Abstract: The present disclosure provides a sensing circuit, including a photo-sensing component, a first transistor, and a temperature-sensing component. The photo-sensing component is configured to receive a light and transmit a first current according to an intensity of the light. A gate terminal of the first transistor is configured to receive a first control circuit. The photo-sensing component and the first transistor are coupled in series between first and second nodes. The temperature-sensing component is coupled between the first and second nodes and is configured to generate a second current according to a temperature. The temperature-sensing component includes a channel structure, a first gate, a second gate, and a light-shielding structure. The channel structure is configured to transmit the second current.

Abstract: The present disclosure provides a sensing circuit, including a photo-sensing component, a first transistor, and a temperature-sensing component. The photo-sensing component is configured to receive a light and transmit a first current according to an intensity of the light. A gate terminal of the first transistor is configured to receive a first control circuit. The photo-sensing component and the first transistor are coupled in series between first and second nodes. The temperature-sensing component is coupled between the first and second nodes and is configured to generate a second current according to a temperature. The temperature-sensing component includes a channel structure, a first gate, a second gate, and a light-shielding structure. The channel structure is configured to transmit the second current.

Abstract: The present disclosure provides a chemical mechanical polishing device including a retaining ring and a wafer carrier and a polishing method. The retaining ring is configured on a polishing pad and includes an inner sidewall defining an opening and an outer sidewall opposite to the inner sidewall. The wafer carrier is configured on the polishing pad and is capable of placing a wafer disposed thereon into the opening and facing the polishing pad. The retaining ring has a notch at the corner adjacent to the wafer and the polishing pad.

Abstract: A semiconductor device includes a substrate. The semiconductor device includes a fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate structure that straddles the fin and extends along a second direction perpendicular to the first direction. The semiconductor device includes a first source/drain structure coupled to a first end of the fin along the first direction. The gate structure includes a first portion protruding toward the first source/drain structure along the first direction. A tip edge of the first protruded portion is vertically above a bottom surface of the gate structure.

Abstract: A package includes an optical sensor die. The optical sensor die has an optically active surface area (OASA) disposed on a front side of a substrate. A glass cover is disposed above the OASA and attached to the front side the substrate by a dam material. A through-substrate via (TSV) extends from an opening at a back side of the substrate toward a front side of the substrate. The TSV has a stepped bottom surface at the front side of the substrate. The TSV provides access for electrical connections between the back side of the substrate and the front side of the substrate.

Abstract: A semiconductor die includes a semiconductor device fabricated in a substrate. The substrate has a front side, a back side, and an inclined sidewall extending from the back side to the front side. A contact pad is connected to the semiconductor device. The contact pad is embedded in an inter dielectric layer (IDL) disposed in the front side. The contact pad has a contact pad edge with a surface aligned along the inclined sidewall. A redistribution layer (RDL) is disposed on the inclined sidewall. The RDL is physically and electrically connected to the contact pad directly through the surface of the contact pad edge aligned along the inclined sidewall.

Abstract: A light shielding element substrate includes a substrate, a transparent island structure and a first light shielding layer. The transparent island structure is located on the substrate. The first light shielding layer is located on the transparent island structure. The first light shielding layer is overlapping with a part of the top surface of the transparent island structure. The first light shielding layer has a first through hole overlapping the top surface of the transparent island structure.

Abstract: An auxiliary operation structure (1) for an endoscope, comprising: a control module (10), a human-machine interface module (30) and a clamping module (12). A plurality of pressing units (P1, P2, P3, P4, P5, P6), a plurality of dial driving units (D1, D2) and a plurality of knob driving units (S1, S2) of the control module (10) are connected to a plurality of control units on an operation module (21) of an endoscope (2) of the control module (10). With the auxiliary operation structure (1) for the endoscope (2), a physician can control a joystick (15) via the hands to perform manipulation, such that the operation module (21) of the endoscope (2) can be controlled and operated easily to perform an invasive examination or a minimally invasive operation by means of the endoscope (2).

Abstract: A light shielding element substrate includes a substrate, a transparent island structure and a first light shielding layer. The transparent island structure is located on the substrate. The first light shielding layer is located on the transparent island structure. The first light shielding layer is overlapping with a part of the top surface of the transparent island structure. The first light shielding layer has a first through hole overlapping the top surface of the transparent island structure.

Abstract: A display device adapted to perform in-screen fingerprint identification is provided. The display device includes a plurality of sub-pixel circuits, a plurality of light sensing circuit stages, and a plurality of sensing drive lines. The light sensing circuit stages correspond to the sub-pixel circuits. The sensing drive lines drive the light sensing circuit stages sequentially. In a first time interval, a first sensing drive line among the sensing drive lines provides a first sensing drive signal to a qth light sensing circuit stage and a latter light sensing circuit stage among the light sensing circuit stages. In the first time interval, the qth light sensing circuit stage performs a light sensing reset operation according to the first sensing drive signal, and the latter light sensing circuit stage performs a light sensing write operation according to the first sensing drive signal.

Abstract: A display apparatus includes a first substrate, a plurality of pixel structures disposed on the first substrate, a light sensor disposed on the first substrate, an insulation layer disposed on the light sensor, a first light shielding pattern, a second substrate disposed opposite to the first substrate, a second light shielding pattern, and a display medium. Each pixel structure includes an active device and a pixel electrode electrically connected to the active device. The first light shielding pattern is disposed on the insulation layer and located above the light sensor. The second light shielding pattern is disposed on the second substrate and has an opening. The opening of the second light shielding pattern and the first light shielding pattern define at least one slit, and the at least one slit and the light sensor are partially overlapped. The display medium is disposed between the first substrate and the second substrate.

