Abstract: The present disclosure relates generally to the manufacturing of semiconductor devices, and more particularly to an improved connection structure for semiconductor devices. A connection structure for a semiconductor device includes: a peanut-shaped opening comprising a narrow area and one or more wide areas, wherein the narrow area is between two of the one or more wide areas; and a conductive plug for filling at least partially the peanut-shaped opening.

Abstract: This invention relates to an improved water-cooled air conditioner and in particular to one which comprises a main body. A condenser provided with a condensing coil is disposed in the middle portion of the main body. The interior of the condenser is filled with water, while the refrigerant is received in the condensing coil therein. An evaporator provided with a cooling coil is disposed in the lower portion of the main body. The cooling coil is connected to the condensing coil via an expansion valve. A cooling device serving as a cooling tower is disposed in the upper portion of the main body. A compressor is disposed on the outside of the main body to provide the heated refrigerant for the condenser and to receive the cooled refrigerant from the evaporator. A ventilating device is disposed around the condenser to provide a further cooling effect. A heating device is disposed in the lower portion of the main body below the evaporator to heat the water received in the evaporator.