Abstract: Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.

Abstract: In an embodiment, a method of forming a semiconductor device includes forming a dummy gate stack over a substrate; forming a first spacer layer over the dummy gate stack; oxidizing a surface of the first spacer layer to form a sacrificial liner; forming one or more second spacer layers over the sacrificial liner; forming a third spacer layer over the one or more second spacer layers; forming an inter-layer dielectric (ILD) layer over the third spacer layer; etching at least a portion of the one or more second spacer layers to form an air gap, the air gap being interposed between the third spacer layer and the first spacer layer; and forming a refill layer to fill an upper portion of the air gap.

Abstract: The present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In some embodiments, a structure includes a first dielectric layer over a substrate, a first conductive feature through the first dielectric layer, the first conductive feature comprising a first metal, a second dielectric layer over the first dielectric layer, and a second conductive feature through the second dielectric layer having a lower convex surface extending into the first conductive feature, wherein the lower convex surface of the second conductive feature has a tip end extending laterally under a bottom boundary of the second dielectric layer.

Abstract: A barrier layer is formed in a portion of a thickness of sidewalls in a recess prior to formation of an interconnect structure in the recess. The barrier layer is formed in the portion of the thickness of the sidewalls by a plasma-based deposition operation, in which a precursor reacts with a silicon-rich surface to form the barrier layer. The barrier layer is formed in the portion of the thickness of the sidewalls in that the precursor consumes a portion of the silicon-rich surface of the sidewalls as a result of the plasma treatment. This enables the barrier layer to be formed in a manner in which the cross-sectional width reduction in the recess from the barrier layer is minimized while enabling the barrier layer to be used to promote adhesion in the recess.

Abstract: A physical vapor deposition (PVD) system is provided. The PVD system includes a PVD chamber defining a PVD volume within which a target material of a target is deposited onto a wafer. The PVD system includes the target in the PVD chamber. The target is configured to overlie the wafer. An edge of the target extends from a first surface of the target to a second surface of the target, opposite the first surface of the target. A first portion of the edge of the target has a first surface roughness. The first portion of the edge of the target extends at most about 6 millimeters from the first surface of the target to a second portion of the edge of the target. The second portion of the edge of the target has a second surface roughness less than the first surface roughness.

Abstract: An assembly for securing an electrical component to a server is disclosed. The assembly includes a structural case configured to receive and secure in place an electrical component for the server; a pair of rail holders mounted to the structural case, each rail holder of the pair of rail holders having a plurality of mounting holes that includes a first hole and a second hole; and a pair of latches, each latch of the pair of latches being movably mounted to a respective one of the pair of rail holders, each latch having a finger end that is coupled to a hook end via a bridge portion. The finger end and the hook end are inserted, respectively, into the first hole and the second hole of the respective one of the pair of rail holder, and independently and flexibly move relative to the bridge portion in response to applied pressure.

Abstract: An eye-bolt assembly includes an eye bolt and a base portion. The eye bolt includes a ring portion, a stem portion, and at least one winged extension. The ring portion is attached a first end of the stem portion. The at least one winged extension is attached to a second end of the stem portion. The base portion receives and securely locks the eye bolt therein. The base portion includes a collar and a platform secured to the collar. The collar forms a first aperture therein. The platform forms a second aperture therein. The platform includes a spring being located at least partially within the second aperture. A first end of the spring is attached to the platform. The second aperture formed in the platform is in spaced communication with the first aperture formed in the collar.

Abstract: In an embodiment, a method of forming a semiconductor device includes forming a dummy gate stack over a substrate; forming a first spacer layer over the dummy gate stack; oxidizing a surface of the first spacer layer to form a sacrificial liner; forming one or more second spacer layers over the sacrificial liner; forming a third spacer layer over the one or more second spacer layers; forming an inter-layer dielectric (ILD) layer over the third spacer layer; etching at least a portion of the one or more second spacer layers to form an air gap, the air gap being interposed between the third spacer layer and the first spacer layer; and forming a refill layer to fill an upper portion of the air gap.

Abstract: Cable release devices and methods are disclosed. The device includes a frame defining an aperture. The frame is sized to fit around a connector on a printed circuit board (PCB) within a computer system with the connector extending into the aperture. The device further includes a post extending from the frame. The device further includes a lever connected to the post. The lever includes a first end positioned such that the first end aligns with a latch of a cable when the cable is connected to the connector and when the frame is around the connector such that actuation of the lever causes the lever to depress the latch. The actuation causes the release of the cable from being retained by the connector.

Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.

Abstract: A semiconductor device includes a semiconductor fin. The semiconductor device includes a metal gate disposed over the semiconductor fin. The semiconductor device includes a gate dielectric layer disposed between the semiconductor fin and the metal gate. The semiconductor device includes first spacers sandwiching the metal gate. The first spacers have a first top surface and the gate dielectric layer has a second top surface, and the first top surface and a first portion of the second top surface are coplanar with each other. The semiconductor device includes second spacers further sandwiching the first spacers. The second spacers have a third top surface above the first top surface and the second top surface. The semiconductor device includes a gate electrode disposed over the metal gate.

