Abstract: A transistor device includes a first source/drain region and a second source/drain region spaced apart from each other; a channel layer electrically connected to the first and second source/drain regions; a gate insulator layer; a gate electrode isolated from the channel layer by the gate insulator layer; and a UV-attenuating layer disposed on the channel layer to protect the channel layer from characteristic degradation caused by UV light.

Abstract: A wafer structure and a trimming method thereof are provided. The wafer structure includes a first wafer which includes a front surface, a back surface, and a sidewall connected to the front surface and the back surface. The sidewall of the first wafer includes a plurality of first regions at an edge of the sidewall and the back surface and laterally separated from one another by a pitch. Each of the first regions extends from the back surface toward the front surface and has etching streaks thereon.

Abstract: A wafer structure and a trimming method thereof are provided. The wafer structure includes a first wafer which includes a front surface, a back surface, and a sidewall connected to the front surface and the back surface. The sidewall of the first wafer includes a plurality of first regions at an edge of the sidewall and the back surface and laterally separated from one another by a pitch. Each of the first regions extends from the back surface toward the front surface and has etching streaks thereon.

Abstract: A wafer structure and a trimming method thereof are provided. The trimming method includes the following steps. A first wafer having a first surface and a second surface opposite to the first surface is provided. A first pre-trimming mark is formed on the first surface of the first wafer, where forming the first pre-trimming mark includes forming a plurality of recesses arranged as a path along a periphery of the first wafer. The first wafer is trimmed on the first pre-trimming mark and along the path of the first pre-trimming mark to remove a portion of the first wafer and form a trimmed edge having first regions thereon.

Abstract: A wafer structure and a trimming method thereof are provided. The trimming method includes the following steps. A first wafer having a first surface and a second surface opposite to the first surface is provided. A first pre-trimming mark is formed on the first surface of the first wafer, where forming the first pre-trimming mark includes forming a plurality of recesses arranged as a path along a periphery of the first wafer. The first wafer is trimmed on the first pre-trimming mark and along the path of the first pre-trimming mark to remove a portion of the first wafer and form a trimmed edge having first regions thereon.

Abstract: A wafer structure and a trimming method thereof are provided. The trimming method includes the following steps. A first wafer having a first surface and a second surface opposite to the first surface is provided. A first pre-trimming mark is formed on the first surface of the first wafer, wherein forming the first pre-trimming mark includes forming a plurality of recesses arranged as a path along a periphery of the first wafer. The first wafer is trimmed on the first pre-trimming mark and along the path of the first pre-trimming mark to remove a portion of the first wafer and form a trimmed edge having first regions thereon.

Abstract: A wafer structure and a trimming method thereof are provided. The trimming method includes the following steps. A first wafer having a first surface and a second surface opposite to the first surface is provided. A first pre-trimming mark is formed on the first surface of the first wafer, wherein forming the first pre-trimming mark includes forming a plurality of recesses arranged as a path along a periphery of the first wafer. The first wafer is trimmed on the first pre-trimming mark and along the path of the first pre-trimming mark to remove a portion of the first wafer and form a trimmed edge having first regions thereon.

Abstract: An energy storage device package is provided. The energy storage device package includes a bottom cover and a top cover connected to form a hollow chamber to accumulate an electrolyte, a first electrode and a second electrode formed on the top cover and which stretch from the top cover to the hollow chamber to contact the electrolyte, and a safety valve. The first electrode includes an opening and an exhaust channel that extends between the hollow chamber and the opening. When a gas pressure in the hollow chamber is smaller than or equal to a threshold value, the safety valve in the first electrode blocks the exhaust channel. When the gas pressure is larger than the threshold value, the gas pushes to open the safety valve and flows out from the hollow chamber through the exhaust channel and the opening.

Abstract: The invention relates to a battery connecting tabs for electrically connecting a plurality of batteries. The battery connecting tabs include a first layer and a second layer adhered to the first layer. The second layer is physically and electrically connected to the first layer, and the second layer has a plurality of holes formed thereon, wherein the conductivity of the second layer is higher than the first layer, the thickness of the second layer is thicker than the first layer, and the first layer is physically and electrically connected to electrodes of the batteries.

