Patents by Inventor Ming Tseng

Ming Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12284812
    Abstract: A semiconductor structure includes a substrate, a first dielectric layer on the substrate, a plurality of memory stack structures on the first dielectric layer, an insulating layer conformally covering the memory stack structures and the first dielectric layer, a second dielectric layer on the insulating layer and filling the spaces between the memory stack structures, a first interconnecting structure through the second dielectric layer, wherein a top surface of the first interconnecting structure is flush with a top surface of the second dielectric layer and higher than top surfaces of the memory stack structures, a third dielectric layer on the second dielectric layer, and a plurality of second interconnecting structures through the third dielectric layer, the second dielectric layer and the insulating layer on the top surfaces of the memory stack structures to contact the top surfaces of the memory stack structures.
    Type: Grant
    Filed: April 16, 2024
    Date of Patent: April 22, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Yu-Ping Wang, Chen-Yi Weng, Chin-Yang Hsieh, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Jing-Yin Jhang, Chien-Ting Lin
  • Publication number: 20250107454
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on a first sidewall of the MTJ, and a second spacer on a second sidewall of the MTJ. Preferably, the first spacer and the second spacer are asymmetric, the first spacer and the second spacer have different heights, and a top surface of the MTJ includes a reverse V-shape.
    Type: Application
    Filed: December 11, 2024
    Publication date: March 27, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Ying-Cheng Liu, Yi-An Shih, Yi-Hui Lee, Chen-Yi Weng, Chin-Yang Hsieh, I-Ming Tseng, Jing-Yin Jhang, Yu-Ping Wang
  • Patent number: 12262647
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Grant
    Filed: March 1, 2024
    Date of Patent: March 25, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 12201032
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on a first sidewall of the MTJ, and a second spacer on a second sidewall of the MTJ. Preferably, the first spacer and the second spacer are asymmetric, the first spacer and the second spacer have different heights, and a top surface of the MTJ includes a reverse V-shape.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: January 14, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Ying-Cheng Liu, Yi-An Shih, Yi-Hui Lee, Chen-Yi Weng, Chin-Yang Hsieh, I-Ming Tseng, Jing-Yin Jhang, Yu-Ping Wang
  • Publication number: 20240427223
    Abstract: The focusing module suitable for a lens module includes a focusing ring having a first maximum rotation stroke and being suitable for rotation to adjust the focal length of the lens module. The focusing module connected to the focusing ring includes a bracket, a drive unit disposed on the bracket, a relay gear connected to the drive unit, a first structure formed on the bracket, and a second structure formed on the relay gear. The focusing ring is connected to the relay gear, and the drive unit is configured to drive the relay gear to rotate to drive the focusing ring to rotate. When the relay gear rotates relatively to the bracket, the first structure and the second structure are suitable for stopping each other to limit rotation of the relay gear, so that the relay gear has a second maximum rotation stroke smaller than the first maximum rotation stroke.
    Type: Application
    Filed: June 20, 2024
    Publication date: December 26, 2024
    Applicant: Coretronic Corporation
    Inventor: Yen-Ming Tseng
  • Publication number: 20240387418
    Abstract: A semiconductor device includes a bottom wafer, a top wafer bonded to the bottom wafer, a first dielectric layer, a second dielectric layer, a deep via conductor structure, and a connection pad. The top wafer includes a first interconnection structure. The first dielectric layer is disposed on the top wafer. The second dielectric layer is disposed on the first dielectric layer. The deep via conductor structure penetrates through the second dielectric layer and the first dielectric layer and is connected with the first interconnection structure. The connection pad is disposed on the second dielectric layer and the deep via conductor structure. A first portion of the second dielectric layer is sandwiched between the connection pad and the first dielectric layer. A second portion of the second dielectric layer is connected with the first portion, and a thickness of the second portion is less than a thickness of the first portion.