Abstract: A method of forming a gas spacer in a semiconductor device and a semiconductor device including the same are disclosed. In accordance with an embodiment, a method includes forming a gate stack over a substrate; forming a first gate spacer on sidewalls of the gate stack; forming a second gate spacer on sidewalls of the first gate spacer; removing the second gate spacer using an etching process to form a first opening, the etching process being performed at a temperature less than 0° C., the etching process using an etching solution including hydrogen fluoride; and depositing a dielectric layer over the first gate spacer and the gate stack, the dielectric layer sealing a gas spacer in the first opening.

Abstract: A package structure includes a plurality of first dies, and a plurality of second dies. The plurality of first dies is on first regions of a semiconductor substrate. The plurality of second dies are electrically bonded to the plurality of first dies. The plurality of second dies covers second regions of the semiconductor substrate between the first regions of the semiconductor substrate. The first portion of top surfaces of the plurality of first dies are covered by the plurality of second dies, and the second portions of the top surfaces of the plurality of first dies are exposed by the plurality of second dies.

Abstract: An adjustable bracket for enclosing an open frame power supply unit (PSU) is disclosed. The adjustable bracket includes a first bracket section having a first primary plate and a first secondary plate extending generally vertically from one end of the first primary plate; and a second bracket section having a second primary plate and a second secondary plate extending generally vertically from one end of the second primary plate, the first secondary plate and the second secondary plate being generally parallel such that the first secondary plate faces the second secondary plate. The second primary plate is movably coupled to the first primary plate such that the adjustable bracket can be in a compact, intermediately extended, or fully extended configuration by adjusting the bracket according to a width of the open frame PSU, the width being different for a first open frame PSU than for a second open frame PSU.

Abstract: An image processing circuit performs super-resolution (SR) operations. The image processing circuit includes memory to store multiple parameter sets of multiple artificial intelligence (AI) models. The image processing circuit further includes an image guidance module, a parameter decision module, and an SR engine. The image guidance module operates to detect a representative feature in an image sequence including a current frame and past frames within a time window. The parameter decision module operates to adjust parameters of one or more AI models based on a measurement of the representative feature. The SR engine operates to process the current frame using the one or more AI models with the adjusted parameters to thereby generate a high-resolution image for display.

Abstract: A molding method of a support rod that first passing a plurality of long fibers through a resin bath for impregnating with resin, then passing the plurality of long fibers impregnated with resin through a bundling hole of a position-constrained vertical plate on a machine to preliminarily form a bundle end; providing a coating layer on the machine, one end of the coating layer obliquely passes through a guiding portion on the position-constrained vertical plate to downwardly contact the bundle end; then placing the one end of the coating layer and the bundle end into a mold cavity of a mold at the same time to form a long rod body; and then cutting the long rod body into multi-segment support rods through a cutting process.

Abstract: A sheltering mechanism applied to a surveillance camera and includes a sheltering component and a resilient component. The casing includes an opening. The sheltering component is slidably disposed on a casing to shelter an opening formed on the casing. The opening is surrounded by the resilient component. The resilient component includes a base portion, a bridging portion and a contacting portion. The base is fixed to the casing. The bridging component is connected to the base portion and stretches outwardly from the base portion. The contacting portion is disposed on an end of the bridging portion opposite to the base portion. The bridging portion pushes the contacting portion to contact against the sheltering component for sealing a gap between the casing and the sheltering component.

Abstract: An automatic feeding device includes an accommodating container, a transmission channel, a valve unit, a sensor and an ejection unit. The transmission channel is disposed on bottom of the accommodating container. The transmission channel has an inlet portion, a central portion and an outlet portion. The central portion is between the inlet portion and the outlet portion. The valve unit is disposed on the bottom of the accommodating container and adjacent to the inlet portion. The valve unit is switchable to allow feed inside the accommodating container for passing the inlet portion and entering the transmission channel. The sensor is disposed on the inlet portion and detects whether the feed passes the inlet portion, and further outputs a control command to switch modes of the valve unit. The ejection unit is disposed on the central portion and used to push the feed inside the transmission channel toward the outlet portion.

Abstract: A camera supporting device includes a supporting frame, an outer casing, a camera holding structure, and a linkage mechanism. The outer casing is rotatably connected to the supporting frame. The camera holding structure is rotatably connected to the supporting frame independently of the outer casing. The linkage mechanism incudes a driving part and a driven part kinematically connected to the driving part. The driving part is fixedly connected to the camera holding structure. The driven part is fixedly connected to the outer casing. An image-capturing device can be fixed on the camera holding structure. Through the camera holding structure driving the outer casing through the linkage mechanism, the outer casing can provide a wider angle range available for the image-capturing device to capturing exterior images.

Abstract: An automatic feeding device includes an accommodating container, a transmission channel, a valve unit, a sensor and an ejection unit. The transmission channel is disposed on bottom of the accommodating container. The transmission channel has an inlet portion, a central portion and an outlet portion. The central portion is between the inlet portion and the outlet portion. The valve unit is disposed on the bottom of the accommodating container and adjacent to the inlet portion. The valve unit is switchable to allow feed inside the accommodating container for passing the inlet portion and entering the transmission channel. The sensor is disposed on the inlet portion and detects whether the feed passes the inlet portion, and further outputs a control command to switch modes of the valve unit. The ejection unit is disposed on the central portion and used to push the feed inside the transmission channel toward the outlet portion.