Patents by Inventor Ming-Wen Liao

Ming-Wen Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device packages
    Patent number: 10373916
    Abstract: A semiconductor device package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body, where the EMI shield has a side portion defining an opening.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: August 6, 2019
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Ji-Min Lin, Ming-Wen Liao, Chun-Ying Huang
  • SEMICONDUCTOR DEVICE PACKAGES
    Publication number: 20180033736
    Abstract: A semiconductor device package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body, where the EMI shield has a side portion defining an opening.
    Type: Application
    Filed: July 28, 2016
    Publication date: February 1, 2018
    Inventors: Ji-Min LIN, Ming-Wen Liao, Chun-Ying Huang