Abstract: A sensing device substrate includes a substrate and a sensing device. The sensing device is disposed on the substrate and includes a first electrode, a second electrode, a sensing layer, a conductive layer, and a first insulating layer. The first electrode is located on the substrate. The second electrode is overlapped with the first electrode. The sensing layer is located between the second electrode and the first electrode. The conductive layer is overlapped with the second electrode and electrically connected to the first electrode. The conductive layer has a first opening, and the first opening is overlapped with the sensing layer. The first insulating layer is located between the conductive layer and the second electrode. A display apparatus including the sensing device substrate is also provided.

Abstract: A display device adapted to perform in-screen fingerprint identification is provided. The display device includes a plurality of sub-pixel circuits, a plurality of light sensing circuit stages, and a plurality of sensing drive lines. The light sensing circuit stages correspond to the sub-pixel circuits. The sensing drive lines drive the light sensing circuit stages sequentially. In a first time interval, a first sensing drive line among the sensing drive lines provides a first sensing drive signal to a qth light sensing circuit stage and a latter light sensing circuit stage among the light sensing circuit stages. In the first time interval, the qth light sensing circuit stage performs a light sensing reset operation according to the first sensing drive signal, and the latter light sensing circuit stage performs a light sensing write operation according to the first sensing drive signal.

Abstract: A display panel includes a substrate, at least one first transistor, and at least one second transistor. The substrate includes at least one reflective region and at least one transmissible region. The first transistor is configured on the substrate and located on the corresponding reflective region. Each of the first transistors includes a first active layer. The second transistor is configured on the substrate and located on the corresponding transmissible region. Each of the second transistors includes a second active layer. A material of the first active layer is different from a material of the second active layer.

Abstract: An active device substrate and a manufacturing method thereof are provided. The active device substrate includes a substrate, first and second scan lines, a data line, first and second active devices and first and second pixel electrodes. The first active device includes a first semiconductor channel layer, a first gate, a first source and a first drain. The first gate is electrically connected to the first scan line. The first pixel electrode is electrically connected to the first drain. The second active device includes a second semiconductor channel layer, a second gate and a second drain. The first semiconductor channel layer is connected to a source region of the second semiconductor channel layer. The first semiconductor channel layer and the second semiconductor channel layer belong to same layer. The second gate is electrically connected to the second scan line. The second pixel electrode is electrically connected to the second drain.

Abstract: A pixel array substrate including a substrate, a plurality of first signal lines, a plurality of pixel structures, a plurality of second signal lines, a plurality of light sensing units, a plurality of third signal lines, and a plurality of touch units is provided. The first signal lines are arranged on the substrate along a first direction. The pixel structures are disposed between the first signal lines. The second signal lines are arranged on the substrate along the first direction. The light sensing units are disposed between the second signal lines. Any adjacent two of the light sensing units are electrically connected to one of the second signal lines and are symmetrically disposed with respect to the second signal line. The third signal lines and the second signal lines are alternately arranged on the substrate. The touch units are electrically connected to the third signal lines.

Abstract: A pixel array substrate including a substrate, a plurality of display pixels, a plurality of sensing pixels, and a read-out circuit is provided. The substrate includes a first region and a second region. The second region is located between the first region and an edge of the substrate. The display pixels are disposed on the first region and the second region of the substrate. The sensing pixels are disposed on the first region of the substrate. The read-out circuit is electrically connected to the sensing pixels. A portion of the read-out circuit is disposed on the second region of the substrate and the portion of the read-out circuit is located between two display pixels of the display pixels.

Abstract: A pixel array substrate including a substrate, a plurality of first signal lines, a plurality of pixel structures, a plurality of second signal lines, a plurality of light sensing units, a plurality of third signal lines, and a plurality of touch units is provided. The first signal lines are arranged on the substrate along a first direction. The pixel structures are disposed between the first signal lines. The second signal lines are arranged on the substrate along the first direction. The light sensing units are disposed between the second signal lines. Any adjacent two of the light sensing units are electrically connected to one of the second signal lines and are symmetrically disposed with respect to the second signal line. The third signal lines and the second signal lines are alternately arranged on the substrate. The touch units are electrically connected to the third signal lines.

Abstract: A pixel array substrate including a substrate, a plurality of display pixels, a plurality of sensing pixels, and a read-out circuit is provided. The substrate includes a first region and a second region. The second region is located between the first region and an edge of the substrate. The display pixels are disposed on the first region and the second region of the substrate. The sensing pixels are disposed on the first region of the substrate. The read-out circuit is electrically connected to the sensing pixels. A portion of the read-out circuit is disposed on the second region of the substrate and the portion of the read-out circuit is located between two display pixels of the display pixels.

Abstract: A display apparatus includes a first substrate, a plurality of pixel structures disposed on the first substrate, a light sensor disposed on the first substrate, an insulation layer disposed on the light sensor, a first light shielding pattern, a second substrate disposed opposite to the first substrate, a second light shielding pattern, and a display medium. Each pixel structure includes an active device and a pixel electrode electrically connected to the active device. The first light shielding pattern is disposed on the insulation layer and located above the light sensor. The second light shielding pattern is disposed on the second substrate and has an opening. The opening of the second light shielding pattern and the first light shielding pattern define at least one slit, and the at least one slit and the light sensor are partially overlapped. The display medium is disposed between the first substrate and the second substrate.