Patents by Inventor Ming Wa Tam
Ming Wa Tam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220384362Abstract: A Faraday cage cavity package, having: a leadframe; a plastic body molded onto the leadframe to form a cavity exposing top surfaces of a die attach paddle, tie bars and lead fingers of the leadframe within the cavity; and a lid attached onto the top of the leadframe to protect a die attached to the die attach pad from electromagnetic fields, wherein the Faraday cage cavity package is manufactured in a matrix format and then separated into a plurality of individual Faraday cage cavity package units.Type: ApplicationFiled: May 30, 2022Publication date: December 1, 2022Inventors: Ming-Wa TAM, Kenneth KWAN
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Patent number: 10777457Abstract: A method of manufacturing, a carrier, and a semiconductor package are provided. The method involves depositing a plurality of conductive vias, applying a molding material over the lead frame, grinding the molding material to expose the plurality of conductive vias, and depositing a metalized pattern over the molding material. The carrier is manufacture by this method and the semiconductor package is formed based on the carrier.Type: GrantFiled: October 3, 2017Date of Patent: September 15, 2020Assignee: UBOTIC COMPANY LIMITEDInventor: Ming-Wa Tam
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Patent number: 10458826Abstract: A mass flow sensor module and method of manufacture thereof are provided, wherein a semiconductor sensor die is integrated within an enhanced molded housing structure that maintains an air tight seal and protects the die from abrasive wear, and which also provides laminar flow of the liquid gas to be sensed. Since the die is embedded in the substrate; there is no need for a spacer for reducing die thickness induced flow turbulence. Moreover, the die surface is at the same level as the top surface of the substrate, such that there is no performance impact due to die thickness variation and therefore no die attach bond line thickness control requirement. In one embodiment, a thermal enhancement capability is provided.Type: GrantFiled: August 25, 2017Date of Patent: October 29, 2019Assignee: UBOTIC COMPANY LIMITEDInventor: Ming-Wa Tam
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Publication number: 20190103313Abstract: A method of manufacturing, a carrier, and a semiconductor package are provided. The method involves depositing a plurality of conductive vias, applying a molding material over the lead frame, grinding the molding material to expose the plurality of conductive vias, and depositing a metalized pattern over the molding material. The carrier is manufacture by this method and the semiconductor package is formed based on the carrier.Type: ApplicationFiled: October 3, 2017Publication date: April 4, 2019Inventor: Ming-Wa TAM
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Publication number: 20190063971Abstract: A mass flow sensor module and method of manufacture thereof are provided, wherein a semiconductor sensor die is integrated within an enhanced molded housing structure that maintains an air tight seal and protects the die from abrasive wear, and which also provides laminar flow of the liquid gas to be sensed. Since the die is embedded in the substrate; there is no need for a spacer for reducing die thickness induced flow turbulence. Moreover, the die surface is at the same level as the top surface of the substrate, such that there is no performance impact due to die thickness variation and therefore no die attach bond line thickness control requirement. In one embodiment, a thermal enhancement capability is provided.Type: ApplicationFiled: August 25, 2017Publication date: February 28, 2019Inventor: Ming-Wa TAM
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Patent number: 9991194Abstract: A method of manufacture and a substrate for sensor packages is provided. The method involves premolding a lead frame with strips having V-grooves; cutting the substrate partially, and plating the exposed surfaces of the lead frame. The method subsequently involves attaching a die to a dies pad and connecting wires between the die and leads to form a sensor package. The sensor package is separated from the substrate by snapping along the score line. The substrate for assembly of sensor packages as well as substrate of sensor packages is manufactured using at least part of the method of manufacture.Type: GrantFiled: April 18, 2017Date of Patent: June 5, 2018Assignee: UBOTIC COMPANY LIMITEDInventors: Ming-Wa Tam, Ken Lik Hang Wan, Wa San Leung
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Publication number: 20160020177Abstract: A radio-frequency shielding cavity package is set forth along with a method of manufacturing thereof. According to one embodiment, the radio-frequency shielding cavity package comprises a metallic leadframe and plastic molded body. The leadframe has a plurality of contact pads extending from top to bottom surfaces thereof, at least one contact pad on the top surface being surrounded by metal for shielding the contact pad from external electric fields. A plated inner ring surrounds a die attach pad on the leadframe. The die attach pad receives a semiconductor die adapted to be wire bonded to the inner ring and plurality of contact pads. A plated outer ring defines a ground plane circumscribing the perimeter of the leadframe. A cap is connected to the ground plane for enclosing and protecting the wire bonded semiconductor device die and providing electrical grounding thereof.Type: ApplicationFiled: June 12, 2015Publication date: January 21, 2016Inventor: Ming-Wa TAM
