Abstract: In an embodiment, a method includes: forming a gate dielectric layer on an interface layer; forming a doping layer on the gate dielectric layer, the doping layer including a dipole-inducing element; annealing the doping layer to drive the dipole-inducing element through the gate dielectric layer to a first side of the gate dielectric layer adjacent the interface layer; removing the doping layer; forming a sacrificial layer on the gate dielectric layer, a material of the sacrificial layer reacting with residual dipole-inducing elements at a second side of the gate dielectric layer adjacent the sacrificial layer; removing the sacrificial layer; forming a capping layer on the gate dielectric layer; and forming a gate electrode layer on the capping layer.

Abstract: A package structure including an organic interposer substrate, a semiconductor die, conductive bumps, an underfill, and an insulating encapsulation is provided. The organic interposer substrate includes stacked organic dielectric layers and conductive wirings embedded in the stacked organic dielectric layers. The semiconductor die is disposed over and electrically connected to the conductive wirings of the organic interposer substrate, and the semiconductor die includes chamfered edges. The conductive bumps are disposed between the semiconductor die and the organic interposer substrate, and the semiconductor die is electrically connected to the organic interposer substrate through the conductive bumps. The underfill is disposed between the semiconductor die and the organic interposer substrate, wherein the underfill encapsulates the conductive bumps and is in contact with the chamfered edges of the at least one semiconductor die.

Abstract: A package structure is provided. The package structure includes a redistribution structure and a first semiconductor die over the redistribution structure. The package structure also includes a wall structure laterally surrounding the first semiconductor die and the wall structure includes a plurality of partitions separated from one another. The package structure also includes an underfill material between the wall structure and the first semiconductor die. The package structure also includes a molding compound encapsulating the wall structure and the underfill material.

Abstract: A method of forming an integrated circuit includes forming a patterned mask layer on a material layer, wherein the patterned mask layer has a plurality of first features, and a first distance between adjacent first features of the plurality of first features. The method further includes patterning the material layer to form the first features in the material layer. The method further includes increasing the first distance between adjacent first features of the plurality of first features to a second distance. The method further includes treating portions of the material layer exposed by the patterned mask layer. The method further includes removing the patterned mask layer; and removing non-treated portions of the material layer.

Abstract: In an embodiment, a method includes: forming a gate dielectric layer on an interface layer; forming a doping layer on the gate dielectric layer, the doping layer including a dipole-inducing element; annealing the doping layer to drive the dipole-inducing element through the gate dielectric layer to a first side of the gate dielectric layer adjacent the interface layer; removing the doping layer; forming a sacrificial layer on the gate dielectric layer, a material of the sacrificial layer reacting with residual dipole-inducing elements at a second side of the gate dielectric layer adjacent the sacrificial layer; removing the sacrificial layer; forming a capping layer on the gate dielectric layer; and forming a gate electrode layer on the capping layer.

Abstract: A pixel driving device includes a capacitance, a reset circuit, a compensation circuit, a driving transistor and a first transistor. Reset circuit and compensation circuit are coupled to a first end and a second end of capacitance. First transistor is coupled between second end of driving transistor and second end of capacitance. Reset circuit resets first end of capacitance at a power supply voltage and reset second end of capacitance at a reference voltage according to a first sweep signal respectively. Compensation circuit writes a data voltage into first end of capacitance via driving transistor and second end of capacitance is maintained at reference voltage according to a second sweep signal. First transistor generates a driving voltage difference between first end and second end of capacitance according to a control signal. Driving transistor outputs a current to a luminous element according to driving voltage difference.

Abstract: A method of forming an integrated circuit includes forming a patterned mask layer on a material layer, wherein the patterned mask layer has a plurality of first features, and a first distance between adjacent first features of the plurality of first features. The method further includes patterning the material layer to form the first features in the material layer. The method further includes increasing the first distance between adjacent first features of the plurality of first features to a second distance. The method further includes treating portions of the material layer exposed by the patterned mask layer. The method further includes removing the patterned mask layer; and removing non-treated portions of the material layer.

Abstract: A displaying device adapted to a screen is provided. The displaying device includes a transparent pyramid, a movable support, and an image conversion unit. The movable support is connected to the transparent pyramid to move the transparent pyramid between a first location and a second location which is different from the first location. The first location is the position on the screen. The image conversion unit is configured to receive image data. When the transparent pyramid moves to the first location, the image conversion unit converts the image data to a holographic image displayed on the screen, and the transparent pyramid generates a 3D hologram based on the holographic image.

