Patents by Inventor Ming Wai Kelvin Ng

Ming Wai Kelvin Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for alignment of a bonding tool
    Patent number: 7240711
    Abstract: The invention provides an apparatus and method for aligning a bonding tool. A force sensor having a plurality of force sensing sections is configured to measure a force generated by the bonding tool on the force sensor. Each sensing section is adapted to individually detect an amount of force from a part of the bonding tool acting on that sensing section, so that an alignment of the bonding tool may be determined.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: July 10, 2007
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Lai Wa Helen Chan, Siu Hong Choy, Chou Kee Peter Liu, Ming Wai Kelvin Ng, Yuk Cheung Au
  • Ultrasonic transducer assembly
    Patent number: 7002283
    Abstract: The invention provides an ultrasonic transducer assembly for a bonding apparatus, comprising a bonding tool mounted to an amplifying horn secured between first and second ultrasonic-generating means. A method of forming a transducer for a bonding apparatus is also provided, comprising the steps of providing an amplifying horn, securing first and second ultrasonic-generating means to the amplifying horn such that the amplifying horn is located between said first and second ultrasonic-generating means and mounting a bonding tool to the amplifying horn.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: February 21, 2006
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Hing Leung Marchy Li, Kin Yik Hung, Ming Wai Kelvin Ng
  • Ultrasonic transducer assembly
    Publication number: 20040245893
    Abstract: The invention provides an ultrasonic transducer assembly for a bonding apparatus, comprising a bonding tool mounted to an amplifying horn secured between first and second ultrasonic-generating means. A method of forming a transducer for a bonding apparatus is also provided, comprising the steps of providing an amplifying horn, securing first and second ultrasonic-generating means to the amplifying horn such that the amplifying horn is located between said first and second ultrasonic-generating means and mounting a bonding tool to the amplifying horn.
    Type: Application
    Filed: June 3, 2003
    Publication date: December 9, 2004
    Applicant: ASM Assembly Automation Ltd.
    Inventors: Hing Leung Marchy Li, Kin Yik Hung, Ming Wai Kelvin Ng