Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: A machining module includes a molding system, a painting system and a transporting system. The transporting system is positioned between the molding system and the painting system. The transporting system automatically transports a plurality of blank members produced by the molding system to the painting system. The transporting system defines a detecting station for detecting the blank members and an assembly station for assembling the detected blank members to the painting system.

Abstract: A molding system includes a container, a plurality of molding machines positioned adjacent to the container, and a feeding module and a power supply module positioned within the container. The feeding module includes a main feeding pipe, a plurality of dehumidifiers connected to the main feeding pipe, and a plurality of branch feeding pipes connecting the dehumidifiers to the molding machines. The power supply module includes a power distribution box connected to the molding machines and the dehumidifiers. The container is divided into receiving boxes, in which a portion of the main air pipe and a portion of the main water pipe, one power distribution box, and several dehumidifiers are housing within each receiving box.

Abstract: A feeding system includes a hopper, a high-pressure fan, a filter, a controller, and a receiving box. The hopper is filled with plastic material. The controller is connected with the high-pressure fan and the filter. The high-pressure fan, the filter, and the controller are received in the receiving box. The filter is connected to the hopper via a feeding pipe. The high-pressure fan is connected to the feeding pipe. The controller controls the high-pressure fan to generate a pulling force to pull the plastic materials out of the hopper, and controls the filter to filter the plastic material.

Abstract: A machining module includes a molding system, a painting system and a transporting system. The transporting system is positioned between the molding system and the painting system. The transporting system automatically transports a plurality of blank members produced by the molding system to the painting system. The transporting system defines a detecting station for detecting the blank members and an assembly station for assembling the detected blank members to the painting system.

Abstract: An intelligent LED lamp group control device using an existing wall switch for controlling a group of LED lamps includes an AC power converter, an interface for intelligent control using an interface circuit for upgrading the existing wall switch for scene group control. The device further includes a night lamp control input port, an emergency operation switch, an external set control box connector, a wall switch input unit, a control configuration set interface, a power failure battery input port and a night lamp and RS-485 serial port. The device enables one single controller to achieve control of and provide power supply to multiple LED lamps, and uses a communication control interface for converting the power supply originally provided to the LED lamps into a logic control signal so that the wiring layout and location of the original lighting control wall switch can be used.