Patents by Inventor Ming Young Son

Ming Young Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer level package having a side package
    Patent number: 6852607
    Abstract: A method of manufacturing a wafer level package includes forming a semiconductor wafer including semiconductor chips, and forming a package body on the sides of each semiconductor chip. The package body is formed by forming a space between each semiconductor chip and potting a package material in the space, which can be a mold resin. The wafer is then separated into separate semiconductor chips by cutting through the package body.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: February 8, 2005
    Assignee: Samsung Electronics., LTD
    Inventors: Young Hee Song, Ming Young Son, Woong Ky Ha
  • Wafer level package having a side package
    Publication number: 20020180017
    Abstract: A method of manufacturing a wafer level package includes forming a semiconductor wafer including semiconductor chips, and forming a package body on the sides of each semiconductor chip. The package body is formed by forming a space between each semiconductor chip and potting a package material in the space, which can be a mold resin. The wafer is then separated into separate semiconductor chips by cutting through the package body.
    Type: Application
    Filed: May 10, 2002
    Publication date: December 5, 2002
    Inventors: Young Hee Song, Ming Young Son, Woong Ky Ha