Abstract: An apparatus is provided for mounting a pellicle to a photomask. A chamber has at least one port for filling the chamber with extreme clean dry air (XCDA) or an inert gas. A pellicle mounter is provided within the chamber. The mask is irradiated with a vacuum ultra violet (VUV) light in an atmosphere of the XCDA or inert gas, and the pellicle is mounted to the mask while the mask is in the atmosphere of the XCDA or inert gas and exposed to the VUV light. An assembly includes the mask attached to a pellicle frame by a pressure sensitive adhesive; and a pellicle joined to the pellicle frame, forming a sealed enclosure, the sealed enclosure being filled with extreme clean dry air (XCDA) or inert gas.

Abstract: The present disclosure provides a method of making a mask. The method includes providing a substrate having a first attenuating layer on the substrate and a first imaging layer on the first attenuating layer; performing a first exposure to the first imaging layer using a first radiation energy in writing mode; performing a first etching to the first attenuating layer; performing a second etching to the substrate; forming a second imaging layer on the first attenuating layer and the substrate; performing a second exposure to the second imaging layer using a light energy and another mask; and performing a third etching to the first attenuating layer after the second exposure.

Abstract: An apparatus is provided for mounting a pellicle to a photomask. A chamber has at least one port for filling the chamber with extreme clean dry air (XCDA) or an inert gas. A pellicle mounter is provided within the chamber. The mask is irradiated with a vacuum ultra violet (VUV) light in an atmosphere of the XCDA or inert gas, and the pellicle is mounted to the mask while the mask is in the atmosphere of the XCDA or inert gas and exposed to the VUV light. An assembly includes the mask attached to a pellicle frame by a pressure sensitive adhesive; and a pellicle joined to the pellicle frame, forming a sealed enclosure, the sealed enclosure being filled with extreme clean dry air (XCDA) or inert gas.

Abstract: The present disclosure provides a method of making a mask. The method includes providing a substrate having a first attenuating layer on the substrate and a first imaging layer on the first attenuating layer; performing a first exposure to the first imaging layer using a first radiation energy in writing mode; performing a first etching to the first attenuating layer; performing a second etching to the substrate; forming a second imaging layer on the first attenuating layer and the substrate; performing a second exposure to the second imaging layer using a light energy and another mask; and performing a third etching to the first attenuating layer after the second exposure.

Abstract: Apparatus is provided for mounting a pellicle to a photomask. A chamber has at least one port for filling the chamber with extreme clean dry air (XCDA) or an inert gas. A pellicle mounter is provided within the chamber. A vacuum ultra violet (VUV) light source is provided for irradiating a mask held by the pellicle mounter while the chamber is filled with the XCDA or inert gas. The mask is irradiated with the VUV light in an atmosphere of the XCDA or inert gas, and the pellicle is mounted to the mask while the mask is in the atmosphere of the XCDA or inert gas and exposed to the VUV light.

Abstract: Apparatus is provided for mounting a pellicle to a photomask. A chamber has at least one port for filling the chamber with extreme clean dry air (XCDA) or an inert gas. A pellicle mounter is provided within the chamber. A vacuum ultra violet (VUV) light source is provided for irradiating a mask held by the pellicle mounter while the chamber is filled with the XCDA or inert gas. The mask is irradiated with the VUV light in an atmosphere of the XCDA or inert gas, and the pellicle is mounted to the mask while the mask is in the atmosphere of the XCDA or inert gas and exposed to the VUV light.

Abstract: The present disclosure provides a method of making a mask. The method includes providing a substrate having a first attenuating layer on the substrate and a first imaging layer on the first attenuating layer; performing a first exposure to the first imaging layer using a first radiation energy in writing mode; performing a first etching to the first attenuating layer; performing a second etching to the substrate; forming a second imaging layer on the first attenuating layer and the substrate; performing a second exposure to the second imaging layer using a light energy and another mask; and performing a third etching to the first attenuating layer after the second exposure.

Abstract: An anti-electrostatic discharge photomask blank for fabrication of an anti-electrostatic discharge photomask is disclosed. The anti-electrostatic discharge photomask blank includes a mask substrate, a conductive layer provided on the mask substrate and an opaque patterning layer provided on the conductive layer. The conductive layer prevents charges of opposite polarity from accumulating on a photomask fabricated from the photomask blank, thus preventing electrostatic discharges on the photomask.

Abstract: A photomask is fabricated to have a patterned surface and a transparent layer formed on the patterned surface.

Abstract: An anti-electrostatic discharge photomask blank for fabrication of an anti-electrostatic discharge photomask is disclosed. The anti-electrostatic discharge photomask blank includes a mask substrate, a conductive layer provided on the mask substrate and an opaque patterning layer provided on the conductive layer. The conductive layer prevents charges of opposite polarity from accumulating on a photomask fabricated from the photomask blank, thus preventing electrostatic discharges on the photomask.

Abstract: A de-pellicle tool for removing a pellicle from a reticle during the formation of circuit patterns on substrates in the fabrication of integrated circuits. The de-pellicle tool of the present invention comprises a support frame on which is mounted the reticle and the pellicle supported on the reticle. A pair of handle-actuated lift pins on opposite sides of the support frame are extended into respective pin openings in the pellicle frame, after which the handles are pushed downwardly to raise the lift pins and lift the pellicle frame from the reticle. Accordingly, no moving parts contact the reticle during the pellicle-removing procedure, preventing scratching or other damage to the reticle.

Abstract: A de-pellicle tool for removing a pellicle from a reticle during the formation of circuit patterns on substrates in the fabrication of integrated circuits. The de-pellicle tool of the present invention comprises a support frame on which is mounted the reticle and the pellicle supported on the reticle. A pair of handle-actuated lift pins on opposite sides of the support frame are extended into respective pin openings in the pellicle frame, after which the handles are pushed downwardly to raise the lift pins and lift the pellicle frame from the reticle. Accordingly, no moving parts contact the reticle during the pellicle-removing procedure, preventing scratching or other damage to the reticle.