Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a clasping portion, an elastic member placed and a first gasket. The clasping portion includes a fixing part, an operating part, and a connecting part connected to the fixing part and the operating part. The connecting part defines a slip groove. The first gasket interferingly fits the slip groove of the clasping portion. The elastic member is placed around the connecting part of the clasping portion and is arranged between the operation part and the first gasket. The first gasket abuts the base after the fixing part extending through the base.

Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a clasping portion, an elastic member placed and a first gasket. The clasping portion includes a fixing part, an operating part, and a connecting part connected to the fixing part and the operating part. The connecting part defines a slip groove. The first gasket interferingly fits the slip groove of the clasping portion. The elastic member is placed around the connecting part of the clasping portion and is arranged between the operation part and the first gasket. The first gasket abuts the base after the fixing part extending through the base.

Abstract: An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.

Abstract: A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.

Abstract: A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: A fan includes a base and an impeller rotatably mounted on the base. The base protrudes a tube outwardly therefrom. The tube defines a receiving hole therein for receiving a bearing. The bearing defines a bearing hole therein. The impeller protrudes a shaft therefrom towards the base. The shaft is rotatably received in the bearing hole. The fan further includes a gasket located at a bottom of the bearing and clipped on a free end of the shaft. The gasket includes a first surface and an opposite second surface. The first surface is a smooth surface and facing directly the bottom surface of the bearing. The second surface is a rough surface relative to the first surface. At least one of the first surface and the second surface is provided with a mark to differentiate the rough second surface from the smooth first surface.

Abstract: A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.