Abstract: A method for detecting heat dissipation is provided, including the following steps: sensing a core temperature of a heat emitting component of an electronic device; sensing current power of the heat emitting component when the core temperature is greater than or equal to a warning temperature; and transmitting an assembling check prompt and activating a thermal control circuit (TCC) when the current power is less than thermal design power (TDP) of the heat emitting component. An electronic device is further provided, to execute the method for detecting heat dissipation.

Abstract: A diagnostic system applied to an electronic equipment with a plurality of hardware devices is provided. The hardware devices include a display and a processor, the diagnostic system is executed by the processor to diagnose the hardware devices. The diagnostic system includes a diagnostic test interface, which is displayed on the display and includes a plurality of hardware items corresponding to the hardware devices. Each of the hardware items links to the hardware devices. When at least one of the hardware items is triggered, the processor executes the diagnostic item of the hardware device corresponding to the triggered hardware item.

Abstract: A plastic molded product includes a plastic body provided with a plurality of holes, which are recessed in a common depth direction, on a surface of the plastic body. The holes include: an inner surface including an inlet a specific reference plane perpendicular to the depth direction and including at least a portion of the inlet and a depth reference point, which is spaced away from a center point on an inlet side of the specific reference plane toward a bottom side of the hole, the depth reference point being spaced away by a distance equal to ¼ of a maximum value of an inlet side bore diameter on the specific reference plane. A deepmost portion of the inner surface of the hole is in a position which coincides with the reference point or is deeper than the reference point toward the bottom side.

Abstract: A method for detecting heat dissipation is provided, including the following steps: sensing a core temperature of a heat emitting component of an electronic device; sensing current power of the heat emitting component when the core temperature is greater than or equal to a warning temperature; and transmitting an assembling check prompt and activating a thermal control circuit (TCC) when the current power is less than thermal design power (TDP) of the heat emitting component. An electronic device is further provided, to execute the method for detecting heat dissipation.

Abstract: A diagnostic system applied to an electronic equipment with a plurality of hardware devices is provided. The hardware devices include a display and a processor, the diagnostic system is executed by the processor to diagnose the hardware devices. The diagnostic system includes a diagnostic test interface, which is displayed on the display and includes a plurality of hardware items corresponding to the hardware devices. Each of the hardware items links to the hardware devices. When at least one of the hardware items is triggered, the processor executes the diagnostic item of the hardware device corresponding to the triggered hardware item.

Abstract: A plastic molded product includes a plastic body provided with a plurality of holes, which are recessed in a common depth direction, on a surface of the plastic body. The holes include: an inner surface including an inlet a specific reference plane perpendicular to the depth direction and including at least a portion of the inlet and a depth reference point, which is spaced away from a center point on an inlet side of the specific reference plane toward a bottom side of the hole, the depth reference point being spaced away by a distance equal to ¼ of a maximum value of an inlet side bore diameter on the specific reference plane. A deepmost portion of the inner surface of the hole is in a position which coincides with the reference point or is deeper than the reference point toward the bottom side.

Abstract: An optical transceiver includes a positioning element, a fiber connecting segment, a base and a housing. The positioning element has a first positioning part. The fiber connecting segment tightly fits to the positioning element. The housing supports at least one optical transceiving element and is connected to the positioning element. The base has a second positioning part and is configured for supporting the positioning element and the fiber connecting segment. The first positioning part and the second positioning part define the position of the fiber connecting segment.

Abstract: An optical transceiver includes a positioning element, a fiber connecting segment, a base and a housing. The positioning element has a first positioning part. The fiber connecting segment tightly fits to the positioning element. The housing supports at least one optical transceiving element and is connected to the positioning element. The base has a second positioning part and is configured for supporting the positioning element and the fiber connecting segment. The first positioning part and the second positioning part define the position of the fiber connecting segment.

Abstract: An optical module includes a first light-guide element, an optical element, a first optical fiber, and a beam splitter. The first light-guide element includes a first surface and a second surface. The optical element corresponds to the first surface. The first optical fiber is contacted with the second surface. The beam splitter is attached to the first surface, the beam splitter partially reflects and partially transmits a light beam striking thereon. A refractive index of the beam splitter is different from a refractive index of the first light-guide element.

Abstract: An opto-electrical conversion structure includes a substrate, a first semiconductor structure, and a second semiconductor structure. The substrate has a first surface and a second surface opposite to each other. The first surface has a plurality of micro-structures and a plurality of nano-structures. The nano-structures are distributed on the surface of the micro-structures, and have heights of about 500 nm to about 900 nm. The first semiconductor structure is disposed on the first surface of the substrate. The second semiconductor structure is disposed on the second surface of the substrate.

