Patents by Inventor Ming-Te Chung

Ming-Te Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat pipe and manufacturing method thereof
    Publication number: 20080078531
    Abstract: A heat pipe includes a hollow annular body with two open ends and two bending portions. A wick structure is formed at an inner surface of the annular body. The bending portions are respectively disposed at the two open ends to form a sealed space within the hollow annular body. A working fluid is filled in the sealed space. Also, a method of manufacturing a heat pipe including steps of: providing a hollow annular body with two open ends, and a wick structure is formed at an inner surface of the hollow annular body; and forming two bending portions respectively at the two open ends to form a sealed space within the hollow annular body, and a working fluid is filled in the sealed space.
    Type: Application
    Filed: April 27, 2007
    Publication date: April 3, 2008
    Inventors: Ming-Te Chung, Chi-Feng Lin, Chin-Ming Chen