Abstract: The present disclosure relates to a display device, a door body and a cabinet body. The display device includes: an information collecting assembly configured to collect environment information; a communication module configured to perform wireless-communication linking to an Internet-of-Things device, to transmit the environment information to the Internet-of-Things device, and receive multimedia information sent by the Internet-of-Things device; and a display module configured to display the multimedia information, wherein the multimedia information includes audio-video advertisement information.

Abstract: An aftercooler for an internal combustion engine includes a core assembly. The core assembly can have a plurality of tubes coupled to a first header plate and can receive a cooling fluid from a manifold assembly. The core assembly can have a plurality of fins coupled to the plurality of tubes. At least a first tube of the plurality of tubes closest to an initial intake of a charge air and closest to the first side sheet is exposed and free of the plurality of fins for a first distance from the first header plate. At least a majority of the plurality of tubes including up to all but the at least the first tube are exposed and free of the plurality of fins for a second distance from the first header plate. The second distance is less than the first distance.

Abstract: Described herein are novel anti-PD1 antibody reagents (e.g., antibodies, antigen-binding fragments thereof, and/or chimeric antigen receptors). Also described herein antibody-drug conjugates or kits comprising the disclosed antibody reagents, as well as methods of treating cancer by administering the disclosed antibody reagents.

Abstract: The invention discloses an environmentally friendly impregnation system for fiber surface treatment and a preparation method thereof, and an impregnation treatment method. The environmentally friendly impregnation system for fiber surface treatment of the invention includes hydroxyacrylic resin, amino resin, epoxy resin, blocked isocyanate, accelerator, rubber latex, and deionized water. Depending on the type of fiber and its application, the invention allows for the selection of one-step impregnation treatment or two-step impregnation treatment. The invention can effectively replace the use of toxic raw materials and intermediates in traditional RFL impregnation system, reducing harm to human health and the environment while achieving the adhesion level of RFL treatment.

Abstract: Described herein are novel anti-PD1 antibody reagents (e.g., antibodies, antigen-binding fragments thereof, and/or chimeric antigen receptors). Also decribed herein antibody-drug conjugates or kits comprising the disclosed antibody reagents, as well as methods of treating cancer by administereing the disclosed antibody reagents.

Abstract: Described herein are novel anti-PD1 antibody reagents (e.g., antibodies, antigen-binding fragments thereof, and/or chimeric antigen receptors). Also described herein antibody-drug conjugates or kits comprising the disclosed antibody reagents, as well as methods of treating cancer by administering the disclosed antibody reagents.

Abstract: A novel hybrid band-pass filter is realized using semiconductor integrated hybrid technology, and includes two acoustic resonance units, and one IPD filter unit. The filter unit may be implemented as a high-pass filter, a low-pass filter, or a band-pass filter. The two acoustic resonance units and the IPD filter unit are arranged on a matching substrate, for example, by way of flip-chip technology and welding of electrodes, and a polymer filled shell is formed external to and surrounding the acoustic resonance units and the IPD filter unit to prevent oxidation and to maintain integrity of the weld points. The first acoustic resonance unit is connected with an input terminal of the IPD filter through a matching inductor, an output terminal of the IPD filter is connected with the second acoustic resonance unit through a matching inductor, and finally, the two acoustic resonance units and the IPD filter unit are integrated on the matching substrate.

Abstract: A novel hybrid band-pass filter is realized using semiconductor integrated hybrid technology, and includes two acoustic resonance units, and one IPD filter unit. The filter unit may be implemented as a high-pass filter, a low-pass filter, or a band-pass filter. The two acoustic resonance units and the IPD filter unit are arranged on a matching substrate, for example, by way of flip-chip technology and welding of electrodes, and a polymer filled shell is formed external to and surrounding the acoustic resonance units and the IPD filter unit to prevent oxidation and to maintain integrity of the weld points. The first acoustic resonance unit is connected with an input terminal of the IPD filter through a matching inductor, an output terminal of the IPD filter is connected with the second acoustic resonance unit through a matching inductor, and finally, the two acoustic resonance units and the IPD filter unit are integrated on the matching substrate.

Abstract: The present disclosure relates to a display device, a door body and a cabinet body. The display device includes: an information collecting assembly configured to collect environment information; a communication module configured to perform wireless-communication linking to an Internet-of-Things device, to transmit the environment information to the Internet-of-Things device, and receive multimedia information sent by the Internet-of-Things device; and a display module configured to display the multimedia information, wherein the multimedia information includes audio-video advertisement information.

Abstract: A nose vent plug, and a nasal mask for anesthesia. The nose vent plug comprises a base (1) and two nasal plugs (2) symmetrically provided on the base (1); the inner edges of the two nasal plugs (2) form a gap (3) into which a nasal septum is embedded; each nasal plug (2) comprises an insertion portion (4) and a pressing portion (5); the outer diameter of the pressing portion (5) is larger than that of the insertion portion (4); the bottom end of the pressing portion (5) is integrally formed on the base (1); the insertion portion (4) is integrally formed on the top of the pressing portion (5); an air hole (6) passing through the pressing portion (5) and the base (1) is provided in the insertion portion (4).

