Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.

Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.

Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.

Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.

Abstract: A light-emitting diode (LED) lighting device has an LED and a power supply including an inductor coupled to the LED. A cathode of the LED is coupled to the inductor opposite an anode of the LED. The inductor is coupled for receiving a first power signal. A transistor includes a conduction terminal coupled to the inductor to enable current through the inductor. A current from the first power signal is switched to generate a second power signal. A first diode includes an anode coupled to the inductor opposite the cathode of the LED. A controller includes a first terminal coupled to a cathode of the first diode and a second terminal coupled to a control terminal of the transistor. A zener diode is coupled to the first terminal of the controller. A capacitor is coupled between the first diode and inductor. A second diode is coupled to the first diode.

Abstract: A light-emitting diode (LED) lighting device has an LED and a power supply including an inductor coupled to the LED. A cathode of the LED is coupled to the inductor opposite an anode of the LED. The inductor is coupled for receiving a first power signal. A transistor includes a conduction terminal coupled to the inductor to enable current through the inductor. A current from the first power signal is switched to generate a second power signal. A first diode includes an anode coupled to the inductor opposite the cathode of the LED. A controller includes a first terminal coupled to a cathode of the first diode and a second terminal coupled to a control terminal of the transistor. A dimming controller is coupled to a third terminal of the controller. A Zener diode is coupled to the first terminal of the controller.

Abstract: A light-emitting diode (LED) lighting device has an LED and a power supply including an inductor coupled to the LED. A cathode of the LED is coupled to the inductor opposite an anode of the LED. The inductor is coupled for receiving a first power signal. A transistor includes a conduction terminal coupled to the inductor to enable current through the inductor. A current from the first power signal is switched to generate a second power signal. A first diode includes an anode coupled to the inductor opposite the cathode of the LED. A controller includes a first terminal coupled to a cathode of the first diode and a second terminal coupled to a control terminal of the transistor. A zener diode is coupled to the first terminal of the controller. A capacitor is coupled between the first diode and inductor. A second diode is coupled to the first diode.

Abstract: A light-emitting diode (LED) lighting device has an LED and a power supply including an inductor coupled to the LED. A cathode of the LED is coupled to the inductor opposite an anode of the LED. The inductor is coupled for receiving a first power signal. A transistor includes a conduction terminal coupled to the inductor to enable current through the inductor. A current from the first power signal is switched to generate a second power signal. A first diode includes an anode coupled to the inductor opposite the cathode of the LED. A controller includes a first terminal coupled to a cathode of the first diode and a second terminal coupled to a control terminal of the transistor. A zener diode is coupled to the first terminal of the controller. A capacitor is coupled between the first diode and inductor. A second diode is coupled to the first diode.

Abstract: A light-emitting diode (LED) lighting device has an LED and a power supply including an inductor coupled to the LED. A cathode of the LED is coupled to the inductor opposite an anode of the LED. The inductor is coupled for receiving a first power signal. A transistor includes a conduction terminal coupled to the inductor to enable current through the inductor. A current from the first power signal is switched to generate a second power signal. A first diode includes an anode coupled to the inductor opposite the cathode of the LED. A controller includes a first terminal coupled to a cathode of the first diode and a second terminal coupled to a control terminal of the transistor. A dimming controller is coupled to a third terminal of the controller. A Zener diode is coupled to the first terminal of the controller.

Abstract: A light-emitting diode (LED) lighting device has an LED and a power supply including an inductor coupled to the LED. A cathode of the LED is coupled to the inductor opposite an anode of the LED. The inductor is coupled for receiving a first power signal. A transistor includes a conduction terminal coupled to the inductor to enable current through the inductor. A current from the first power signal is switched to generate a second power signal. A first diode includes an anode coupled to the inductor opposite the cathode of the LED. A controller includes a first terminal coupled to a cathode of the first diode and a second terminal coupled to a control terminal of the transistor. A zener diode is coupled to the first terminal of the controller. A capacitor is coupled between the first diode and inductor. A second diode is coupled to the first diode.

Abstract: A light-emitting diode lamp includes a light engine, a power assembly, and a heatsink. The light engine includes a plurality of light-emitting diodes, and the power assembly includes a socket disposed at one end of the power assembly and a heat spreader plate disposed at another end of the power assembly opposite the socket. The light engine is mounted to the heat spreader plate. The power assembly further includes a power supply circuit that is electrically coupled to the socket and to the light engine. The socket is configured to electrically couple the power supply circuit to an external electrical source. The heatsink encircles the power assembly and is thermally connected to the light engine. The heatsink also includes a plurality of perforations, which are arranged to facilitate a natural convection airflow over and through the heatsink.

Abstract: A light-emitting diode lamp includes a light engine, a power assembly, and a heatsink. The light engine includes a plurality of light-emitting diodes, and the power assembly includes a socket disposed at one end of the power assembly and a heat spreader plate disposed at another end of the power assembly opposite the socket. The light engine is mounted to the heat spreader plate. The power assembly further includes a power supply circuit that is electrically coupled to the socket and to the light engine. The socket is configured to electrically couple the power supply circuit to an external electrical source. The heatsink encircles the power assembly and is thermally connected to the light engine. The heatsink also includes a plurality of perforations, which are arranged to facilitate a natural convection airflow over and through the heatsink.

Abstract: A light-emitting diode lamp includes a light engine, a power assembly, and a heatsink. The light engine includes a plurality of light-emitting diodes, and the power assembly includes a socket disposed at one end of the power assembly and a heat spreader plate disposed at another end of the power assembly opposite the socket. The light engine is mounted to the heat spreader plate. The power assembly further includes a power supply circuit that is electrically coupled to the socket and to the light engine. The socket is configured to electrically couple the power supply circuit to an external electrical source. The heatsink encircles the power assembly and is thermally connected to the light engine. The heatsink also includes a plurality of perforations, which are arranged to facilitate a natural convection airflow over and through the heatsink.