    Type: Application
    Filed: June 14, 2023
    Publication date: November 21, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Chun Chen, Yu-Ping Wang, I-Ming Tseng, Yi-An Shih, Chung-Sung Chiang, Chiu-Jung Chiu
  • Publication number: 20240371758
    Abstract: A method for fabricating a semiconductor device includes the steps of first bonding a top wafer to a bottom wafer, in which the top wafer has a first metal interconnection including a first barrier layer exposing from a bottom surface of the top wafer. Next, a dielectric layer is formed on the bottom surface of the top wafer and then a second metal interconnection is formed in the dielectric layer and connected to the first metal interconnection, in which the second metal interconnection includes a second barrier layer and the first barrier layer and the second barrier layer include a H-shape altogether.
    Type: Application
    Filed: May 31, 2023
    Publication date: November 7, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Chun Chen, Yu-Ping Wang, I-Ming Tseng, Yi-An Shih, Chung-Sung Chiang, Chiu-Jung Chiu
  • Patent number: 12133474
    Abstract: A method of fabricating magnetoresistive random access memory, including providing a substrate, forming a bottom electrode layer, a magnetic tunnel junction stack, a top electrode layer and a hard mask layer sequentially on the substrate, wherein a material of the top electrode layer is titanium nitride, a material of the hard mask layer is tantalum or tantalum nitride, and a percentage of nitrogen in the titanium nitride gradually decreases from a top surface of top electrode layer to a bottom surface of top electrode layer, and patterning the bottom electrode layer, the magnetic tunnel junction stack, the top electrode layer and the hard mask layer into multiple magnetoresistive random access memory cells.
    Type: Grant
    Filed: September 27, 2023
    Date of Patent: October 29, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Chin-Yang Hsieh, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, Jing-Yin Jhang, I-Ming Tseng, Yu-Ping Wang, Chien-Ting Lin, Kun-Chen Ho, Yi-Syun Chou, Chang-Min Li, Yi-Wei Tseng, Yu-Tsung Lai, Jun Xie
  • Publication number: 20240357943
    Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a trench in the IMD layer, forming a synthetic antiferromagnetic (SAF) layer in the trench, forming a metal layer on the SAF layer, planarizing the metal layer and the SAF layer to form a metal interconnection, and forming a magnetic tunneling junction (MTJ) on the metal interconnection.
    Type: Application
    Filed: June 30, 2024
    Publication date: October 24, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chiu-Jung Chiu, Ya-Sheng Feng, I-Ming Tseng, Yi-An Shih, Yu-Chun Chen, Yi-Hui Lee, Chung-Liang Chu, Hsiu-Hao Hu
  • Patent number: 12111501
    Abstract: The present invention provides a dust-proof device for protecting insertion interfaces arranged in the optical receptacle. The dust-proof device comprises a coupling portion and a flexible arm connected to the coupling portion, wherein the flexible arm may swing or scroll at a location where the coupling portion is connected to the flexible arm. Alternatively, in another embodiment, the present invention further provides an optical receptacle having a plurality of coupling structures respectively having a first insertion interface at a first side and a second insertion interface at a second side, each first insertion interface or second insertion interface may couple to the dust-proof device so as to form an optical connector module for preventing the optical receptacle from being contaminated.
    Type: Grant
    Filed: June 13, 2021
    Date of Patent: October 8, 2024
    Assignee: ACSUPER TECHNOLOGIES INC.
    Inventor: Chung-Ming Tseng
  • Patent number: 12100028
    Abstract: Disclosed embodiments describe text-driven AI-assisted short-form video creation. Text from a website is extracted to generate extracted text. Possible summary sentences are formed from the extracted text. The forming is based on natural language processing. The summary sentences are ranked according to an engagement metric. Summary sentences from the possible summary sentences are picked based on a threshold engagement metric value. A list of video scenes is generated based on the summary sentences. Each video scene is associated with a summary sentence. A media asset from a media asset library is chosen for each video scene within the list of video scenes. The choosing is accomplished by machine learning. The list of video scenes, including the media asset that was chosen for each video scene, is compiled into a short-form video. Media is extracted from the website included into the short-form video. The compiling includes a dynamically generated image.