Abstract: A package structure including an organic interposer substrate, a semiconductor die, conductive bumps, an underfill, and an insulating encapsulation is provided. The organic interposer substrate includes stacked organic dielectric layers and conductive wirings embedded in the stacked organic dielectric layers. The semiconductor die is disposed over and electrically connected to the conductive wirings of the organic interposer substrate, and the semiconductor die includes chamfered edges. The conductive bumps are disposed between the semiconductor die and the organic interposer substrate, and the semiconductor die is electrically connected to the organic interposer substrate through the conductive bumps. The underfill is disposed between the semiconductor die and the organic interposer substrate, wherein the underfill encapsulates the conductive bumps and is in contact with the chamfered edges of the at least one semiconductor die.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package at least has a semiconductor die and a redistribution layer disposed on an active surface of the semiconductor die and electrically connected with the semiconductor die. The redistribution layer has a wiring-free zone arranged at a location below a corner of the semiconductor die. An underfill is disposed between the semiconductor die and the redistribution layer. The wiring-free zone is located below the underfill and is in contact with the underfill. The wiring-free zone extends horizontally from the semiconductor die to the underfill.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a lower dielectric arranged over a substrate. An interconnect wire is arranged over the dielectric layer, and a first interconnect dielectric layer is arranged outer sidewalls of the interconnect wire. A protection liner that includes graphene is arranged directly on the outer sidewalls of the interconnect wire and on a top surface of the interconnect wire. The integrated chip further includes a first etch stop layer arranged directly on upper surfaces of the first interconnect dielectric layer, and a second interconnect dielectric layer arranged over the first interconnect dielectric layer and the interconnect wire. Further, an interconnect via extends through the second interconnect dielectric layer, is arranged directly over the protection liner, and is electrically coupled to the interconnect wire.

Abstract: An automatic mounting and demounting device and system for a motor testing platform, adapted to enable a control host to control automatic mounting and demounting between an axle of a motor under test and an axle of a testing apparatus, includes a mobile platform and a positional information sensing member. The control host controls the mobile platform according to positional information generated by the positional information sensing member, such that a carrier for carrying the motor under test is automatically driven to a corresponding position to thereby effect alignment and connection or separation of the axle of the motor under test and the axle of the testing apparatus. Therefore, preparation for the motor dynamics testing is automatically carried out effectively and correctly, thereby reducing the time and manpower required for testing-related preparation.

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

Abstract: A block management method, a memory control circuit unit and a memory storage apparatus for managing a plurality of physical blocks are provided. The method includes writing test data to a first physical block among the plurality of physical blocks, reading the test data from the first physical block among the plurality of physical blocks to obtain a plurality of parameters corresponding to the first physical block; grouping the first physical block into a first block group or a second block group according to the plurality of parameters corresponding to the first physical block and a rule between the plurality of parameters and grouping of the plurality of physical blocks; establishing first and second block mapping tables; and mapping logical addresses of the first and second block mapping tables to the plurality of physical blocks belonging to the first and second block groups.

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

Abstract: A memory management method, a memory control circuit unit and a memory storage device are provided. The method includes recording use information according to each physical erasing unit of a rewritable non-volatile memory module. The method also includes configuring a plurality of super physical units. An address offset value corresponding to a first unavailable physical programming unit of a first physical erasing unit in a first super physical unit is the same as an address offset value corresponding to a first available physical programming unit of a second physical erasing unit in the first super physical unit.

Abstract: A block management method, a memory control circuit unit and a memory storage apparatus for managing a plurality of physical blocks are provided. The method includes reading user data from a first physical block among physical blocks to obtain a plurality of parameters; inputting the parameters corresponding to the first physical block into a machine learning based block recognizer to group the first physical block into a first block group or a second block group according to an output result of the machine learning based block recognizer; establishing a first and second block mapping tables; mapping logical addresses of the first and second block mapping tables to the physical blocks belonging to the first and second block groups. The parameters may comprise at least one of a read busy time parameter, an error bit position parameter and a storage retention parameter. A machine learning operation may be performed using first and second test physical blocks, and corresponding parameters, as training data.

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

Abstract: A memory management method, a memory control circuit unit and a memory storage device are provided. The method includes recording use information according to each physical erasing unit of a rewritable non-volatile memory module. The method also includes configuring a plurality of super physical units. An address offset value corresponding to a first unavailable physical programming unit of a first physical erasing unit in a first super physical unit is the same as an address offset value corresponding to a first available physical programming unit of a second physical erasing unit in the first super physical unit.