Abstract: An energy storage device package is provided. The energy storage device package includes a bottom cover and a top cover connected to form a hollow chamber to accumulate an electrolyte, a first electrode and a second electrode formed on the top cover and which stretch from the top cover to the hollow chamber to contact the electrolyte, and a safety valve. The first electrode includes an opening and an exhaust channel that extends between the hollow chamber and the opening. When a gas pressure in the hollow chamber is smaller than or equal to a threshold value, the safety valve in the first electrode blocks the exhaust channel. When the gas pressure is larger than the threshold value, the gas pushes to open the safety valve and flows out from the hollow chamber through the exhaust channel and the opening.

Abstract: The invention relates to a battery connecting tabs for electrically connecting a plurality of batteries. The battery connecting tabs include a first layer and a second layer adhered to the first layer. The second layer is physically and electrically connected to the first layer, and the second layer has a plurality of holes formed thereon, wherein the conductivity of the second layer is higher than the first layer, the thickness of the second layer is thicker than the first layer, and the first layer is physically and electrically connected to electrodes of the batteries.

Abstract: A manufacturing method for a flat heat column includes the steps of: providing a flat hollow tube, of which a first wick structure is disposed on the inner surface; providing at least one guiding device disposed within the flat heat tube for supporting the flat heat tube, wherein a second wick structure is disposed on the surface of the guiding device; connecting the first wick structure and the second wick structure for forming a continuous wick structure; and filling a working fluid and sealing both two ends of the flat hollow tube so as to form the flat heat column. A heat dissipation module and its flat heat column are also disclosed for applying to a heat element. The flat heat column can provide flowing path with optimum thermal conductive efficiency for the fluid therein.

Abstract: A vapor chamber applied to an electronic device generating heat is provided. The vapor chamber includes a hollow tube and a capillary structure, which is continuously formed on the inner surface of the hollow tube. The method for manufacturing the vapor chamber includes providing a hollow tube, forming the capillary structure on the inner surface of the hollow tube, filling a working fluid into the tube, and finally evacuating the hollow tube and sealing the other end of the tube, so as to provide better thermal transferring effect.

Abstract: A heat pipe and manufacturing method thereof. The manufacturing method includes steps of: providing a pipe; shaping the pipe by bending or pressing according to requirements of a heat-dissipation module of an electronic device; inserting a molding bar into the pipe; forming a wick structure in the pipe; separating the molding bar from the pipe; and adding a working fluid to the pipe, wherein the working fluid is confined in a closed space of the pipe. The pipe is shaped before formation of the wick structure therein to prevent damage to the wick structure.

Abstract: A heat dissipation module includes a first annular wall, a second annular wall, at least one porous structure, at least one first heat conductive structure and second heat conductive structure. The second annular wall with respect to the first annular wall, and the first annular wall and the second annular wall are jointed to form a closed chamber. The porous structure is disposed on an inner surface of the closed chamber. The first heat conductive structure is externally connected to the first annular wall and the second heat conductive structure is internally connected to the second annular wall.

Abstract: A heat dissipation apparatus. The heat dissipation apparatus includes a base and a support member. The support member has an opening and at least one protruding part surrounding the opening. The support member is connected with the base in a predetermined site by the protruding parts. When the base passes through the opening and the protruding parts are disposed in the predetermined site, the protruding parts become deformed to be engaged with the base by a force. The protruding parts and the support member may be integrally formed. Alternately, the base may comprise a groove in the predetermined site for allowing the protruding parts be inserted into the groove. The protruding parts substantially protrude inwardly into the opening so that the support member is engaged with the base when the protruding parts are inserted into the groove.

Abstract: A heat pipe and manufacturing method thereof. A pipe is provided and shaped. A molding bar is inserted into the pipe. A wick structure is formed in the pipe. The molding bar is separated from the pipe. A working fluid is added and confined in a closed space of the pipe. The pipe is shaped before formation of the wick structure therein to prevent damage to the wick structure.

Abstract: A position detector is provided for use on a spin-drying machine employed in integrated circuit (IC) fabrication to detect whether the spin-drying machine has shifted in position during operation. If the spin-drying machine is positioned incorrectly, the position detector is capable of stopping the operation of robot arms used to grab and position wafers on the spin-drying machine so that the robot arms will not be damaged or crash into the wafers on the spin-drying machine due to the incorrect positioning of the spin-drying machine. The position detector is designed for use on a spin-drying machine having a spinning unit, a fixed platform surrounding the spinning unit, and at least one robot arm mounted on the fixed unit. The position detector comprises a pair of emitters mounted on the spinning unit and a pair of oppositely arranged receivers on the fixed platform.