Patents by Inventor Ming-Te We

Ming-Te We has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGHLY ADHESIVE POLYIMIDE COPPER CLAD LAMINATE AND METHOD OF MAKING THE SAME
    Publication number: 20130244000
    Abstract: The present invention is related to a chip on film package, comprising a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precursor comprising a diamine monomer, a dianhydride monomer, an organic solvent and a silane coupling agent having one or more organic functional groups, and the copper foil is a smooth copper foil. The polyimide layer of the present invention provides high transparency, good dimensional stability, good mechanical properties and good adhesion to the copper foil.
    Type: Application
    Filed: September 4, 2012
    Publication date: September 19, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Yu-Jean Chen, Brian C. Auman, Sheng-Yu Huang, Tsutomu Mutoh, Ming-Te We, Yu-Chih Yeh
  • HIGHLY ADHESIVE POLYIMIDE COPPER CLAD LAMINATE AND METHOD OF MAKING THE SAME
    Publication number: 20100323161
    Abstract: The present invention is related to a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precursor comprising a diamine monomer, a dianhydride monomer, an organic solvent and a silane coupling agent having one or more organic functional groups, and the copper foil is a smooth copper foil. The polyimide layer of the present invention provides high transparency, good dimensional stability, good mechanical properties and good adhesion to the copper foil.
    Type: Application
    Filed: January 30, 2009
    Publication date: December 23, 2010
    Applicant: E. I. Du Pont De Nemours and Company
    Inventors: Yu-Jean Chen, Brian C. Auman, Sheng-Yu Huang, Tsutomu Mutoh, Ming-Te We, Yu-Chih Yeh
  • HIGHLY ADHESIVE POLYIMIDE COPPER CLAD LAMINATE AND METHOD OF MAKING THE SAME
    Publication number: 20090197104
    Abstract: The present invention is related to a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precursor comprising a diamine monomer, a dianhydride monomer, an organic solvent and a silane coupling agent having one or more organic functional groups, and the copper foil is a smooth copper foil. The polyimide layer of the present invention provides high transparency, good dimensional stability, good mechanical properties and good adhesion to the copper foil.
    Type: Application
    Filed: May 8, 2008
    Publication date: August 6, 2009
    Applicant: E. I. du Pont de Nemours and Company
    Inventors: Yu-Jean Chen, Brian C. Auman, Sheng-Yu Huang, Tsutomu Mutoh, Ming-Te We, Yu-Chih Yeh