Abstract: An optical module includes a first light-guide element, an optical element, a first optical fiber, and a beam splitter. The first light-guide element includes a first surface and a second surface. The optical element corresponds to the first surface. The first optical fiber is contacted with the second surface. The beam splitter is attached to the first surface, the beam splitter partially reflects and partially transmits a light beam striking thereon. A refractive index of the beam splitter is different from a refractive index of the first light-guide element.

Abstract: The lock member includes: a plate-like base portion positioned on a top side of the socket; a holder retaining the base portion to the socket; an operating portion connected to the base portion and movable in a direction intersecting the base portion by an external operation; and a lock portion restricting disengagement of the engaged portions and the engaging portions. The lock portion is positioned in the socket and connected to the operating portion via a joint inserted in the cutout. Without the external operation, the lock portion is present in movement paths where the engaging portions move to be disengaged from the engaged portions. When the operating portion is moved by the external operation, the lock portion is moved away from the movement paths.

Abstract: An optical splitting device includes a body and an optical condensing member. The optical condensing member is disposed on the body, and includes a first light incident surface and a second light incident surface. The second light incident surface is discontinuously adjacent to the first light incident surface.

Abstract: The lock member includes: a plate-like base portion positioned on a top side of the socket; a holder retaining the base portion to the socket; an operating portion connected to the base portion and movable in a direction intersecting the base portion by an external operation; and a lock portion restricting disengagement of the engaged portions and the engaging portions. The lock portion is positioned in the socket and connected to the operating portion via a joint inserted in the cutout. Without the external operation, the lock portion is present in movement paths where the engaging portions move to be disengaged from the engaged portions. When the operating portion is moved by the external operation, the lock portion is moved away from the movement paths.

Abstract: A damper for protecting a gauge sensor measuring the pressure of a dry etch chamber. The damper includes a vacuum tube for connecting the gauge with the chamber and at least one plate for blocking the plasma of the chamber from directly striking against the sensor. The at least one plate is disposed at the inner wall of the vacuum tube to effectively prevent the plasma from attaching onto the sensor so as to maintain the sensitivity of the sensor and prolong the lifetime of the gauge.

Abstract: An adjustable positioning device used to position a work piece on a work platform is provided. The adjustable positioning device includes a base which is coupled to the work platform and has multiple sockets, and a supporting frame which has multiple slots. The supporting frame further includes a supporting portion protruded from a lateral side of the supporting frame, a number of bars which are installed at the bottom of the supporting frame and are used to insert into selected sockets, a slide block with a sliding section and a pressing section wherein the sliding section is able to slide and can be selectively fixed in a slot while the pressing section and the supporting portion are opposed to each other. The work piece can be retained between the pressing section and the supporting portion.

Abstract: A damper for protecting a gauge sensor measuring the pressure of a dry etch chamber. The damper includes a vacuum tube for connecting the gauge with the chamber and at least one plate for blocking the plasma of the chamber from directly striking against the sensor. The at least one plate is disposed at the inner wall of the vacuum tube to effectively prevent the plasma from attaching onto the sensor so as to maintain the sensitivity of the sensor and prolong the lifetime of the gauge.

Abstract: An apparatus for preventing a substrate from being contaminated by condensed liquid is disclosed to be adapted to a substrate, comprising a reaction chamber having at least a doorway on one side for the substrate to enter or exit wherein the chamber receives the substrate and a process fluid to proceed with a processing step, a conveyor unit for delivering the substrate into or out of the reaction chamber via the doorway, a first jet device disposed on the delivery route of the conveyor unit external to the reaction chamber to eject a gas out in a direction toward the substrate on the conveyor unit, and a second jet device disposed on one side of the doorway external to the reaction chamber to eject a gas out in a direction toward the doorway. Also, a method for preventing a substrate from being contaminated by condensed liquid is provided.

Abstract: An adjustable positioning device used to position a work piece on a work platform is provided. The adjustable positioning device includes a base which is coupled to the work platform and has multiple sockets, and a supporting frame which has multiple slots. The supporting frame further includes a supporting portion protruded from a lateral side of the supporting frame, a number of bars which are installed at the bottom of the supporting frame and are used to insert into selected sockets, a slide block with a sliding section and a pressing section wherein the sliding section is able to slide and can be selectively fixed in a slot while the pressing section and the supporting portion are opposed to each other. The work piece can be retained between the pressing section and the supporting portion.