Patents by Inventor Ming-Ting Wu

Ming-Ting Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12159092
    Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.
    Type: Grant
    Filed: July 26, 2023
    Date of Patent: December 3, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Ping Chiang, Ming-Hui Chih, Chih-Wei Hsu, Ping-Chieh Wu, Ya-Ting Chang, Tsung-Yu Wang, Wen-Li Cheng, Hui En Yin, Wen-Chun Huang, Ru-Gun Liu, Tsai-Sheng Gau
  • Patent number: 12148782
    Abstract: Various embodiments of the present application are directed towards image sensors including composite backside illuminated (CBSI) structures to enhance performance. In some embodiments, a first trench isolation structure extends into a backside of a substrate to a first depth and comprises a pair of first trench isolation segments. A photodetector is in the substrate, between and bordering the first trench isolation segments. A second trench isolation structure is between the first trench isolation segments and extends into the backside of the substrate to a second depth less than the first depth. The second trench isolation structure comprises a pair of second trench isolation segments. An absorption enhancement structure overlies the photodetector, between the second trench isolation segments, and is recessed into the backside of the semiconductor substrate. The absorption enhancement structure and the second trench isolation structure collectively define a CBSI structure.
    Type: Grant
    Filed: July 21, 2023
    Date of Patent: November 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Jhy-Jyi Sze, Keng-Yu Chou, Yen-Ting Chiang, Ming-Hsien Yang, Chun-Yuan Chen
  • Publication number: 20240371904
    Abstract: Various embodiments of the present application are directed towards image sensors including composite backside illuminated (CBSI) structures to enhance performance. In some embodiments, a first trench isolation structure extends into a backside of a substrate to a first depth and comprises a pair of first trench isolation segments. A photodetector is in the substrate, between and bordering the first trench isolation segments. A second trench isolation structure is between the first trench isolation segments and extends into the backside of the substrate to a second depth less than the first depth. The second trench isolation structure comprises a pair of second trench isolation segments. An absorption enhancement structure overlies the photodetector, between the second trench isolation segments, and is recessed into the backside of the semiconductor substrate. The absorption enhancement structure and the second trench isolation structure collectively define a CBSI structure.
    Type: Application
    Filed: July 19, 2024
    Publication date: November 7, 2024
    Inventors: Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Jhy-Jyi Sze, Keng-Yu Chou, Yen-Ting Chiang, Ming-Hsien Yang, Chun-Yuan Chen
  • Publication number: 20240345299
    Abstract: An optical structure is provided. The optical structure includes a substrate and multiple films disposed on the substrate. The multiple films include a first set of multiple films and a second set of multiple films. The first set of multiple films includes a plurality of first material layers and a plurality of second material layers including germanium oxide, germanium nitride or germanium hydroxide which are arranged in an alternating manner. The second set of multiple films includes a plurality of third material layers including germanium oxide, germanium nitride or germanium hydroxide and a plurality of fourth material layers which are arranged in an alternating manner. The thickness of the fourth material layer is greater than that of the first material layer.
    Type: Application
    Filed: April 12, 2023
    Publication date: October 17, 2024
    Inventors: Cheng-Ta MU, Po-Han FU, Ming-Lun SHIH, Sheng-Hui CHEN, Liang-Ting WU, Gui-Sheng ZENG
  • Patent number: 12078657
    Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat extension spring segment and wherein in some embodiments the probes also provide: (1) narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements, and/or (2) ratcheting elements on probe arms and/or frame elements to allow permanent or semi-permanent transition from a build state or initial state to a working state or pre-biased state.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: September 3, 2024
    Assignee: Microfabrica Inc.
    Inventors: Ming Ting Wu, Arun S. Veeramani
  • Publication number: 20240273695
    Abstract: An image recognition method includes the steps of: receiving a captured image; acquiring a focusing zone image from a portion of the captured image; processing the captured image and/or the focusing zone image and then making the two images into a batch of image information; and executing an image analysis procedure on the batch of image information to generate an analysis result.
    Type: Application
    Filed: October 16, 2023
    Publication date: August 15, 2024
    Inventors: Ming-Chen WANG, Yu-Ting LI, Shao-Yuan LIN, Jia-Lin LEE, Guan-Yi WU
  • Publication number: 20240103042
    Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
    Type: Application
    Filed: October 17, 2022
    Publication date: March 28, 2024
    Applicant: Microfabrica Inc.
    Inventors: Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
  • Publication number: 20240103038
    Abstract: Probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat tensional spring segments and in some embodiments include narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements.
    Type: Application
    Filed: August 29, 2022
    Publication date: March 28, 2024
    Applicant: Microfabrica Inc.
    Inventor: Ming Ting Wu
  • Publication number: 20240094249
    Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat extension spring segment and wherein in some embodiments the probes also provide: (1) narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements, and/or (2) ratcheting elements on probe arms and/or frame elements to allow permanent or semi-permanent transition from a build state or initial state to a working state or pre-biased state.
    Type: Application
    Filed: June 30, 2022
    Publication date: March 21, 2024
    Applicant: Microfabrica Inc.
