Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.

Abstract: An image conversion device includes: a lens module configured to allow passing of image light beams of an object, an optical waveguide element configured to transmit the image light beams to a light processing component, and an image sensor configured to convert the image light beams into digital image signals. By changing image capturing and image forming methods, higher image quality may be achieved and expanding flexibility may be maintained.

Abstract: The present invention discloses a flash memory controller and a control method thereof. The flash memory controller comprises a scrambling circuit and a control circuit. The scrambling circuit scrambles at least one input data for generating at least one valid data. The control circuit receives at least one invalid data and the valid data generated by the scrambling circuit. The invalid data is not a fixed constant. The control circuit writes the valid data to at least one valid storage zone of a flash memory and the invalid data to at least one invalid storage zone of the flash memory. By writing non-fixed-constant invalid data to the invalid storage zones of the flash memory, the interference of the invalid storage zones on the valid storage zones may be decreased. Thereby, the reliability and the usable storage space of the flash memory may be increased.