Patents by Inventor Ming-Wei Lin

Ming-Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145632
    Abstract: A micro light emitting device includes an epitaxial structure, a conductive layer, and a first insulating layer. The epitaxial structure has a first surface and a second surface opposite to the first surface, and includes a first semiconductor layer, an active layer and a second semiconductor layer that are arranged in such order in a direction from the first surface to the second surface. The conductive layer is formed on a surface of the first semiconductor layer away from the active layer. The first insulating layer is formed on the surface of the first semiconductor layer away from the active layer, and exposes at least a part of the conductive layer.
    Type: Application
    Filed: October 23, 2023
    Publication date: May 2, 2024
    Inventors: Ming-Chun TSENG, Shaohua HUANG, Hongwei WANG, Kang-Wei PENG, Su-Hui LIN, Xiaomeng LI, Chi-Ming TSAI, Chung-Ying CHANG
  • Publication number: 20240131538
    Abstract: An annular airflow regulating apparatus includes a cup-shaped element and an adjustment element. The cup-shaped element has a bowl and a bottom, integrated to form a first chamber. The bottom has a tapered channel parallel to an axis and penetrating through the bottom. A ring-shaped groove is disposed between the tapered channel and the bottom. The ring-shaped groove has an annular plane perpendicular to the axis. The adjustment element, having a tapered portion and second holes, is movably disposed in the cup-shaped element. The tapered portion protrudes into the tapered channel A tapered annular gap is formed between the tapered portion and the tapered channel. When the adjustment element is moved with respect to the cup-shaped element, a width of the tapered annular gap is varied, and thereupon a flow rate and velocity of the process gas would be varied accordingly.
    Type: Application
    Filed: December 8, 2022
    Publication date: April 25, 2024
    Inventors: CHEN-CHUNG DU, Ming-Jyh Chang, Chang-Yi Chen, Ming-Hau Tsai, Ko-Chieh chao, Yi-Wei Lin
  • Patent number: 11961944
    Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a semiconductor substrate, active devices and transparent conductive patterns. The active devices are formed on the semiconductor substrate. The transparent conductive patterns are formed over the active devices and electrically connected to the active devices. The transparent conductive patterns are made of a metal oxide material. The metal oxide material has a first crystalline phase with a prefer growth plane rich in oxygen vacancy, and has a second crystalline phase with a prefer growth plane poor in oxygen vacancy.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin, Chin-Wei Kang, Chang-Jung Hsueh
  • Patent number: 11961791
    Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo
  • Patent number: 11961796
    Abstract: A package comprises at least one first device die, and a redistribution line (RDL) structure having the at least one first device die bonded thereto. The RDL structure comprises a plurality of dielectric layers, and a plurality of RDLs formed through the plurality of dielectric layers. A trench is defined proximate to axial edges of the RDL structure through each of the plurality of dielectric layers. The trench prevents damage to portions of the RDL structure located axially inwards of the trench.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yueh-Ting Lin, Hua-Wei Tseng, Ming Shih Yeh, Der-Chyang Yeh
  • Patent number: 11953052
    Abstract: A fastener is adapted for assembling a first housing to a second housing. The first housing is provided with a protruding portion and a buckling portion, and the second housing has a first surface, a second surface, and a through hole. The fastener includes a first portion, at least one connecting portion, at least two elastic portions, and a second portion. The first portion movably abuts against the first surface and has a first opening. The connecting portion is accommodated in the through hole. One end of the connecting portion is connected to the first portion. The connecting portion is spaced apart from an inner edge of the second housing by a gap. The two elastic portions inclinedly extend into the first opening. The second portion movably abuts against the second surface and is disposed at the another end of the connecting portion.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: April 9, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Jian-Hua Chen, Po-Tsung Shih, Yu-Wei Lin, Ming-Hua Ho, Chih-Hao Wu
  • Patent number: 11952237
    Abstract: A pneumatic transmission device includes a transmitting channel, an air inlet and an air supply device. The transmitting channel includes a first feeding path, a second feeding path, and a compressing path communicated between the first feeding path and the second feeding path. The compressing path is gradually inclined downward and rearward from a front end of the compressing path to a rear end of the compressing path. The second feeding path is equipped with a scanning unit. The air inlet is slantwise extended upward and frontward from a top wall of the transmitting channel. An inside of the air inlet defines a passageway. The passageway is connected with the second feeding path. The air supply device is connected to the passageway. The air supply device injects high pressure air into the passageway.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: April 9, 2024
    Assignee: Foxlink Image Technology Co., Ltd.
