Patents by Inventor Ming-Wen Hsu

Ming-Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9370221
    Abstract: A shock absorbing and pressure releasing damper apparatus for footwear includes: an upper board having upper mounting portions on a bottom thereof; a lower board arranged at the bottom of the upper board and having lower mounting portions corresponding to the upper mounting portions of the upper board on a top thereof; a middle cushion member disposed between the upper and lower board and including slits; elastic members arranged between the upper mounting portions and the lower mounting portions; magnetic members arranged inside the upper and lower mounting portions of the upper and lower boards and at centers of the elastic members.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: June 21, 2016
    Inventors: Ming-Wen Hsu, Chun-Hao Hsu, Wei-Lun Hsu
  • Publication number: 20150157091
    Abstract: A shock absorbing and pressure releasing damper apparatus for a shoe insole, wherein the damper apparatus comprises: an upper board having a plurality of upper mounting portions on a bottom thereof; a lower board arranged at the bottom of the upper board and having a plurality of lower mounting portions corresponding to the upper mounting portions of the upper board on a top thereof; a plurality of elastic members arranged between the upper mounting portions of the upper board and the lower mounting portions of the lower board; a plurality of magnets arranged inside the upper and lower mounting portions of the upper and lower boards and at centers of the elastic members; wherein the damper apparatus further includes a shoe body having an insole portion with a concave portion; a pad is provided on a top of the damper apparatus. Accordingly, the damper apparatus rises and lowers as appropriate.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 11, 2015
    Inventor: Ming-Wen Hsu