    Inventors: Ming Ting Wu, Arun S. Veeramani
  • Publication number: 20240094250
    Abstract: Probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat tensional spring segments and in some embodiments include one or both of:(1) narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements and/or (2) pairs of joined probes with at least one end of the probe set having independently compressible tips (e.g. as Kelvin probe pairs for use in 4 wire Kelvin probe tests).
    Type: Application
    Filed: August 29, 2022
    Publication date: March 21, 2024
    Applicant: Microfabrica Inc.
    Inventors: Ming Ting Wu, Garret R. Smalley
  • Publication number: 20240094257
    Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
    Type: Application
    Filed: October 18, 2022
    Publication date: March 21, 2024
    Applicant: Microfabrica Inc.
    Inventors: Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
  • Publication number: 20240094256
    Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner spring elements along their lengths. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
    Type: Application
    Filed: October 18, 2022
    Publication date: March 21, 2024
    Applicant: Microfabrica Inc.
    Inventors: Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
  • Publication number: 20240094258
    Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
    Type: Application
    Filed: October 18, 2022
    Publication date: March 21, 2024
    Applicant: Microfabrica Inc.
    Inventors: Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
  • Publication number: 20240085457
    Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two springs separated by a movable stop while in other embodiments, three or more springs may be included with two or more movable stops. Movable stops interact with fixed stops that are either part of the probes themselves or part of separate elements that engage with the probes (such as array frame structures) that provide for the retention, longitudinal and/or lateral positioning of probes and possibly for orientation of the probes about a longitudinal axis. Fixed stops provide for controlled limits for movement of the movable stops which in turn allow for enhanced compliant or elastic performance of the probes upon increased probe compression in either one direction, in the order of tip compressions, or in both directions or tip compression orders (e.g.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Ming Ting Wu, Garret R. Smalley, Dennis R. Smalley
  • Patent number: 11906549
    Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat tensional spring segment.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: February 20, 2024
    Assignee: Microfabrica Inc.
    Inventor: Ming Ting Wu
  • Publication number: 20240044939
    Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two flat spring segments with at least one of those segments being used in a compressive manner wherein the probe additionally includes guide elements, framing structures or other structural configurations that limit or inhibit one or more compressive spring segments from bowing or deflecting out of a desired position when subjected to loading.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 8, 2024
    Inventor: Ming Ting Wu
  • Patent number: 11886734
    Abstract: A secure memory card includes a non-volatile memory device for storing data, which includes a specific address and a regular address different from the first specific address; a secure element for conducting a securing operation; and a non-volatile memory controller in communication with the non-volatile memory device and the secure element, adapted to receive a command from a host. The non-volatile memory controller interacts with the secure element to conduct the securing operation in response to the command from the host if the command from the host is secure-element control command. The secure-element control command is a single command taking a single instruction cycle and corresponds to the specific address. The non-volatile memory controller interacts with the non-volatile memory device while having no interaction with the secure element in response to the command from the host if the command from the host is a non-secure-element control command corresponding to the regular address.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: January 30, 2024
    Assignee: INFOKEYVAULT TECHNOLOGY CO., LTD.
    Inventors: Ming-Ting Wu, Neng-Jie Yu, Chihhung Lin
  • Patent number: 11867721
    Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two springs separated by a movable stop while in other embodiments, three or more springs may be included with two or more movable stops. Movable stops interact with fixed stops that are either part of the probes themselves or part of separate elements that engage with the probes (such as array frame structures) that provide for the retention, longitudinal and/or lateral positioning of probes and possibly for orientation of the probes about a longitudinal axis. Fixed stops provide for controlled limits for movement of the movable stops which in turn allow for enhanced compliant or elastic performance of the probes upon increased probe compression in either one direction, in the order of tip compressions, or in both directions or tip compression orders (e.g.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: January 9, 2024
    Assignee: Microfabrica Inc.
    Inventors: Ming Ting Wu, Garret R. Smalley, Dennis R. Smalley
  • Publication number: 20230358785
    Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes of an array plate and an upper retention feature having a lateral configuration that is sized to pass through the extension provided by the side wall feature of the plate probe hole when aligned and after longitudinally locating the upper retention feature above the extension, the retention feature undergoes displacement relative to the upper plate probe hole such that the upper retention feature can no longer longitudinally pass through the extension of the upper plate probe hole.
    Type: Application
    Filed: April 4, 2023
    Publication date: November 9, 2023
    Inventors: Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley
  • Publication number: 20230349947
    Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes of a array plate and an upper retention feature comprising at least one tab-like feature extending laterally from the body of the probe at a level above and longitudinally spaced from the lower retention feature; and wherein after longitudinally locating the upper retention feature above the plate probe hole in the array plate, the upper retention feature undergoes lateral displacement such that the upper retention feature can no longer longitudinally pass through the plate probe hole in the array plate.
    Type: Application
    Filed: April 4, 2023
    Publication date: November 2, 2023
    Inventors: Arun S. Veeramani, Ming Ting Wu, Dennis R. Smalley