Patents by Inventor Ming-Yu Chen

Ming-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210020672
    Abstract: A photo-detecting apparatus includes an absorption layer configured to absorb photons and to generate photo-carriers from the absorbed photons, wherein the absorption layer includes germanium. A carrier guiding unit is electrically coupled to the absorption layer, wherein the carrier guiding unit includes a first switch including a first gate terminal.
    Type: Application
    Filed: October 1, 2020
    Publication date: January 21, 2021
    Inventors: Chien-Yu Chen, Yun-Chung Na, Szu-Lin Cheng, Ming-Jay Yang, Han-Din Liu, Che-Fu Liang
  • Patent number: 10893563
    Abstract: Methods and apparatuses for handling sensing for a sidelink source in a wireless communication system are disclosed herein. In one method, a User Equipment (UE) receives a control signaling which schedules a resource of a first transmission, in which the control signaling informs and/or indicates that the scheduled resource is not kept for a next transmission. The UE performs energy sensing for candidate resources, in which one or more resources associated with the scheduled resource of the first transmission is not utilized for energy sensing.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: January 12, 2021
    Assignee: ASUSTek Computer Inc.
    Inventors: Ming-Che Li, Li-Chih Tseng, Wei-Yu Chen, Li-Te Pan
  • Patent number: 10886311
    Abstract: A photo-detecting apparatus includes an absorption layer configured to absorb photons and to generate photo-carriers from the absorbed photons, wherein the absorption layer includes germanium. A carrier guiding unit is electrically coupled to the absorption layer, wherein the carrier guiding unit includes a first switch including a first gate terminal.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: January 5, 2021
    Assignee: Artilux, Inc.
    Inventors: Chien-Yu Chen, Yun-Chung Na, Szu-Lin Cheng, Ming-Jay Yang, Han-Din Liu, Che-Fu Liang
  • Publication number: 20200411514
    Abstract: A semiconductor device and method are provided whereby a series of spacers are formed in a first region and a second region of a substrate. The series of spacers in the first region are patterned while the series of spacers in the second region are protected in order to separate the properties of the spacers in the first region from the properties of the spacers in the second region.
    Type: Application
    Filed: February 3, 2020
    Publication date: December 31, 2020
    Inventors: Shih-Yao Lin, Kuei-Yu Kao, Chi-Sheng Lai, Chih-Han Lin, Wei-Chung Sun, Ming-Ching Chang, Chao-Cheng Chen
  • Patent number: 10879224
    Abstract: A package structure, a die and method of forming the same are provided. The package structure includes a die, an encapsulant, a RDL structure, and a conductive terminal. The die has a connector. The connector includes a seed layer and a conductive on the seed layer. The seed layer extends beyond a sidewall of the conductive pillar. The encapsulant is aside the die and encapsulates sidewalls of the die. The RDL structure is electrically connected to the die. The conductive terminal is electrically connected to the die through the RDL structure.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: December 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hsien Huang, Ming-Shih Yeh
  • Patent number: 10872855
    Abstract: A chip package including an integrated circuit component, a thermal conductive layer, an insulating encapsulant and a redistribution circuit structure is provided. The integrated circuit component includes an amorphous semiconductor portion located at a back surface thereof. The thermal conductive layer covers the amorphous semiconductor portion of the integrated circuit component, wherein thermal conductivity of the thermal conductive layer is greater than or substantially equal to 10 W/mK. The insulating encapsulant laterally encapsulates the integrated circuit component and the thermal conductive layer. The redistribution circuit structure is disposed on the insulating encapsulant and the integrated circuit component, wherein the redistribution circuit structure is electrically connected to the integrated circuit component.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: December 22, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Guan-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh
  • Publication number: 20200395393
    Abstract: A photo-detecting apparatus is provided. The photo-detecting apparatus includes at least one pixel, and each pixel includes N subpixels, wherein each of the subpixels comprises a detection region, two first conductive contacts, wherein the detection region is between the two first conductive contacts, wherein N is a positive integer and is ?2.
