Abstract: A method includes directing light at a first side of a semiconductor structure; detecting a first light intensity at a second side of the semiconductor structure, wherein the first light intensity corresponds to the light that penetrated the semiconductor structure from the first side to the second side; and comparing the first light intensity to a second light intensity, wherein the second light intensity corresponds to an expected intensity of light.

Abstract: A semiconductor device includes a first diode, a second diode, a clamp circuit and a third diode. The first diode is coupled between an input/output (I/O) pad and a first voltage terminal. The second diode is coupled with the first diode, the I/O pad and a second voltage terminal. The clamp circuit is coupled between the first voltage terminal and the second voltage terminal. The second diode and the clamp circuit are configured to direct a first part of an electrostatic discharge (ESD) current flowing between the I/O pad and the first voltage terminal. The third diode, coupled to the first voltage terminal, and the second diode include a first semiconductor structure configured to direct a second part of the ESD current flowing between the I/O pad and the first voltage terminal.

Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.

Abstract: A liquid-cooling device includes multiple water blocks and at least one connection tube. Each of the water blocks has a water incoming end, a water outgoing end and a water-receiving space in communication with the water incoming end and the water outgoing end. The connection tube is disposed between each two water blocks. Two ends of the connection tube are respectively connected with the water incoming end of one of the two water blocks and the water outgoing end of the other water block, whereby the water-receiving spaces of the two water blocks communicate with each other via the connection tube. The connection tube has at least one bellows section between two ends of the connection tube. The liquid-cooling device solves the problems of the conventional liquid-cooling device that when the water block is welded, thermal deformation is produced to cause tolerance and the manufacturing cost is higher.

Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.

Abstract: In some embodiments, a semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.

Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.

Abstract: A liquid supply device adapted to a liquid cooling system includes a casing, a cover, a plunger, a driving unit and a sensing unit. The casing has a liquid outlet. The cover is connected to the casing. A chamber is formed between the casing and the cover and contains a cooling liquid. The chamber communicates with the liquid outlet. The plunger is movably disposed in the chamber. The driving unit is disposed in the chamber and used for driving the plunger to move. The sensing unit is selectively disposed on one of the casing and the plunger. The sensing unit senses a liquid level of the cooling liquid and outputs a sensing signal with a predetermined status as the liquid level is equal to or lower than a predetermined height.

Abstract: A plug connector having a firmly fastened protecting element includes a main body, an integrally molded outer shell surrounding the inner shell, and a protecting element. The main body includes a circuit board, a connecting element, a soldering element and an inner shell. The connecting element includes an assembling end, and a function end connected with the assembling end. The assembling end is adjacent to and is connected with one end of the circuit board. The soldering element is connected with the other end of the circuit board. The inner shell is fastened between the connecting element and the soldering element. The inner shell surrounds the circuit board. The protecting element is fastened to one end of the main body adjacent to the assembling end. The protecting element includes a connecting end combined with and is fastened to one end of the outer shell away from the soldering element.

Abstract: A plug connector having a firmly fastened protecting element includes a main body, an integrally molded outer shell surrounding the inner shell, and a protecting element. The main body includes a circuit board, a connecting element, a soldering element and an inner shell. The connecting element includes an assembling end, and a function end connected with the assembling end. The assembling end is adjacent to and is connected with one end of the circuit board. The soldering element is connected with the other end of the circuit board. The inner shell is fastened between the connecting element and the soldering element. The inner shell surrounds the circuit board. The protecting element is fastened to one end of the main body adjacent to the assembling end. The protecting element includes a connecting end combined with and is fastened to one end of the outer shell away from the soldering element.

Abstract: A plug connector includes a main body, a protecting assembly and an outer shell. The main body includes a connecting element for an electrical connection, a circuit board electrically connected with the connecting element, a soldering element fastened to a rear end of the circuit board, and an inner shell surrounding the circuit board. The protecting assembly is fastened to the main body. The protecting assembly includes a combination element surrounding the inner shell, and a protecting element fastened with the combination element. The outer shell surrounds the inner shell. The protecting element is fastened to a junction among the connecting element, the inner shell and the outer shell. The combination element has a first buckling assembly and a second buckling assembly. The first buckling assembly is buckled with the inner shell. The second buckling assembly is buckled with the outer shell.

Abstract: A liquid supply device adapted to a liquid cooling system includes a casing, a cover, a plunger, a driving unit and a sensing unit. The casing has a liquid outlet. The cover is connected to the casing. A chamber is formed between the casing and the cover and contains a cooling liquid. The chamber communicates with the liquid outlet. The plunger is movably disposed in the chamber. The driving unit is disposed in the chamber and used for driving the plunger to move. The sensing unit is selectively disposed on one of the casing and the plunger. The sensing unit senses a liquid level of the cooling liquid and outputs a sensing signal with a predetermined status as the liquid level is equal to or lower than a predetermined height.

Abstract: A micro-power rectifier including a plurality of charge pumps and a method of the micro-power rectifier are provided. The charge pumps respectively include an input capacitor, an output capacitor, a first diode and a second diode. Wherein, at least one of reference voltages of the output capacitors is greater than 0V, and other reference voltages of the output capacitors is/are a ground voltage. Therefore, the efficiency and the output voltage of the rectifier can be increased.

Abstract: An on-chip balun is disclosed. The balun includes a first transmission line, a second transmission line and a coupling transmission line. A terminal of the first transmission line receives a first signal. A terminal of the second transmission line receives a second signal and the other terminal of the second transmission line is coupled to a reference voltage. A terminal of the coupling transmission line receives the reference voltage, and the other terminal is directly connected to the other terminal of the first transmission line. The coupling transmission line and the second transmission line are disposed in parallel for coupling the second signal to generate a coupling signal on the coupling transmission line. The first and second signals are differential signals and the phases of the second signal and the coupling signal are opposite.

Abstract: A planar-like inductor coupling structure includes a first planar inductor embedded in an insulating material layer and a second planar inductor also embedded in the insulating material layer. The first planar inductor and the second planar inductor are substantially at the same height, and have a portion in a horizontal distribution serving as a coupled overlapping region with electric insulation from each other. In addition, the first planar inductor and the second planar inductor may be at different heights.

Abstract: A removal rate estimating method of a chemical mechanical polishing process under mixed products or mixed layers is provided, the estimation at least comprises: providing a pad removal rate of a specific product or layer; providing a removal rate adjustment; and summing up the pad removal rate of the specific product or layer and the removal rate adjustment as an estimated value of the removal rate of the chemical mechanical polishing process under mixed products or mixed layers. Wherein the value of the removal rate adjustment will be set to zero when the pad is replaced with a new one.

Abstract: Disclosed is a crosslinked PGA that is obtained by crosslinking PGA polymer with a crosslinking reagent to develop a three-dimensional crosslinked PGA structure. The crosslinked PGA has good tissue antiadhesion and biocompatibility.

Abstract: A modular computer assembly includes a peripheral circuit module having a first housing half, a connecting circuit board mounted inside the first housing half, and peripheral interface circuit units mounted on the connecting circuit board. The connecting circuit board has peripheral interface connectors to connect with the peripheral interface circuit units, and a mother board connector mounted thereon. The mother board connector is electrically connected to the peripheral interface connectors. The assembly further has a system circuit module including a second housing half and a mother board mounted inside the second housing half. The mother board has an insert edge insertable into the mother board connector to establish electrical connection with the peripheral circuit module. The second housing half complements with the first housing half to form a computer housing when the system circuit module and the peripheral circuit module are assembled.