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Patent number: 8853564Abstract: In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole.Type: GrantFiled: April 30, 2010Date of Patent: October 7, 2014Assignee: Ubotic Intellectual Property Co. Ltd.Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
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Patent number: 8809974Abstract: In some embodiments, a semiconductor package can include: (a) a base having a cavity; (b) an interposer coupled to the base and at least partially over the cavity such that the interposer and the base form a back chamber, the interposer has a first opening into the back chamber; (c) a micro-electro-mechanical system device located over the interposer at the first opening; and (d) a lid coupled to the base. Other embodiments also are disclosed.Type: GrantFiled: February 26, 2010Date of Patent: August 19, 2014Assignee: Ubotic Intellectual Property Company LimitedInventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
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Patent number: 8742569Abstract: In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base coupled to the lid and having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. At least one of the lid or the base can have at least one port hole. The one or more first electrically conductive leads can be configured to couple to the printed circuit board. Other embodiments are disclosed.Type: GrantFiled: April 30, 2010Date of Patent: June 3, 2014Assignee: Ubotic Intellectual Property Co. Ltd.Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
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Publication number: 20130140319Abstract: An innovative end cap for IC trays includes a bottom and side walls. The side walls extend upwardly from the bottom and form a tray-accommodating space. The innovative end cap includes a plurality of buffering ribs and buffering grooves on its surfaces. The buffering ribs and buffering grooves arranged on the end cap can fully absorb, disperse and transfer the impact energy generated during testing, storage, collision and shock of the trays which accommodate the precision semiconductor components therein, and increase impact strength and anti-dropping damage ability of the end cap. Therefore, the innovative end cap with the buffering ribs and buffering grooves can not only protect the trays and extend the service lifetime of the trays, but also give better protection to the precision semiconductor components such as Chips, IC etc in the trays.Type: ApplicationFiled: May 9, 2012Publication date: June 6, 2013Inventors: Ming Wa TAM, Huimin WANG, Zhiguang JIANG
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Publication number: 20130128487Abstract: In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole.Type: ApplicationFiled: April 30, 2010Publication date: May 23, 2013Applicant: UBOTIC INTELLECTUAL PROPERTY CO. LTD.Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
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Publication number: 20130032905Abstract: In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base coupled to the lid and having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. At least one of the lid or the base can have at least one port hole. The one or more first electrically conductive leads can be configured to couple to the printed circuit board. Other embodiments are disclosed.Type: ApplicationFiled: April 30, 2010Publication date: February 7, 2013Applicant: UBOTIC INTELLECTUAL PROPERTY CO. LTD.Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
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Publication number: 20130008966Abstract: An intelligent tray for chips includes a main body having a readable and writable memory unit thereon. The readable and writable memory unit has parameters related to the intelligent tray written therein. The parameters written in the readable and writable memory unit can be read out automatically by a machine, and no need to be manually checked one by one. This helps to automate production, improve production efficiency and shorten production cycle.Type: ApplicationFiled: February 22, 2012Publication date: January 10, 2013Inventors: Ming Wa TAM, Huimin Wang, Yee Ping Chan, Xiaoping Zhang, Zhiguang Jiang
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Publication number: 20120319256Abstract: In some embodiments, a semiconductor package can include: (a) a base having a cavity; (b) an interposer coupled to the base and at least partially over the cavity such that the interposer and the base form a back chamber, the interposer has a first opening into the back chamber; (c) a micro-electro-mechanical system device located over the interposer at the first opening; and (d) a lid coupled to the base. Other embodiments also are disclosed.Type: ApplicationFiled: February 26, 2010Publication date: December 20, 2012Applicant: UBOTIC INTELLECTUAL PROPERTY COMPANY LIMITEDInventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
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Patent number: D757538Type: GrantFiled: February 17, 2015Date of Patent: May 31, 2016Assignee: UBOTIC COMPANY LIMITEDInventor: Ming-Wa Tam