Abstract: The present invention is to provide a spring-assisted knife, which includes a handle, a blade movably contained in the handle or exposed out of a front end of the handle, an elastically releasing and receiving assembly disposed inside the handle and movable along the length direction of handle to drive the blade, a releasing key movably mounted on the lateral of handle and capable of being pushed toward the front end of handle for a first predetermined distance for driving the assembly to eject the blade out of the handle, and a receiving key movably exposed out of the lateral of handle and capable of being pushed toward a rear end of the handle for a second predetermined distance for driving the assembly to receive the blade into the handle, so as to enable a user to operate ejection and receiving of the blade at single lateral of the handle.

Abstract: An assisted-opening knife has a spring tied to a front of a blade carrier and a movable slider assembly within a slot formed through the blade carrier, so that a blade can be rapidly extended by the elastic force without going through stepwise movement. An expanded portion of the slot engaging the slider assembly allows the blade to be received in a holder and ejected only when the slider assembly fully disengages from the expanded portion, thereby generating no sudden ejection of the blade. Additionally, a safety latch securely locks the blade when the blade is fully retracted. When the blade is fully extended, a stopper engages the slider assembly to prevent the blade from being retracted during cutting and stabbing. Accordingly, the assisted-opening knife addresses a solution to rapidly extend the blade for cutting and stabbing without compromising the safety considerations.

Abstract: An assisted-opening knife has a spring tied to a front of a blade carrier and a movable slider assembly within a slot formed through the blade carrier, so that a blade can be rapidly extended by the elastic force without going through stepwise movement. An expanded portion of the slot engaging the slider assembly allows the blade to be received in a holder and ejected only when the slider assembly fully disengages from the expanded portion, thereby generating no sudden ejection of the blade. Additionally, a safety latch securely locks the blade when the blade is fully retracted. When the blade is fully extended, a stopper engages the slider assembly to prevent the blade from being retracted during cutting and stabbing. Accordingly, the assisted-opening knife addresses a solution to rapidly extend the blade for cutting and stabbing without compromising the safety considerations.

Abstract: The present invention relates to a method which introduce a parasitic series resistance for solving electrostatic discharge voltages by using transmission line pulse method and least square error solution method. In present invention, we introduce a parasitic series resistance, Rs, into the equation which presents the correlation between the transmission line pulse method and human body model. The equation is then rewritten as electrostatic discharge voltage=electrostatic discharge current×(the human body equivalent resistance+the parasitic series resistance) We can obtain the optimal parasitic series resistance and electrostatic discharge voltage by using the least square error solution method.

Abstract: The present invention relates to a method which introduce a parasitic series resistance for solving electrostatic discharge voltages by using transmission line pulse method and least square error solution method. In present invention, we introduce a parasitic series resistance, Rs, into the equation which presents the correlation between the transmission line pulse method and human body model.

Abstract: A fabrication method for an oxide layer with reduced interface-trapped charges, which is applicable to the fabrication of a gate oxide layer of a flash memory device, is described. The method includes conducting a first inert ambient annealing process, followed by growing an oxide layer on the silicon substrate. A second inert ambient annealing process is then conducted on the oxide layer. Carbon ions are then incorporated into the interface between the oxide layer and the silicon substrate, followed by a third ambient annealing process.