13, 2018
    Applicant: Winbond Electronics Corp.
    Inventors: CHEOL SOO PARK, Ming-Tang Chen, Chun-Chieh Wang