    Type: Application
    Filed: August 27, 2020
    Publication date: December 17, 2020
    Inventors: Szu-Lin Cheng, Chien-Yu Chen, Shu-Lu Chen, Yun-Chung Na, Ming-Jay Yang, Han-Din Liu, Che-Fu Liang
  • Patent number: 10868139
    Abstract: A method includes forming a dummy gate electrode layer over a semiconductor region, forming a mask strip over the dummy gate electrode layer, and performing a first etching process using the mask strip as a first etching mask to pattern an upper portion of the dummy gate electrode layer. A remaining portion of the upper portion of the dummy gate electrode layer forms an upper part of a dummy gate electrode. The method further includes forming a protection layer on sidewalls of the upper part of the dummy gate electrode, and performing a second etching process on a lower portion of the dummy gate electrode layer to form a lower part of the dummy gate electrode, with the protection layer and the mask strip in combination used as a second etching mask. The dummy gate electrode and an underlying dummy gate dielectric are replaced with a replacement gate stack.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: December 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Han Lin, Kuei-Yu Kao, Ming-Ching Chang, Chan-Lon Yang, Chao-Cheng Chen, Syun-Ming Jang
  • Patent number: 10868353
    Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, an antenna pattern, and an insulating layer. The chip package includes a semiconductor die and an insulating encapsulation enclosing the semiconductor die. The antenna pattern is electrically coupled to the chip package, where a material of the antenna pattern comprises a conductive powder having fused metal particles. The insulating layer disposed between the chip package and the antenna pattern, where the antenna pattern includes a first surface in contact with the insulating layer, and a second surface opposite to the first surface, and a surface roughness of the second surface is greater than a surface roughness of the first surface.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: December 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho, Wei-Yu Chen, Yu-Peng Tsai, Chia-Lun Chang, Chia-Shen Cheng, Chih-Chiang Tsao, Tzu-Chun Tang, Ching-Hua Hsieh, Tuan-Yu Hung, Cheng-Shiuan Wong
  • Publication number: 20200387196
    Abstract: An electronic device includes a first body, a second body, at least one hinge, and at least one electronic assembly. The hinge is connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the hinge. The electronic assembly is connected to the second body. A first gap exists between the electronic assembly and the hinge in an axial direction of the hinge.
    Type: Application
    Filed: February 5, 2020
    Publication date: December 10, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ming-Chung Peng, Jih-Houng Lee, Ko-Fan Chen, Hsin-Yu Huang
  • Publication number: 20200387200
    Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.
    Type: Application
    Filed: January 21, 2020
    Publication date: December 10, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ming-Chung Peng, Ko-Fan Chen, Chun-Yi Ho, Chien-Ting Lin, Yu-Jung Liu, Hsin-Jung Lee, Hsin-Yu Huang, Jih-Houng Lee, Ming-Feng Liu, Kuo-Jung Wu, Kuo-Pin Chen, Chia-Ling Lee, Jing-Jie Lin
  • Patent number: 10859440
    Abstract: A spectrometer engine and an adjustment method thereof are provided. The spectrometer engine includes a connector, a light sensor, a variable gain amplifier, a variable reference voltage generation circuit, an analog-to-digital converter and a control circuit. The light sensor senses a light to be measured coming from an object to be measured to generate a sensing signal. The variable gain amplifier amplifies the sensing signal according to a first setting parameter to generate an amplified signal. The variable reference voltage generation circuit provides a reference voltage according to a second setting parameter. The analog-to-digital converter converts the amplified signal to a digital signal according to the reference voltage. The control circuit reads the digital signal and adjusts at least one of the first to third setting parameters according to the digital signal for the spectrometer engine to measure the object to be measured again to generate another digital signal.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: December 8, 2020
    Assignee: InnoSpectra Corporation
    Inventors: Cheng-Hsiung Chen, Yung-Yu Huang, Ming-Hui Lin, He-Yi Hsieh, Hsi-Pin Li
  • Patent number: 10861988
    Abstract: An image sensor with an absorption enhancement semiconductor layer is provided. In some embodiments, the image sensor comprises a front-side semiconductor layer, an absorption enhancement semiconductor layer, and a back-side semiconductor layer that are stacked. The absorption enhancement semiconductor layer is stacked between the front-side and back-side semiconductor layers. The absorption enhancement semiconductor layer has an energy bandgap less than that of the front-side semiconductor layer. Further, the image sensor comprises a plurality of protrusions and a photodetector. The protrusions are defined by the back-side semiconductor layer, and the photodetector is defined by the front-side semiconductor layer, the absorption enhancement semiconductor layer, and the back-side semiconductor layer.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: December 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Chi Wu, Chien Nan Tu, Kun-Yu Lin, Shih-Shiung Chen
  • Patent number: 10861989
    Abstract: An image sensor with an absorption enhancement semiconductor layer is provided. In some embodiments, the image sensor comprises a front-side semiconductor layer, an absorption enhancement semiconductor layer, and a back-side semiconductor layer that are stacked. The absorption enhancement semiconductor layer is stacked between the front-side and back-side semiconductor layers. The absorption enhancement semiconductor layer has an energy bandgap less than that of the front-side semiconductor layer. Further, the image sensor comprises a plurality of protrusions and a photodetector. The protrusions are defined by the back-side semiconductor layer, and the photodetector is defined by the front-side semiconductor layer, the absorption enhancement semiconductor layer, and the back-side semiconductor layer.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: December 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Chi Wu, Chien Nan Tu, Kun-Yu Lin, Shih-Shiung Chen
  • Publication number: 20200374427
    Abstract: Examples of an audio-video (AV) apparatus are described herein. In an example, the AV apparatus includes a base member. The AV apparatus further includes an AV unit including an image sensor and an audio sensor. The AV unit being actuated to move, with respect to the base member, either in a first direction and activate the audio sensor or in a second direction and activate the image sensor and the audio sensor.
