Abstract: The present disclosure provides a method of determining a leakage of a semiconductor manufacturing tool. The method includes: placing a substrate including a material layer on the substrate into a chamber of the semiconductor manufacturing tool; delivering a gas into the chamber to react with the material layer; obtaining a gas composition inside the chamber; and comparing the gas composition to a referential gas composition. The leakage is determined to exist if the gas composition is substantially different from the referential gas composition.

Abstract: The present disclosure provides a mechanism for filtering an etching byproduct during semiconductor fabrication. The mechanism includes: an etching tool, configured to etch a portion of a material layer and having an outlet for discharging the etching byproduct formed from the etched portion of the material layer; a pipeline, for allowing the etching byproduct to flow through, the pipeline having a first end connected to the outlet of the etching tool and a second end distal to the first end and the etching tool; and a filter, disposed between the first end and the second end and configured to filter the etching byproduct. The filter includes a solidifier configured to solidify the etching byproduct by freezing or heating, and a medium configured to retain the etching byproduct solidified by the solidifier.