Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: A projection correction method adapted to a projector. The projection correction method includes: sensing a temperature of a body of the projector, so as to obtain a first temperature value, where a focusing gear of the projector is located at a first gear position; determining whether the temperature of the body of the projector is changed, and when the temperature of the body of the projector is changed from the first temperature value to a second temperature value, the focusing gear is rotated by a predetermined distance to rotate the focusing gear to a second gear position; and determining whether a storage device stores a target gear position corresponding to the second temperature value, so as to rotate the focusing gear to the target gear position. Moreover, a projector using the aforementioned projection correction method is also provided.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: A projection device and a luminance control method of a frame are provided. The luminance control method of the frame includes the following steps. Whether the frame is a dark-like frame or not is determined according to a gray level distribution of the frame and whether at least one sub-frame of the frame is a dark-like sub-frame or not is determined according to a gray level distribution of the sub-frame. When the frame is the dark-like frame and the sub-frame is not the dark-like sub-frame, a corresponding area of the sub-frame is ignored and a reference value of luminance is computed according to a part corresponding to the unignored area in the frame. The luminance of a projection light of the projection device is adjusted according to the reference value of luminance.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: A projection correction method adapted to a projector. The projection correction method includes: sensing a temperature of a body of the projector, so as to obtain a first temperature value, where a focusing gear of the projector is located at a first gear position; determining whether the temperature of the body of the projector is changed, and when the temperature of the body of the projector is changed from the first temperature value to a second temperature value, the focusing gear is rotated by a predetermined distance to rotate the focusing gear to a second gear position; and determining whether a storage device stores a target gear position corresponding to the second temperature value, so as to rotate the focusing gear to the target gear position. Moreover, a projector using the aforementioned projection correction method is also provided.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: The invention discloses a plant cultivation apparatus comprising a plurality of partitioning spaces, each partitioning space intervally disposed with an isolation net, two ends of each partitioning space respectively disposed with an opening, a rack body respectively disposed inside each partitioning space to place plantings; a working region disposed at one end of the plurality of partitioning spaces, the working region comprising a plurality of ducted fans, each ducted fan respectively and correspondingly located above each partitioning space to supply and conduct airstream to another end of the partitioning space; and a water curtain component disposed at another end of the plurality of partitioning spaces to receive airstream supplied by the ducted fan and conducting it to the opening of each partitioning space so inject airstream into an inside of each partitioning space.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: The present invention discloses a modular device for raising seedling that comprises at least two individual containers to receive a culture medium and a seedling, and at least a coupling member. Each of the individual containers is provided with at least a pair of the coupling bumps arranged on two opposing positions respectively on both lateral edges of the individual container, and is protruded at a predetermined height from a backside of the individual container. Each of the coupling members is provided with a mating groove which is arranged in extending around its longitudinal shape so as to form a serial connection of the individual containers by means of mating the coupling bump with the mating groove within the same coupling member between two adjacent individual containers.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: A plant cultivation apparatus includes at least one container body, an elongated bottom plate installed at the container body, plural grids formed and separated by a partition, a rear plate installed on a side of the bottom plate and coupled between the partitions, a window formed on the rear plate and interconnected to each grid, and a first through hole formed on the bottom plate and interconnected to each respective grid. Each grid serves as a growth space for accommodating a plant, and the first through hole serves as a channel of a cultivation liquid in contact with the root of the plant and the bottom of the container body, such that the growing space of each plant obtains good air convection to improve the growing quality of the plant.

Abstract: A link device with a large density routing is attached to a package in order to provide a high-density interconnect pathway to interconnect semiconductor devices. In an embodiment the package is an integrated fan out package. The link device may be bonded on either side of the package, and the package may optionally comprise through package vias. The link device may also be an integrated passive device that includes resistors, inductor, and capacitor components.

Abstract: The present invention discloses a modular device for raising seedling that comprises at least two individual containers to receive a culture medium and a seedling, and at least a coupling member. Each of the individual containers is provided with at least a pair of the coupling bumps arranged on two opposing positions respectively on both lateral edges of the individual container, and is protruded at a predetermined height from a backside of the individual container. Each of the coupling members is provided with a mating groove which is arranged in extending around its longitudinal shape so as to form a serial connection of the individual containers by means of mating the coupling bump with the mating groove within the same coupling member between two adjacent individual containers.

Abstract: A projection device and a luminance control method of a frame are provided. The luminance control method of the frame includes the following steps. Whether the frame is a dark-like frame or not is determined according to a gray level distribution of the frame and whether at least one sub-frame of the frame is a dark-like sub-frame or not is determined according to a gray level distribution of the sub-frame. When the frame is the dark-like frame and the sub-frame is not the dark-like sub-frame, a corresponding area of the sub-frame is ignored and a reference value of luminance is computed according to a part corresponding to the unignored area in the frame. The luminance of a projection light of the projection device is adjusted according to the reference value of luminance.