Patents by Inventor Ming X. Chan

Ming X. Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatuses and methods for high speed bonding
    Patent number: 7576656
    Abstract: Apparatuses and methods for high speed bonding for an RFID device are provided. A first substrate includes an antenna and is coupled to a strap assembly by an adhesive material. The adhesive material is substantially inert thermally for a predetermined temperature range, or it otherwise lacks a heat flow variation greater than 0.05 W/g for the predetermined temperature range. Such an adhesive material provides a reliable bond. In a specific embodiment, the predetermined temperature range is about 30° Celsius to about 85° Celsius. In an alternative embodiment, the adhesive material can be exposed to water or steam to reduce its heat flow variation to less than 0.05 W/g for the temperature range.
    Type: Grant
    Filed: September 14, 2006
    Date of Patent: August 18, 2009
    Assignee: Alien Technology Corporation
    Inventors: Gordon S. W. Craig, Susan Swindlehurst, Randolph W. Eisenhardt, Ming X. Chan
  • Apparatus for forming an electronic assembly
    Patent number: 7080444
    Abstract: An apparatus for dispensing blocks in a fluid over a substrate. The apparatus includes a first tube having a first end and a second end. A compression device is coupled to the first tube. A second tube is connected to the first tube to deliver a slurry having blocks to the first tube. The compression device pulsates at least one block in the slurry which is flowing through a portion of the first tube.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: July 25, 2006
    Assignee: Alien Technology Corporation
    Inventors: Gordon S. W. Craig, Ming X. Chan, Cornelius V. Sutu, Omar R. Alvarado, Hoang Pham, Mark Alfred Hadley