Abstract: The invention discloses an environmentally friendly impregnation system for fiber surface treatment and a preparation method thereof, and an impregnation treatment method. The environmentally friendly impregnation system for fiber surface treatment of the invention includes hydroxyacrylic resin, amino resin, epoxy resin, blocked isocyanate, accelerator, rubber latex, and deionized water. Depending on the type of fiber and its application, the invention allows for the selection of one-step impregnation treatment or two-step impregnation treatment. The invention can effectively replace the use of toxic raw materials and intermediates in traditional RFL impregnation system, reducing harm to human health and the environment while achieving the adhesion level of RFL treatment.

Abstract: Described herein are compositions (e.g. cells and transgenic animals) and methods relating to engineered Ig loci that permit expression of particular antibodies or antibody segments while still permitting recombination and/or maturation process for antibody optimization.

Abstract: An energy storage system may include a container having a plurality of racks, a plurality of energy storage units supported on the racks, and an inverter cabinet containing an inverter, the inverter cabinet having an inverter cabinet inlet and an inverter exhaust duct. The energy storage system may also include an air temperature control unit configured to circulate conditioned air to the container via a supply duct and to receive returned air from the container via the inverter exhaust duct and a return duct, and at least one baffle, configured to receive the conditioned air from the air temperature control unit and to distribute the conditioned air to an interior of the container and to the inverter cabinet via the inverter cabinet inlet.

Abstract: The technology described herein is directed to novel anti-PD1 antibody reagents (e.g., antibodies, antigen-binding fragments thereof, and/or chimeric antigen receptors). Also described herein are antibody-drug conjugates or kits comprising the disclosed antibody reagents, as well as methods of treating an autoimmune or auto-inflammatory disorder by administering the disclosed antibody reagents.

Abstract: Described herein are compositions (e.g. cells and transgenic animals) and methods relating to engineered Ig loci that permit expression of particular antibodies or antibody segments while still permitting recombination and/or maturation process for antibody optimization.

Abstract: A novel hybrid band-pass filter is realized using semiconductor integrated hybrid technology, and includes two acoustic resonance units, and one IPD filter unit. The filter unit may be implemented as a high-pass filter, a low-pass filter, or a band-pass filter. The two acoustic resonance units and the IPD filter unit are arranged on a matching substrate, for example, by way of flip-chip technology and welding of electrodes, and a polymer filled shell is formed external to and surrounding the acoustic resonance units and the IPD filter unit to prevent oxidation and to maintain integrity of the weld points. The first acoustic resonance unit is connected with an input terminal of the IPD filter through a matching inductor, an output terminal of the IPD filter is connected with the second acoustic resonance unit through a matching inductor, and finally, the two acoustic resonance units and the IPD filter unit are integrated on the matching substrate.

Abstract: Described herein are compositions (e.g. cells and transgenic animals) and methods relating to engineered Ig loci that permit expression of particular antibodies or antibody segments while still permitting recombination and/or maturation process for antibody optimization.

Abstract: Described herein are novel anti-PD1 antibody reagents (e.g., antibodies, antigen-binding fragments thereof, and/or chimeric antigen receptors). Also described herein antibody-drug conjugates or kits comprising the disclosed antibody reagents, as well as methods of treating cancer by administering the disclosed antibody reagents.

Abstract: The present application provides a method for manufacturing FDSOI devices. The method includes steps of: providing a semiconductor structure which comprises a silicon substrate, a buried oxide layer on the silicon substrate, a silicon-on-insulator layer on the buried oxide layer; and a hard mask layer on the silicon-on-insulator layer; performing spin coating of a photoresist on the hard mask layer to form a bulk silicon region; performing plasma anisotropic etching on the bulk silicon region to open a part of the buried oxide layer, and then performing isotropic etching, so that the silicon-on-insulator layer shrinks in the horizontal direction; performing plasma anisotropic etching to etch through the buried oxide layer to form a bulk silicon region trench; performing silicon epitaxial growth in the bulk silicon region trench.

Abstract: The present application provides a method for manufacturing FDSOI devices. The method includes steps of: providing a semiconductor structure which comprises a silicon substrate, a buried oxide layer on the silicon substrate, a silicon-on-insulator layer on the buried oxide layer; and a hard mask layer on the silicon-on-insulator layer; performing spin coating of a photoresist on the hard mask layer to form a bulk silicon region; performing plasma anisotropic etching on the bulk silicon region to open a part of the buried oxide layer, and then performing isotropic etching, so that the silicon-on-insulator layer shrinks in the horizontal direction; performing plasma anisotropic etching to etch through the buried oxide layer to form a bulk silicon region trench; performing silicon epitaxial growth in the bulk silicon region trench.