Abstract: A dual-material co-injection molded bipolar plate and its manufacturing method are disclosed, in which the manufacturing method comprises the steps of: injecting a skin polymer melt containing a first conductive material into a mold cavity of a bipolar plate mold; sequential or simultaneous injecting a core polymer melt containing a second conductive and the skin polymer melt into the mold cavity; molding a bipolar plate, being a sandwich structure having a core layer packed inside a skin layer, while enabling a conductive grid composed of the first conductive material and the second conductive material to be formed between the core layer and the skin layer for improving the through-plane conductivity of the bipolar plate.

Abstract: A fabrication method for enhancing the electrical conductivity of bipolar plates, adapted for laminating a three-layered structure that is constructed by sandwiching a bonding layer made of a conductive material between two bipolar plates made of a thermoplastic polymer composite, is disclosed, which comprises the steps of: using an induction coil to heat up the bonding layer; and exerting a pressure upon the two bipolar plates for laminating the bonding layer to the two bipolar plates. With the aforesaid method, not only the through-plane conductivity with regard to the two bipolar plates can be enhanced, but also the processing time is greatly reduced.

Abstract: A dual BIOS circuit includes a first BIOS chip, a second BIOS chip, a power supply, and a switch. The first BIOS chip is connected to a Southbridge chip of a motherboard via a bus. The second BIOS chip is connected to the Southbridge chip of a motherboard via another bus. The power supply is connected to signal pin of the Southbridge chip. The switch includes a handle. The first terminal of the switch is connected to the a detecting pin of the Southbridge chip. The second terminal of the switch is connected to the power supply. The third terminal of the switch is grounded. The first or second BIOS chip is selected to operate according to the voltage level at the detecting pin of the Southbridge chip.

Abstract: A dual BIOS circuit includes a first BIOS chip, a second BIOS chip, and a transistor. The first and the second BIOS chip include a setup program configured for setting the voltage of a GPIO pin of a Southbridge chip. The first and the second BIOS chip are connected to the Southbridge chip. The gate of the transistor is connected to the GPIO pin of the Southbridge chip. The drain of the transistor is connected to a power supply via a resistor, and connected to a detecting pin of the Southbridge chip. The source of the transistor is grounded. The power supply is connected to a signal pin of the Southbridge chip. The first or second BIOS chip is selected to operate according to the voltage level at the detecting pin of the Southbridge chip.