Abstract: A blind insert fluid connection module includes a first fluid connector located on a first assembly and a second fluid connector located on a second assembly. The second fluid connector is used to engage the first fluid connector in a first direction to form a fluid channel. The second assembly includes a main body, a guide structure, and a cushioning resilient member. The fastening member is located on the main body. The guide structure is located on the main body, and the second fluid connector is fixed on the guide structure. The cushioning resilient member is connected to the guide structure to provide a buffer displacement of the second fluid connector along the second direction when the first and second fluid connectors are joined, wherein an included angle is formed between the second direction and the first direction.

Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.

Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.

Abstract: A blind insert fluid connection module includes a first fluid connector located on a first assembly and a second fluid connector located on a second assembly. The second fluid connector is used to engage the first fluid connector in a first direction to form a fluid channel. The second assembly includes a main body, a guide structure, and a cushioning resilient member. The fastening member is located on the main body. The guide structure is located on the main body, and the second fluid connector is fixed on the guide structure. The cushioning resilient member is connected to the guide structure to provide a buffer displacement of the second fluid connector along the second direction when the first and second fluid connectors are joined, wherein an included angle is formed between the second direction and the first direction.

Abstract: An adjustable rack assembly and a cabinet using the same are disclosed. The adjustable rack assembly includes a rail and a sliding component. The rail is extended along a first direction, and includes a rail body, a bent portion and plural positioning grooves. The bent portion protrudes inwardly from an outer edge of the rail body, and the plural positioning grooves are disposed on the bent portion along the first direction. The sliding component includes a sliding body, a limiting portion and a guiding groove. The limiting portion is connected to the sliding body, and the guiding groove and the bent portion are mutually matched. When the sliding component is misaligned with the plural positioning grooves in the first direction, the sliding component is allowed to slide in the first direction. When the sliding component is engaged with the positioning groove, the sliding component is locked on the rail.

Abstract: The present disclosure provides an immersion cooling system for a server cabinet including a plurality of server boxes, a cooling tank and a plurality of liquid connecting pipes. Each server box includes an electronic device immersed in the cooling liquid, and the electronic device generates a thermal energy so that part of the cooling liquid evaporates into a hot vapor. The cooling tank is connected to the plurality of server boxes and includes a condenser and a storage part. The condenser is connected to each server box and condenses the hot vapor to form the cooling liquid. The storage part storages the cooling liquid from the condenser. Two ends of the liquid connecting pipe is connected to the storage part and the server box respectively. The cooling liquid in the storage part and the cooling liquid of each server box are maintained in a same liquid level.

Abstract: A leak detection sensor is disclosed for detecting a leaking liquid spilled from an adapter-coupling position, and includes a first conductive layer, an insulator and a second conductive layer. The first conductive layer includes a first through hole. The adapter-coupling position is located adjacent to the first through hole. The insulator includes a second through hole. The second conductive layer is connected to the first conductive layer through the insulator, and includes a conducting surface in fluid communication with the adapter-coupling position through the second through hole and the first through hole. The first conductive layer and the second conductive layer are insulated from each other through the insulator. When the leaking liquid is spilled into the first through hole and the second through hole, and contacts the conducting surface, the second conductive layer is conducted to the first conductive layer to form a conducting-resistance value.

Abstract: A leak detection sensor is disclosed for detecting a leaking liquid spilled from an adapter-coupling position, and includes a first conductive layer, an insulator and a second conductive layer. The first conductive layer includes a first through hole. The adapter-coupling position is located adjacent to the first through hole. The insulator includes a second through hole. The second conductive layer is connected to the first conductive layer through the insulator, and includes a conducting surface in fluid communication with the adapter-coupling position through the second through hole and the first through hole. The first conductive layer and the second conductive layer are insulated from each other through the insulator. When the leaking liquid is spilled into the first through hole and the second through hole, and contacts the conducting surface, the second conductive layer is conducted to the first conductive layer to form a conducting-resistance value.

Abstract: The present disclosure provides a latch mechanism, applied to a rack-mount server system. The rack-mount server system includes a server and a manifold, and the server includes a casing and a fluid connector. The manifold includes a manifold connector. The latch mechanism includes a fixing member, a fixing frame and a hook member. The fixing member is disposed on the manifold and includes a fixing pin. The fixing frame is secured to the server and includes a shaft. The hook member is rotatably disposed on the shaft and includes a hook portion. By rotating the hook portion to latch with the fixing pin, the fixing frame and fixing member are secured with each other, and the fluid connector of the server is coupled to and in fluid communication with the manifold connector of the manifold.

Abstract: The present disclosure provides a liquid cooling manifold. The liquid cooling manifold includes a channel body and a plurality of fluid connectors. The channel body includes a base, a wall portion and a fixing portion. The wall portion is connected between the base and the fixing portion, and a fluid channel is formed among the base, the wall portion and the fixing portion. The fixing portion includes a plurality of fixing openings respectively in fluid communication with the fluid channel. The plurality of fluid connectors are respectively disposed on the fixing portion and fixed to the corresponding one of the plurality of fixing openings and respectively in fluid communication with the fluid channel.

