Patents by Inventor Ming-Tsung Lin
Ming-Tsung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240135990Abstract: A resistive memory apparatus including a memory cell array, at least one dummy transistor and a control circuit is provided. The memory cell array includes a plurality of memory cells. Each of the memory cells includes a resistive switching element. The dummy transistor is electrically isolated from the resistive switching element. The control circuit is coupled to the memory cell array and the dummy transistor. The control circuit is configured to provide a first bit line voltage, a source line voltage and a word line voltage to the dummy transistor to drive the dummy transistor to output a saturation current. The control circuit is further configured to determine a value of a second bit line voltage for driving the memory cells according to the saturation current. In addition, an operating method and a memory cell array of the resistive memory apparatus are also provided.Type: ApplicationFiled: December 28, 2023Publication date: April 25, 2024Applicant: Winbond Electronics Corp.Inventors: Ming-Che Lin, Min-Chih Wei, Ping-Kun Wang, Yu-Ting Chen, Chih-Cheng Fu, Chang-Tsung Pai
-
Patent number: 11953052Abstract: A fastener is adapted for assembling a first housing to a second housing. The first housing is provided with a protruding portion and a buckling portion, and the second housing has a first surface, a second surface, and a through hole. The fastener includes a first portion, at least one connecting portion, at least two elastic portions, and a second portion. The first portion movably abuts against the first surface and has a first opening. The connecting portion is accommodated in the through hole. One end of the connecting portion is connected to the first portion. The connecting portion is spaced apart from an inner edge of the second housing by a gap. The two elastic portions inclinedly extend into the first opening. The second portion movably abuts against the second surface and is disposed at the another end of the connecting portion.Type: GrantFiled: June 17, 2021Date of Patent: April 9, 2024Assignee: PEGATRON CORPORATIONInventors: Jian-Hua Chen, Po-Tsung Shih, Yu-Wei Lin, Ming-Hua Ho, Chih-Hao Wu
-
Patent number: 11948278Abstract: An image quality improvement method and an image processing apparatus using the same are provided. Denoising filtering is performed to an original image by a filter to obtain a preliminary processing image. The preliminary processing image is input to a multi-stage convolutional network model to generate an optimization image through the multi-stage convolutional network model. The multi-stage convolutional network model includes multiple convolutional network sub-models, and these convolutional network sub-models respectively correspond to different network architectures.Type: GrantFiled: August 18, 2021Date of Patent: April 2, 2024Assignee: National Chengchi UniversityInventors: Yan-Tsung Peng, Sha-Wo Huang, Ming-Hao Lin, Chin-Hsien Wu, Chun-Lin Tang
-
Publication number: 20240105389Abstract: A wound capacitor package structure and a method of manufacturing the same are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly, a package casing and a protruding sealing element. The conductive assembly includes a first conductive pin and a second conductive pin. The package casing is configured to receive the wound assembly. The protruding sealing element is arranged inside and cooperates with the package casing. The package casing is configured to receive the wound assembly. The protruding sealing element is disposed inside the package casing and cooperating with the package casing. The package casing has a surrounding concave position-limiting portion recessed inward, and a surrounding convex end portion protruding from the surrounding concave position-limiting portion.Type: ApplicationFiled: December 13, 2022Publication date: March 28, 2024Inventors: MING-TSUNG LIANG, HSUAN-YI LIN
-
