Patents by Inventor Ming-Tsang Wang

Ming-Tsang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978768
    Abstract: A method manufacturing of a semiconductor structure including following steps is provided. A material layer is provided. A first mask layer is formed on the material layer. Core patterns are formed on the first mask layer. A spacer material layer is conformally formed on the core patterns. An etch-back process is performed on the spacer material layer. A portion of the spacer material layer located on two ends of the core pattern is removed, then spacer structures are formed. Each spacer structure includes a merged spacer and a non-merged spacer. The core patterns are removed. The first patterned mask layer is formed to cover a portion of the merged spacer and expose another portion of the merged spacer and the non-merged spacer. The first patterned mask layer and the spacer structure are used as a mask, and the first mask layer is patterned into a second patterned mask layer.
    Type: Grant
    Filed: June 8, 2023
    Date of Patent: May 7, 2024
    Assignee: Winbond Electronics Corp.
    Inventors: Tseng-Yao Pan, Chien-Hsiang Yu, Ching-Yung Wang, Cheng-Hong Wei, Ming-Tsang Wang
  • Publication number: 20230317781
    Abstract: A method manufacturing of a semiconductor structure including following steps is provided. A material layer is provided. A first mask layer is formed on the material layer. Core patterns are formed on the first mask layer. A spacer material layer is conformally formed on the core patterns. An etch-back process is performed on the spacer material layer. A portion of the spacer material layer located on two ends of the core pattern is removed, then spacer structures are formed. Each spacer structure includes a merged spacer and a non-merged spacer. The core patterns are removed. The first patterned mask layer is formed to cover a portion of the merged spacer and expose another portion of the merged spacer and the non-merged spacer. The first patterned mask layer and the spacer structure are used as a mask, and the first mask layer is patterned into a second patterned mask layer.
    Type: Application
    Filed: June 8, 2023
    Publication date: October 5, 2023
    Applicant: Winbond Electronics Corp.
    Inventors: Tseng-Yao Pan, Chien-Hsiang Yu, Ching-Yung Wang, Cheng-Hong Wei, Ming-Tsang Wang
  • Patent number: 11721720
    Abstract: A semiconductor structure includes a trunk portion and a branch portion. The trunk portion extends in a first direction. The branch portion is connected to the trunk portion. The branch portion includes a handle portion and a two-pronged portion. The handle portion is connected to the trunk portion and extends in a second direction. The second direction intersects the first direction. The two-pronged portion is connected to the handle portion. A line width of the handle portion is greater than a line width of the two-pronged portion.
    Type: Grant
    Filed: March 21, 2021
    Date of Patent: August 8, 2023
    Assignee: Winbond Electronics Corp.
    Inventors: Tseng-Yao Pan, Chien-Hsiang Yu, Ching-Yung Wang, Cheng-Hong Wei, Ming-Tsang Wang
  • Publication number: 20220302254
    Abstract: A semiconductor structure includes a trunk portion and a branch portion. The trunk portion extends in a first direction. The branch portion is connected to the trunk portion. The branch portion includes a handle portion and a two-pronged portion. The handle portion is connected to the trunk portion and extends in a second direction. The second direction intersects the first direction. The two-pronged portion is connected to the handle portion. A line width of the handle portion is greater than a line width of the two-pronged portion.
    Type: Application
    Filed: March 21, 2021
    Publication date: September 22, 2022
    Applicant: Winbond Electronics Corp.
    Inventors: Tseng-Yao Pan, Chien-Hsiang Yu, Ching-Yung Wang, Cheng-Hong Wei, Ming-Tsang Wang
  • Patent number: 5397084
    Abstract: A supporting frame for a golf bag including a seat having an enlarged portion and a flange at both sides of the enlarged portion, the flange being riveted on an upper portion of a golf bag, the enlarged portion having a recess at a bottom and between two shoulders, two blocks depending downwardly from a top surface of the recess and being each formed with an elongated slot, the recess having a rear side provided with a rail, a pair of legs each formed at an upper end with a horizontal portion having a threaded hole, each of the legs being fixedly connected with the seat by a bolt, a connecting member inserted into the rail of the seat and having two lugs between which is fitted an end of a spring, and a handle engaged with the connecting member by a pin extending through the two lugs of the connecting member and a partition of the locking handle whereby the legs will expand to support the golf bag at an upright position simply by pulling the handle outward.
    Type: Grant
    Filed: July 25, 1994
    Date of Patent: March 14, 1995
    Inventor: Ming-Tsang Wang