Abstract: A heat sink clip is provided for clipping a memory module. The heat sink clip is made from a flexible heat-conductive metal plate formed by bending, and includes a top plate and two side plates facing opposite. Each side plate has a top portion, an inwardly inclined portion and a lead. The top portions of the two side plates extend from two opposite side edges of the top plate, respectively, and incline inwardly. The inwardly inclined portions of the two side plates extend from bottoms of the two top portions, respectively, and continue to incline inwardly. The leads of the two side plates extend from bottoms of the two inwardly inclined portions, respectively, and incline outwardly.

Abstract: A memory module includes a plurality of memory cards and a heat dissipating apparatus. The heat dissipating apparatus is a continuously-bending metal sheet. The heat dissipating apparatus includes a plurality of thermal conductive portions arranged in a row and a plurality of connecting sheets locating in between the thermal conductive portions respectively and configured to connect with the two adjacent thermal conductive portions. Each of the thermal conductive portions includes a top plate, a front side plate, and a rear side plate, the front and rear side plates extend from two opposite sides of the top plate respectively. The front and rear side plates of each of the thermal conductive portions are configured to snugly clip to one of the memory cards and are in contact with heat sources on two opposite sides of the corresponding memory card.

Abstract: A ring-shaped heat dissipating device made of a continuously-bending metal sheet includes a plurality of fins arranged in a radial form to form a central passage communicating from theretop to therebottom. Each of fins has a top plate, a front side plate and a rear side plate extending downwardly from opposite edges of the top plate respectively, and a bottom plate extending from a bottom edge of the rear side plate. The front side plate of one of fins connects with the bottom plate of another fin adjacent thereto. An inner edge of the top plate of one of fins adjacent to the central passage is connected with another two inner edges of two top plate plates of two fins adjacent thereto. And an inner edge of the bottom plate is connected with another two inner edges of two bottom plates of two fins adjacent thereto.

Abstract: A heat sink clip is provided for clipping a memory module. The heat sink clip is made from a flexible heat-conductive metal plate formed by bending, and includes a top plate and two side plates facing opposite. Each side plate has a top portion, an inwardly inclined portion and a lead. The top portions of the two side plates extend from two opposite side edges of the top plate, respectively, and incline inwardly. The inwardly inclined portions of the two side plates extend from bottoms of the two top portions, respectively, and continue to incline inwardly. The leads of the two side plates extend from bottoms of the two inwardly inclined portions, respectively, and incline outwardly.

Abstract: A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly cling to the respective heat source.

Abstract: A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly clip to the respective heat source.

Abstract: A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly clip to the respective heat source.

Abstract: A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly clip to the respective heat source.

Abstract: A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly clip to the respective heat source.