Abstract: Semiconductor devices and methods which utilize a treatment process of a bottom anti-reflective layer are provided. The treatment process may be a physical treatment process in which material is added in order to fill holes and pores within the material of the bottom anti-reflective layer or else the treatment process may be a chemical treatment process in which a chemical reaction is used to form a protective layer. By treating the bottom anti-reflective layer the diffusion of subsequently applied chemicals is reduced or eliminated, thereby helping to prevent defects that arise from such diffusion.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A shock absorbing and pressure releasing damper apparatus for footwear includes: an upper board having upper mounting portions on a bottom thereof; a lower board arranged at the bottom of the upper board and having lower mounting portions corresponding to the upper mounting portions of the upper board on a top thereof; a middle cushion member disposed between the upper and lower board and including slits; elastic members arranged between the upper mounting portions and the lower mounting portions; magnetic members arranged inside the upper and lower mounting portions of the upper and lower boards and at centers of the elastic members.

Abstract: A shock absorbing and pressure releasing damper apparatus for a shoe insole, wherein the damper apparatus comprises: an upper board having a plurality of upper mounting portions on a bottom thereof; a lower board arranged at the bottom of the upper board and having a plurality of lower mounting portions corresponding to the upper mounting portions of the upper board on a top thereof; a plurality of elastic members arranged between the upper mounting portions of the upper board and the lower mounting portions of the lower board; a plurality of magnets arranged inside the upper and lower mounting portions of the upper and lower boards and at centers of the elastic members; wherein the damper apparatus further includes a shoe body having an insole portion with a concave portion; a pad is provided on a top of the damper apparatus. Accordingly, the damper apparatus rises and lowers as appropriate.