    Type: Grant
    Filed: December 5, 2023
    Date of Patent: September 24, 2024
    Assignee: Loop Now Technologies, Inc.
    Inventors: Wu-Hsi Li, Jeremiah Kevin Tu, Hong-Ming Tseng, Xiaochen Zhang
  • Patent number: 12096879
    Abstract: A capsule coffee machine includes a base, a capsule channel formed at a top surface of the base, a gate, an optics lens, a guiding unit, a drip container, a collecting groove, a water injection unit connected with the guiding unit, a driving unit connected with the guiding unit, and an actuator. A bottom of the capsule channel is equipped with the gate. An inside of the capsule channel is equipped with the optics lens. The guiding unit is disposed under the gate and accommodated in the base. The drip container is connected with the guiding unit. The drip container has a mouth, a stopping wall opposite to the mouth, and a peripheral wall extended between the mouth and the stopping wall. The collecting groove is recessed towards a downward direction and in the peripheral wall of the drip container. The actuator is connected with the gate.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: September 24, 2024
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventor: Chi-Ming Tseng
  • Patent number: 12096172
    Abstract: A headphone includes an arc-shaped headband, a sliding bar slidably arranged at a tail end of the headband, a hanger pivotally arranged at a tail end of the sliding bar, an earphone unit hanged to the hanger, and a light emitting unit. The earphone unit is fastened to the hanger. The earphone unit includes a housing. A peripheral edge of an outer surface of the housing protrudes outward to form a protruding ring. The light emitting unit is fastened to the housing. The light emitting unit includes a light guiding module and a light emitter. The light guiding module includes a light guider and a light blocker. An inner end of the light blocker is provided with a contacting portion which is closely cooperated with the protruding ring, and an inner end of the light guider closely abuts against the protruding ring.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: September 17, 2024
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chi-Ming Tseng, Chin-Chung Lin
  • Publication number: 20240290024
    Abstract: Disclosed embodiments provide techniques for dynamic synthetic video chat agent replacement. A human host receives a request for a video chat initiated by a user. An image for a synthetic host including a representation of an individual is retrieved. The image of the synthetic host is selected based on information about the user. Aspects of the individual included in the image are extracted using one or more processors. A video performance by the human host responding to the statement or query by the user is captured. A synthetic host performance is created in which the video performance of the human host is dynamically replaced by the individual that was extracted so that the synthetic host performance responds to the user statement or query. The synthetic host performance is rendered to the user and supplemented with additional synthetic host performances as the video chat continues.
    Type: Application
    Filed: February 23, 2024
    Publication date: August 29, 2024
    Applicant: Loop Now Technologies, Inc.
    Inventors: Wu-Hsi Li, Edwin Chiu, Jerry Ting Kwan Luk, Hong-Ming Tseng, Jeremiah Kevin Tu
  • Publication number: 20240292069
    Abstract: Disclosed embodiments provide techniques for synthesized realistic metahuman short-form videos. A photorealistic representation of an individual is accessed from media sources including videos, photographs, livestreams, or a 360-degree recording of a human host. The individual can be selected based on information on the viewer of the short-form video, such as purchase history, viewing history, and metadata. The photorealistic representation is isolated using machine learning and is used to create a three-dimensional (3D) model of the individual, based on a game engine. A realistic synthetic performance is created by combining the 3D model of the individual with animation generated by a game engine. The synthesized performance can include the voice of the human host. The synthesized performance is inserted into a metaverse environment and rendered to a viewer as a short-form video, including an ecommerce window with an on-screen product card and virtual purchase cart.
    Type: Application
    Filed: February 23, 2024
    Publication date: August 29, 2024
    Applicant: Loop Now Technologies, Inc.