Abstract: The present disclosure provides a liquid cooling manifold. The liquid cooling manifold includes a channel body and a plurality of fluid connectors. The channel body includes a base, a wall portion and a fixing portion. The wall portion is connected between the base and the fixing portion, and a fluid channel is formed among the base, the wall portion and the fixing portion. The fixing portion includes a plurality of fixing openings respectively in fluid communication with the fluid channel. The plurality of fluid connectors are respectively disposed on the fixing portion and fixed to the corresponding one of the plurality of fixing openings and respectively in fluid communication with the fluid channel.

Abstract: A blind insert fluid connection module includes a first fluid connector located on a first assembly and a second fluid connector located on a second assembly. The second fluid connector is used to engage the first fluid connector in a first direction to form a fluid channel. The second assembly includes a main body, a guide structure, and a cushioning resilient member. The fastening member is located on the main body. The guide structure is located on the main body, and the second fluid connector is fixed on the guide structure. The cushioning resilient member is connected to the guide structure to provide a buffer displacement of the second fluid connector along the second direction when the first and second fluid connectors are joined, wherein an included angle is formed between the second direction and the first direction.

Abstract: A power socket includes a main body and a latch member. The main body includes a connection seat, a receiving recess and a latching slot. The connection seat is disposed within the receiving recess and configured to electrically connect with a plug passing, when the power plug is fitted in the receiving recess along a first direction. The latching slot is in communication with the receiving recess. The latch member includes an arm slidable along the latching slot from a first position to a second position along a second direction. The arm includes at least one protrusion configured to slide into the receiving recess for engaging with a lateral wall of the power plug when the arm slides towards the second position.

Abstract: An electronic device is provided, including a first circuit board, a second circuit board, a supporting member, and a first locking member. The first circuit board has a first hole. The second circuit board has a second hole, a pin, and a metal connector, wherein the pin is connected to the first circuit board. The supporting member has a first portion disposed in the first hole, a second portion, and a screw hole extending from the first portion to the second portion, wherein the diameter of the first portion is less than that of the second portion. The first locking member passes through the second hole and enters the screw hole to affix the second circuit board to the supporting member. The second portion is disposed between the first circuit board and the second circuit board to form a gap therebetween.

Abstract: A casing assembly includes a first casing and a second casing. The first casing includes a first lateral plate and a first engaging element. The first engaging element includes a first slab, a first sidewall and a second sidewall. The first sidewall and the second sidewall are connected with the first lateral plate. Moreover, a dent is formed between the first lateral plate and the first engaging element. The second casing is combined with the first casing. The second casing includes a second lateral plate and a second engaging element. The second engaging element includes a second slab, a third sidewall and a fourth sidewall. The third sidewall and the fourth sidewall are connected with the second lateral plate. The second engaging element is accommodated within the dent and in contact with the first engaging element, so that the first casing and the second casing are combined together.

Abstract: A casing assembly includes a first casing and a second casing. The first casing includes a first lateral plate and a first engaging element. The first engaging element includes a first slab, a first sidewall and a second sidewall. The first sidewall and the second sidewall are connected with the first lateral plate. Moreover, a dent is formed between the first lateral plate and the first engaging element. The second casing is combined with the first casing. The second casing includes a second lateral plate and a second engaging element. The second engaging element includes a second slab, a third sidewall and a fourth sidewall. The third sidewall and the fourth sidewall are connected with the second lateral plate. The second engaging element is accommodated within the dent and in contact with the first engaging element, so that the first casing and the second casing are combined together.

Abstract: A composite structure includes an electronic component and a supporting member. The electronic component includes a main body and a plurality of pins extended outwardly from the main body. The supporting member includes a first supporting part and a second supporting part. The first supporting part is foldable with respect to the second supporting part. The main body of the electronic component is accommodated within the first supporting part of the supporting member. The pins are accommodated with the second supporting part of the supporting member. The first supporting part is folded with respect to the second supporting part such that the pins are bent to define a bent structure.

Abstract: An assembled structure includes an electronic component, a heat-dissipating device and a stepped isolation member. The electronic component has a first perforation. The heat-dissipating device has a second perforation corresponding to the first perforation of the electronic component. The stepped isolation member includes a first segment, a second segment and a third segment. The outer diameter of the first segment is smaller than the outer diameter of the second segment, and the outer diameter of the second segment is smaller than the outer diameter of the third segment. The first segment is partially accommodated within the first perforation of the electronic component, the second segment is arranged between the first segment and the third segment and engaged with the second perforation of the heat-dissipating device, and the third segment is contacted with the heat-dissipating device.

Abstract: A cushioning member for use in a circuit board includes an elastic main body and a fixing element. The fixing element is coupled with the elastic main body and aligned with a perforation of the circuit board. The fixing element includes an extension part and a fastening part. The extension part is arranged between the elastic main body and the fastening part. The fastening part is arranged on an end of the fixing element. The fastening part is sustained against a first surface of the circuit board and the extension part is received in the perforation after the fixing element is penetrated through the perforation, so that the cushioning member is combined with the circuit board and the elastic main body is attached on a second surface of the circuit board, wherein a cushioning efficacy is provided when the electronic device is suffered from an external force.

Abstract: An electronic device includes a casing, a circuit board and a cushioning member. The circuit board is disposed within the casing. The cushioning member is disposed within the casing and includes a sustaining element and a supporting element. The sustaining element is supported by the supporting element and disposed on the circuit board. When the casing is subject to an impact, the sustaining element is sustained against the casing to prevent from fracture of the casing.