Patents by Inventor Ming-Yang Hsiao

Ming-Yang Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10794393
    Abstract: An impeller includes a hub and a plurality of blade plates. The hub includes a hub body and a plurality of installation portions disposed on the hub body. Each blade plate includes a plurality of fan blades and a folding portion. The folding portion is connected to one end of each fan blade. The folding portions are respectively installed at the installation portions.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: October 6, 2020
    Assignee: Pegatron Corporation
    Inventors: Chao-Kai Huang, Tzu-Ming Yang, Yu- Hao Chiu, Ming-Yang Hsiao
  • Publication number: 20190162201
    Abstract: An impeller includes a hub and a plurality of blade plates. The hub includes a hub body and a plurality of installation portions disposed on the hub body. Each blade plate includes a plurality of fan blades and a folding portion. The folding portion is connected to one end of each fan blade. The folding portions are respectively installed at the installation portions.
    Type: Application
    Filed: September 19, 2018
    Publication date: May 30, 2019
    Inventors: Chao-Kai Huang, Tzu-Ming Yang, Yu- Hao Chiu, Ming-Yang Hsiao
  • Publication number: 20090151901
    Abstract: A fin is penetrated through by a heat pipe. The fin includes a fin body and a plurality of positioning protrusions. The fin body has an accommodating hole penetrated by the heat pipe. The positioning protrusions are formed at the circumference of the accommodating hole for holding against the heat pipe, so that a gap is provided between the heat pipe and the circumference of the accommodating hole.
    Type: Application
    Filed: September 23, 2008
    Publication date: June 18, 2009
    Applicant: ASUSTEK COMPUTER INC.
    Inventor: Ming-Yang Hsiao
  • Publication number: 20090014160
    Abstract: A heat dissipation module including a fan and a first heat dissipation unit is provided. The fan has a frame and a blade set provided in the frame. The frame has an air inlet and an air outlet, and a flow channel communicating the air inlet and the air outlet is formed between the blade set and the frame. The first heat dissipation unit includes a first heat dissipation base, a first radiating fin assembly located inside the frame wall of the fan on the flow channel, and a first heat pipe which is connected between the first heat dissipation base and the first radiating fin assembly.
    Type: Application
    Filed: April 30, 2008
    Publication date: January 15, 2009
    Applicant: ASUSTEK COMPUTER INC.
    Inventor: Ming-Yang Hsiao
  • Publication number: 20080030949
    Abstract: A fluid-providing module including a housing and a fan is provided. The housing includes a first inlet and a space connected to the first inlet. The space includes a first channel and a second channel such that one is stacked on top of the other. The first channel includes a first outlet and the second channel includes a second outlet. The fan is disposed in the space for moving the fluid and discharging the fluid from the housing through the first outlet and the second outlet. Consequently, the fluid-providing module can discharge the fluid in multiple directions. In addition, an electronic device using the fluid-providing module is also provided.
    Type: Application
    Filed: July 31, 2007
    Publication date: February 7, 2008
    Applicant: ASUSTEK COMPUTER INC.
    Inventor: Ming-Yang Hsiao
  • Patent number: 6565428
    Abstract: A duct flow-type fan comprised of a housing having at least one upper and one lower side walls as well as a laterally oriented air port, a motor, a vane, and a shaft. The vane is fitted onto one end of the shaft, with the other end of the shaft conjoined to and driven by the motor such that vane air current passes through the laterally oriented air port of the housing to cool the heat sink of a computer chip in order to achieve efficient computer chip heat dissipation.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: May 20, 2003
    Assignee: ElanVital Corporation
    Inventor: Ming-Yang Hsiao
  • Publication number: 20020098792
    Abstract: A duct flow-type fan comprised of a housing having at least one upper and one lower side walls as well as a laterally oriented air port, a motor, a vane, and a shaft. The vane is fitted onto one end of the shaft, with the other end of the shaft conjoined to and driven by the motor such that vane air current passes through the laterally oriented air port of the housing to cool the heat sink of a computer chip in order to achieve efficient computer chip heat dissipation.
    Type: Application
    Filed: July 30, 2001
    Publication date: July 25, 2002
    Inventor: Ming-Yang Hsiao