    Inventor: Ming Wei Lin
  • Publication number: 20240113112
    Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: April 4, 2024
    Inventors: Ryan Chia-Jen Chen, Cheng-Chung Chang, Shao-Hua Hsu, Yu-Hsien Lin, Ming-Ching Chang, Li-Wei Yin, Tzu-Wen Pan, Yi-Chun Chen
  • Publication number: 20240105818
    Abstract: A semiconductor device includes a gate electrode over a channel region of a semiconductor fin, first spacers over the semiconductor fin, and second spacers over the semiconductor fin. A lower portion of the gate electrode is between the first spacers. An upper portion of the gate electrode is above the first spacers. The second spacers are adjacent the first spacers opposite the gate electrode. The upper portion of the gate electrode is between the second spacers.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 28, 2024
    Inventors: Jian-Jou Lian, Chun-Neng Lin, Ming-Hsi Yeh, Chieh-Wei Chen, Tzu-Ang Chiang
  • Patent number: 11942445
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-En Yen, Chin-Wei Kang, Kai-Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng, Mirng-Ji Lii
  • Patent number: 11935804
    Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
  • Patent number: 11936418
    Abstract: A radar signal processing system with a self-interference cancelling function includes an analog front end (AFE) processor, an analog to digital converter (ADC), an adaptive interference canceller (AIC), and a digital to analog converter (DAC). The AFE processor receives an original input signal and generates an analog input signal. The ADC converts the analog input signal to a digital input signal. The AIC generates a digital interference signal digital interference signal by performing an adaptive interference cancellation process according to the digital input signal. The DAC converts the digital interference signal to an analog interference signal. Finally, the analog interference signal is fed back to the AFE and cancelled from the original input signal in the AFE processor while performing the front end process, reducing the interference of the static interference from the leaking of a close-by transmitter during the front end process.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: March 19, 2024
    Assignee: KAIKUTEK INC.
    Inventors: Mike Chun-Hung Wang, Chun-Hsuan Kuo, Mohammad Athar Khalil, Wen-Sheng Cheng, Chen-Lun Lin, Chin-Wei Kuo, Ming Wei Kung, Khoi Duc Le
  • Publication number: 20240083742
    Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li YANG, Kai-Di WU, Ming-Da CHENG, Wen-Hsiung LU, Cheng Jen LIN, Chin Wei KANG
  • Publication number: 20240069618
    Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.
    Type: Application
    Filed: April 27, 2023
    Publication date: February 29, 2024
    Inventors: Wen Che CHUNG, Hui Chuan LO, Hao-Hsuan LIN, Chun TSAO, Jun-Fu CHEN, Ming-Hung YAO, Jia-Wei ZHANG, Kuan-Lun CHEN, Ting-Chao LIN, Cheng-Yen LIN, Chunyen LAI
  • Publication number: 20240036455
    Abstract: An automatic document feeder includes a horizontal feeding path, a curve feeding path, a scanning unit arranged in the horizontal feeding path, a motor, a movable document guider, an actuator, a feeding roller arranged in the horizontal feeding path, and a transmission structure. One end of the curve feeding path is connected with a common document inlet, the other end of the curve feeding path is connected with a middle of the horizontal feeding path. A gentle bending corner is formed at a junction area between the curve feeding path and the horizontal feeding path. The motor outputs a forward torque or a converse torque. The movable document guider is rotatably positioned near the gentle bending corner. The actuator is rotatably positioned near the gentle bending corner. The transmission structure is connected among the motor, the feeding roller and the actuator.