    Inventors: Hong-Ming Tseng, Edwin Chiu, Wu-Hsi Li, Jeremiah Kevin Tu
  • Publication number: 20240292070
    Abstract: Disclosed embodiments provide techniques for iterative AI prompt optimization for video generation. A first text template to be read by a large language model (LLM) neural network is accessed. The template includes control parameters that are populated from within a website. The populated template is submitted as a request to the LLM neural network, which generates a first video script. The first video script is used to create a first short-form video. The first short-form video is evaluated based on one or more performance metrics. The text template, short-form video, website information, and evaluation are used to train a machine learning model that is used to create a second text template. The second text template can be used to generate a second short-form video. The evaluation of iterative text templates and resulting short-form videos continues until a usable video is produced.
    Type: Application
    Filed: April 10, 2024
    Publication date: August 29, 2024
    Applicant: Loop Now Technologies, Inc.
    Inventors: Wu-Hsi Li, Edwin Chiu, Hong-Ming Tseng, Xiaochen Zhang
  • Patent number: 12063871
    Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a trench in the IMD layer, forming a synthetic antiferromagnetic (SAF) layer in the trench, forming a metal layer on the SAF layer, planarizing the metal layer and the SAF layer to form a metal interconnection, and forming a magnetic tunneling junction (MTJ) on the metal interconnection.
    Type: Grant
    Filed: August 4, 2023
    Date of Patent: August 13, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chiu-Jung Chiu, Ya-Sheng Feng, I-Ming Tseng, Yi-An Shih, Yu-Chun Chen, Yi-Hui Lee, Chung-Liang Chu, Hsiu-Hao Hu
  • Publication number: 20240268124
    Abstract: A semiconductor structure includes a substrate, a first dielectric layer on the substrate, a plurality of memory stack structures on the first dielectric layer, an insulating layer conformally covering the memory stack structures and the first dielectric layer, a second dielectric layer on the insulating layer and filling the spaces between the memory stack structures, a first interconnecting structure through the second dielectric layer, wherein a top surface of the first interconnecting structure is flush with a top surface of the second dielectric layer and higher than top surfaces of the memory stack structures, a third dielectric layer on the second dielectric layer, and a plurality of second interconnecting structures through the third dielectric layer, the second dielectric layer and the insulating layer on the top surfaces of the memory stack structures to contact the top surfaces of the memory stack structures.
    Type: Application
    Filed: April 16, 2024
    Publication date: August 8, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Yu-Ping Wang, Chen-Yi Weng, Chin-Yang Hsieh, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Jing-Yin Jhang, Chien-Ting Lin
  • Publication number: 20240267573
    Abstract: Disclosed embodiments provide techniques for livestream with synthetic scene insertion. A prerecorded livestream featuring a host is rendered to one or more viewers. An operator accesses a video segment related to the prerecorded livestream. The related video segment includes a performance by an individual. The operator retrieves an image of the host of the prerecorded livestream and creates from the related video segment a synthesized video segment that includes the performance of the individual accomplished by the host. One or more insertion points are determined within the prerecorded livestream for the insertion of the synthesized video segment. The operator inserts the synthesized video segment into the prerecorded livestream at the one or more determined insertion points. The insertion is accomplished dynamically and appears seamless to the viewer. The remainder of the prerecorded video is rendered to the one or more viewers after the insertion point.
    Type: Application
    Filed: February 2, 2024
    Publication date: August 8, 2024
    Applicant: Loop Now Technologies, Inc.
    Inventors: Hong-Ming Tseng, Edwin Chiu, Wu-Hsi Li, Jerry Ting Kwan Luk, Jeremiah Kevin Tu
  • Publication number: 20240255707
    Abstract: The present invention provides an optical connector comprising a terminal portion and a connector body. The connector body has a buckle structure for latching with a receptacle and an unbuckle structure for releasing buckle structure from the receptacle. The connector body comprises a first assembly element and a second assembly element. The first assembly element is connected to the terminal portion, and a first channel is formed at a first side of the first assembly element while a first coupling element is arranged at a second side of the first assembly element. The second assembly element is connected to the first coupling element, and a second channel formed on a first side of the second assembly element is communicated with the first channel while a second coupling element is arranged at a second side of the second assembly element and movably connected to the first coupling element.
    Type: Application
    Filed: September 19, 2023
    Publication date: August 1, 2024
    Inventor: Chung-Ming TSENG