Abstract: A disclosed method for manufacturing a printed circuit board includes creating multiple conductive layers, each including conductive traces for carrying high-speed data signals, and a non-round plated through power via for delivering high current from a switched-mode power source to and between the conductive layers. Creating the power via may include drilling an opening through the multiple conductive layers, the perimeter of which has a flattened oval shape, and plating the walls of the opening to a predetermined plating thickness using a conductive material. The power via may have a lower resistivity than a combined resistivity of multiple round, plated through vias that, together with required spacing between them, have the same footprint as the power via. The space occupied by the power via may be less than a required footprint for multiple round, plated through vias whose combined resistivity equals the resistivity of the power via.

Abstract: An electronic component base for an electronic component is disclosed to have a top wall adapted to accommodate an electronic component core, diagonally extended wire grooves in the top wall for guiding out lead wires of the loaded electronic component core, a bottom wall, a plurality of electrically conducting zones in the bottom wall, four peripheral walls, four chamfered angles alternatively connected between the peripheral walls, and four conducting side grooves respectively extended from the wire grooves to the electrically conducting zones for receiving the lead wires of the electronic component core from the wire grooves.

Abstract: A fixture for assembling an inductor is a flat locating seat with an upper side thereof having a locating nest corresponding to the RI core of the inductor and having a central part corresponding to a locating part disposed at the bottom of the DR core in the inductor. The inductor can be located at the fixture and operations such as soldering and spot gluing can be performed steadily.