    Type: Application
    Filed: May 23, 2023
    Publication date: February 1, 2024
    Inventors: Ming Wei Lin, Wen Ching Liao, Wei Pin Hsieh
  • Patent number: 11767695
    Abstract: A resistance hinge includes a first hinge bracket, a fixing shaft fastened in the first hinge bracket, a locating holder surrounding the fixing shaft, a friction part, a second hinge bracket and a transmission module. The friction part is formed in a hollow cylinder shape and surrounds the locating holder together with the fixing shaft. The second hinge bracket is pivotally mounted on the first hinge bracket. The transmission module is connected between the friction part and the second hinge bracket.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: September 26, 2023
    Assignee: Foxlink Image Technology Co., Ltd.
    Inventor: Ming Wei Lin
  • Patent number: 11603274
    Abstract: A paper feeding mechanism includes a feeding path, a driving motor, a bidirectional transmission mechanism, at least one feeding roller, a unidirectional transmission mechanism and at least one blocking roller. The driving motor is controllable to output a driving force towards a forward direction or a driving force towards a reverse direction. The bidirectional transmission mechanism is connected to the driving motor. The at least one feeding roller is mounted in the feeding path. The at least one feeding roller is connected to the bidirectional transmission mechanism. The unidirectional transmission mechanism is connected to the driving motor. The at least one blocking roller is mounted in the feeding path. The at least one blocking roller is disposed to a downstream of the at least one feeding roller. The at least one blocking roller is connected to the unidirectional transmission mechanism.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: March 14, 2023
    Assignee: Foxlink Image Technology Co., Ltd.
    Inventor: Ming Wei Lin
  • Patent number: 11590174
    Abstract: Disclosed herein is a method for treating an osteoarthritis in a subject in need thereof. The method mainly includes administering to the subject an effective amount of isolated mitochondria. According to some embodiments of the present disclosure, the isolated mitochondria are administered to the subject in need in the amount of about 1 mg/kg to about 100 mg/kg.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: February 28, 2023
    Assignee: E-DA CANCER HOSPITAL
    Inventors: Ming-Wei Lin, Hsin-Yi Tsai, I-Ming Jou, Chin-Hsien Wu
  • Publication number: 20230009351
    Abstract: A resistance hinge includes a first hinge bracket, a fixing shaft fastened in the first hinge bracket, a locating holder surrounding the fixing shaft, a friction part, a second hinge bracket and a transmission module. The friction part is formed in a hollow cylinder shape and surrounds the locating holder together with the fixing shaft. The second hinge bracket is pivotally mounted on the first hinge bracket. The transmission module is connected between the friction part and the second hinge bracket.
    Type: Application
    Filed: April 11, 2022
    Publication date: January 12, 2023
    Inventor: Ming Wei Lin
  • Publication number: 20220340381
    Abstract: A paper feeding mechanism includes a feeding path, a driving motor, a bidirectional transmission mechanism, at least one feeding roller, a unidirectional transmission mechanism and at least one blocking roller. The driving motor is controllable to output a driving force towards a forward direction or a driving force towards a reverse direction. The bidirectional transmission mechanism is connected to the driving motor. The at least one feeding roller is mounted in the feeding path. The at least one feeding roller is connected to the bidirectional transmission mechanism. The unidirectional transmission mechanism is connected to the driving motor. The at least one blocking roller is mounted in the feeding path. The at least one blocking roller is disposed to a downstream of the at least one feeding roller. The at least one blocking roller is connected to the unidirectional transmission mechanism.
    Type: Application
    Filed: January 3, 2022
    Publication date: October 27, 2022
    Inventor: Ming Wei Lin