Patents by Inventor Ming-Tsao Chiang
Ming-Tsao Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8871032Abstract: A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level.Type: GrantFiled: June 6, 2013Date of Patent: October 28, 2014Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuang-Nian Tang, Yang-Kai Fan, Yu-Sheng Su, Ming-Tsao Chiang, Yu-Cheng Shih
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Patent number: 8834671Abstract: A method and apparatus for controlling a silicon nitride etching bath provides the etching bath including phosphoric acid heated to an elevated temperature. The concentration of silicon in the phosphoric acid is controlled to maintain a desired level associated with a desired silicon nitride/silicon oxide etch selectivity. Silicon concentration is measured while the silicon remains in soluble form and prior to silica precipitation. Responsive to the measuring, fresh heated phosphoric acid is added to the etching bath when necessary to maintain the desired concentration and silicon nitride:silicon oxide etch selectivity and prevent silica precipitation. The addition of fresh heated phosphoric acid enables the etching bath to remain at a steady state temperature. Atomic absorption spectroscopy may be used to monitor the silicon concentration which may be obtained by diluting a sample of phosphoric acid with cold deionized water and measuring before silica precipitation occurs.Type: GrantFiled: April 1, 2013Date of Patent: September 16, 2014Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Zin-Chang Wei, Tsung-Min Huang, Ming-Tsao Chiang, Cheng-Chen Calvin Hsueh
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Patent number: 8616821Abstract: The present disclosure provides a system and method for processing a semiconductor substrate wherein a substrate is received at a load lock interface. The substrate is transferred from the load lock interface to a process module using a first module configured for unprocessed substrates. A manufacturing process is performed on the substrate within the process module. Thereafter, the substrate is transferred from the process module to the load lock interface using a second module configured for processed substrates.Type: GrantFiled: August 26, 2010Date of Patent: December 31, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shao-Yen Ku, Chi-Ming Yang, Ming-Tsao Chiang, Yu-Fen Tzeng, Chin-Hsiang Lin
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Publication number: 20130263900Abstract: A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level.Type: ApplicationFiled: June 6, 2013Publication date: October 10, 2013Inventors: Kuang-Nian Tang, Yang- Kai Fan, Yu-Sheng Su, Ming-Tsao Chiang, Yu-Cheng Shih
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Patent number: 8460478Abstract: A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level.Type: GrantFiled: May 29, 2007Date of Patent: June 11, 2013Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuang-Nian Tang, Yang-Kai Fan, Yu-Sheng Su, Ming-Tsao Chiang, Yu-Cheng Shih
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Patent number: 8409997Abstract: A method and system for controlling a silicon nitride etching bath provides the etching bath including phosphoric acid heated to an elevated temperature. The concentration of silicon in the phosphoric acid is controlled to maintain a desired level associated with a desired silicon nitride/silicon oxide etch selectivity. Silicon concentration is measured while the silicon remains in soluble form and prior to silica precipitation. Responsive to the measuring, fresh heated phosphoric acid is added to the etching bath when necessary to maintain the desired concentration and silicon nitride:silicon oxide etch selectivity and prevent silica precipitation. The addition of fresh heated phosphoric acid enables the etching bath to remain at a steady state temperature. Atomic absorption spectroscopy may be used to monitor the silicon concentration which may be obtained by diluting a sample of phosphoric acid with cold deionized water and measuring before silica precipitation occurs.Type: GrantFiled: January 25, 2007Date of Patent: April 2, 2013Assignee: Taiwan Semiconductor Maufacturing Co., Ltd.Inventors: Zin-Chang Wei, Tsung-Min Huang, Ming-Tsao Chiang Chiang, Cheng-Chen Calvin Hsueh
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Publication number: 20080295874Abstract: A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level.Type: ApplicationFiled: May 29, 2007Publication date: December 4, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Kuang-Nian Tang, Yang-Kai Fan, Yu-Sheng Su, Ming-Tsao Chiang, Yu-Cheng Shih
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Publication number: 20080179293Abstract: A method and system for controlling a silicon nitride etching bath provides the etching bath including phosphoric acid heated to an elevated temperature. The concentration of silicon in the phosphoric acid is controlled to maintain a desired level associated with a desired silicon nitride/silicon oxide etch selectivity. Silicon concentration is measured while the silicon remains in soluble form and prior to silica precipitation. Responsive to the measuring, fresh heated phosphoric acid is added to the etching bath when necessary to maintain the desired concentration and silicon nitride:silicon oxide etch selectivity and prevent silica precipitation. The addition of fresh heated phosphoric acid enables the etching bath to remain at a steady state temperature. Atomic absorption spectroscopy may be used to monitor the silicon concentration which may be obtained by diluting a sample of phosphoric acid with cold deionized water and measuring before silica precipitation occurs.Type: ApplicationFiled: January 25, 2007Publication date: July 31, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Zin-Chang Wei, Tsung-Min Huang, Ming-Tsao Chiang, Cheng-Chen Calvin Hsueh
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Publication number: 20080047589Abstract: An apparatus for wafer cleaning includes an enclosure. A stage is within the enclosure. At least one first wall is within the enclosure, around the stage. A plate is within the enclosure and above the stage, operable to enclose a first region between the stage and the first wall. The apparatus further includes an exhauster fluidly coupled to the first region between the stage and the first wall.Type: ApplicationFiled: August 25, 2006Publication date: February 28, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tsung-Min Huang, Zin-Chang Wei, Ming-Tsao Chiang