Patent number: 11933849Abstract: The present disclosure provides an inductance detection method includes steps of: (a) acquiring a stator resistance of the reluctance motor; (b) injecting a high-frequency sinusoidal signal in the d-axis or q-axis direction; (c) injecting an align signal command in the q-axis or d-axis direction; (d) receiving a dq-axes signal generated through injecting the high-frequency sinusoidal signal and the align signal command; (e) sampling a motor feedback signal generated through receiving the dq-axes signal; (f) in the direction of injecting the high-frequency sinusoidal signal, calculating an amplitude difference between the high-frequency sinusoidal signal and the motor feedback signal, and adjusting an amplitude of the high-frequency sinusoidal signal according to the amplitude difference for regulating a feedback amplitude of the motor feedback signal; and (g) when the feedback amplitude reaching an expected amplitude, calculating an apparent inductance of the reluctance motor based on the dq-axes signal, theType: GrantFiled: May 19, 2022Date of Patent: March 19, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Yu-Shian Lin, Tung-Chin Hsieh, Ming-Tsung Chen
-
Publication number: 20230238360Abstract: A semiconductor package assembly and an electronic device are provided. The semiconductor package assembly includes a base, a system-on-chip (SOC) package, a memory package and a silicon capacitor die. The base has a first surface and a second surface opposite the first surface. The SOC package is disposed on the first surface of the base and includes a SOC die having pads and a redistribution layer (RDL) structure. The RDL structure is electrically connected to the SOC die by the pads. The memory package is stacked on the SOC package and includes a memory package substrate and a memory die. The memory package substrate has a top surface and a bottom surface. The memory die is electrically connected to the memory package substrate. The silicon capacitor die is disposed on and electrically connected to the second surface of the base.Type: ApplicationFiled: December 29, 2022Publication date: July 27, 2023Inventors: Li-Huan CHU, Kai-Che CHENG, Ming-Tsung LIN, Sheng-Feng LIU, Chi-Ko YU
-
Patent number: 10910829Abstract: An interface circuit of an electronic device includes one or more pins, an internal circuit, an over-voltage protection circuit and a monitoring circuit. The pins are selectively connected to an external circuit. The over-voltage protection circuit is coupled between the internal circuit and at least one pin to prevent the internal circuit from being damaged by a voltage spike or a current surge received at the pin. The monitoring circuit is configured to monitor one or more electrical characteristics of at least one critical component in the internal circuit or the over-voltage protection circuit by monitoring the value of at least one parameter related to the electrical characteristics of the critical component. When the value of the parameter is outside of a safety range, the monitoring circuit outputs a warning signal.Type: GrantFiled: October 2, 2017Date of Patent: February 2, 2021Assignee: MEDIATEK INC.Inventors: Shou-En Liu, Hsien-Sheng Huang, Yu-Hsuan Lin, Ming-Tsung Lin
-
Publication number: 20180102639Abstract: An interface circuit of an electronic device includes one or more pins, an internal circuit, an over-voltage protection circuit and a monitoring circuit. The pins are selectively connected to an external circuit. The over-voltage protection circuit is coupled between the internal circuit and at least one pin to prevent the internal circuit from being damaged by a voltage spike or a current surge received at the pin. The monitoring circuit is configured to monitor one or more electrical characteristics of at least one critical component in the internal circuit or the over-voltage protection circuit by monitoring the value of at least one parameter related to the electrical characteristics of the critical component. When the value of the parameter is outside of a safety range, the monitoring circuit outputs a warning signal.Type: ApplicationFiled: October 2, 2017Publication date: April 12, 2018Inventors: Shou-En LIU, Hsien-Sheng HUANG, Yu-Hsuan LIN, Ming-Tsung LIN
-
Patent number: 8419233Abstract: A lampshade structure for LED lamps includes at least one light-diffusing bowl structure, a lower end, an interior space and a sidewall. The light-diffusing bowl structure composed by an exterior curve wall and an interior curve wall is located on top of the lampshade to diffuse lights from the LED laterally to the lamp. Both the curvature centers of the exterior curve wall and the interior curve wall are located exteriorly to the lampshade structure. By providing the concave light-diffusing bowl structure to occupy the illumination angle of the LED, the incident rays of the LED to the bowl structure can be partly deflected to leave from the lateral sides of the lampshade so as to emulate the LED lamp as an omni-directional lamp device.Type: GrantFiled: May 10, 2011Date of Patent: April 16, 2013Assignee: Applied Lighting CompanyInventor: Ming Tsung Lin