    Type: Application
    Filed: January 30, 2018
    Publication date: November 26, 2020
    Inventors: Ming-Shan TSAI, Szu-Yu Chen, Wei-Chih TSAO
  • Patent number: 10847949
    Abstract: Some embodiments relate to a method for manufacturing a vertical cavity surface emitting laser. The method includes forming an optically active layer over a first reflective layer and forming a second reflective layer over the optically active layer. Forming a masking layer over the second reflective layer, where the masking layer leaves a sacrificial portion of the second reflective layer exposed. A first etch is performed to remove the sacrificial portion of the second reflective layer, defining a second reflector. Forming a first spacer covering outer sidewalls of the second reflector and masking layer. Performing an oxidation process to oxidize a peripheral region of the optically active layer. A second etch is performed to remove a portion of the oxidized peripheral region, defining an optically active region. Forming a second spacer covering outer sidewalls of the first spacer, the optically active region, and the first reflector.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: November 24, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen Yu Chen, Ming Chyi Liu, Jhih-Bin Chen
  • Publication number: 20200360967
    Abstract: A touch feedback and sensing device includes a circuit board, a piezoelectric ceramic actuator on the circuit board; and at least one strain sensor on the circuit board. The piezoelectric ceramic actuator includes a piezoelectric ceramic block, a cathode and an anode on the piezoelectric ceramic block. Different voltages are applied to the cathode and the anode to vibrate the piezoelectric ceramic block. The circuit board vibrates with vibration of the piezoelectric ceramic block. The at least one strain sensor is configured to detect and monitor vibration of the circuit board.
    Type: Application
    Filed: July 12, 2019
    Publication date: November 19, 2020
    Inventors: MING-TA CHIANG, MIN-YU KAN, MENG-ZHU MA, HUAN DING, YU-JU CHEN
  • Patent number: 10840199
    Abstract: Methods of forming connector pad structures, interconnect structures, and structures thereof are disclosed. In some embodiments, a method of forming a connector pad structure includes forming an underball metallization (UBM) pad, and increasing a surface roughness of the UBM pad by exposing the UBM pad to a plasma treatment. A polymer material is formed over a first portion of the UBM pad, leaving a second portion of the UBM pad exposed.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: November 17, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen
  • Publication number: 20200356150
    Abstract: Systems, methods, apparatuses for fan type identification are disclosed. A predetermined pulse width modulation duty cycle is used to obtain a sequence of fan speeds from a fan over a time period. A fan type of the fan is determined based on the sequence of fan speeds.
    Type: Application
    Filed: May 6, 2020
    Publication date: November 12, 2020
    Inventors: MING CHANG CHUANG, JUI-CHAN FAN, YUHUNG WANG, CHENWEI LEE, EDWARD YU-CHEN KUNG
  • Patent number: 10816398
    Abstract: A spectrometer and a spectrum measurement method thereof are provided. An analog-to-digital converter converts an amplified signal into a digital signal according to a reference voltage provided by a variable reference voltage generation circuit and amplifies the digital signal according to a target signal value, thereby approximating a signal value of the amplified digital signal to the target signal value. A control circuit outputs a spectral signal according to the amplified digital signal. A user can obtain spectrum measurement results that can be easily interpreted by the spectrometer and the spectrum measurement method thereof, without changing hardware or software, so as to improve convenience of use of the spectrometer.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: October 27, 2020
    Assignee: InnoSpectra Corporation
    Inventors: Yung-Yu Huang, Hsi-Pin Li, He-Yi Hsieh, Cheng-Hsiung Chen, Ming-Hui Lin