-
Publication number: 20080249949Abstract: A data exchange method between a first peer system having a requested data chunk and a second peer system having a credit includes: exchanging the credit of the second peer system for the requested data chunk of the first peer system; and using the credit received by the first peer system to exchange for a future data chunk from the second peer system at a later time.Type: ApplicationFiled: April 9, 2007Publication date: October 9, 2008Inventors: Chia-Chin Wang, Yung-Chieh Lin, Ming-Tsung Lin
-
Patent number: 6412734Abstract: A golf bag support device includes a support secured to bag having an opening on a side and a recess adjacent the opening, a flexible member open at the top and one side having a corrugated surface secured to the recess and a bottom attached to the corrugated surface, a flexible extension member with one end pivotably attached to the bottom of the flexible member and the other ends pivotably attached at predetermined positions on the legs, and two legs with top ends pivotably attached to the top edge of golf bag. In operation, the bag is pulled outward such that the corrugated surface is compressed by the weight of bag and golf clubs and extension member is bent to cause the legs to extend outward to form an angle with respect to the bag. This forms a three-legged support by the legs, support, and flexible member for the bag. Further, the clubs are extended above the bag due to the compression of the flexible member. This facilitates the access of golf clubs. Moreover, this device is aesthetic.Type: GrantFiled: May 9, 2000Date of Patent: July 2, 2002Inventor: Ming-Tsung Lin
-
Publication number: 20020000500Abstract: A golf bag support device comprises a support secured to bag having an opening on a side and a recess adjacent the opening, a flexible member open at the top and one side having a corrugated surface secured to the recess and a bottom attached to the corrugated surface, a flexible extension member with one end pivotably attached to the bottom of the flexible member and the other ends pivotably attached at predetermined positions of legs, and two legs with top ends pivotably attached to the top edge of golf bag. In operation, pull bag outward such that corrugated surface is compressed by the weight of bag and golf clubs and extension member is bent to cause legs to extend outward to form an angle with respect to bag. This forms a three-legged support by legs, support, and flexible member for the bag. Further, clubs are extended above the bag due to the compression of flexible member. This facilitates the access of golf clubs. Moreover, this device is aesthetic.Type: ApplicationFiled: May 9, 2000Publication date: January 3, 2002Applicant: LERNER DAVID LITTENBERG KRUMHOLZ & MENTLIKInventor: Ming-Tsung Lin
-
Patent number: 6311938Abstract: A support base for a golf club bag. The support base includes an upper base (9). The upper base includes at least one through passage. The support base includes a lower base (2) having an upper portion (2A, 7A) and a lower portion (2B, 7B). The first end of a golf club bag (1) is attached to the upper base (9) and the lower base (2) to form an open cavity between the upper and lower bases. A stand (5) is pivotally connected to the upper base (9) and extends along the length of the golf club bag, near the lower base (2). A support frame (4) is attached to the lower base (2) and pivotally connected to the stand (5).Type: GrantFiled: March 8, 2000Date of Patent: November 6, 2001Inventor: Ming-Tsung Lin
-
Patent number: 6085901Abstract: The invention herein relates to a golf club bag shaft mount having of a frame that is installed in the opening of a golf club bag as well as individual golf club shaft mounts. Each mount is a unitary fabricated body having groove formed in the interior, with a curvilinear surface along the top of the groove. Furthermore, formed at the top is a semicircular concave recess. There is a bolt hole on each of two sides of the mount. After the adjacent sides of the mounts and the enclosure panels are fastened using the bolt holes, the invention herein is securely installed into the opening of the golf bag. Following assembly, the golf club shafts are placed into the openings of the mounts and then the mounts are rotated 90 degrees clockwise to prevent shifting and shaft-to-shaft impact.Type: GrantFiled: January 20, 1999Date of Patent: July 11, 2000Inventor: Ming-Tsung Lin