Abstract: A composite intermediary device using vertical probe for wafer testing, comprising: a printed circuit board, a glass interposer and a vertical probe set; wherein the printed circuit board has printed circuit connected with a measuring apparatus, the glass interposer has multiple contact pads connected with the printed circuit, and then the probes of the vertical probe set are against the contact pads of the glass interposer and the bumps of the device under test. By a fine pitch configuration of the printed circuit and the contact pads of the glass interposer, the present invention achieves the requirements of synchronous and interleaved testing of multiple ICs.

Abstract: An optical path folding element includes a main body, a light absorption film layer and a matte structure. The main body has optical surface including an incident surface, a reflective surface and an emitting surface. A light enters into the optical folding element through the incident surface. The reflective surface reflects the light so as to change a traveling direction thereof. The light exits the optical folding element through the emitting surface. The light absorbing film layer is configured to reduce reflectance and provided adjacent to at least part of the optical surface, and the light absorbing film layer is in physical contact with the main body. The matte structure is disposed adjacent to at least part of the optical surface. The matte structure provides an undulating profile on a surface of the optical path folding element, and the matte structure is formed in one-piece with the main body.

Abstract: A battery module includes an insulating base, a pair of electrodes and multiple battery packs. Each electrode is installed to the insulating base and has a bridge portion and a wire connecting part exposed from the insulating base, and a pair of lugs is extended smoothly from each battery pack, and an end of at least a part of the lugs is attached to each bridge portion correspondingly. Therefore, the lug is not being twisted or deformed easily, and the battery module may have good conductive efficiency, long service life, and convenience of changing the battery pack.

Abstract: An imaging lens assembly module includes a lens barrel, a catadioptric lens assembly, an imaging lens assembly, a first fixing element and a second fixing element. The lens barrel has a first relying surface and a second relying surface, which face towards an object side of the imaging lens assembly module. The catadioptric lens assembly relies on the first relying surface. The imaging lens assembly is disposed on an image side of the catadioptric lens assembly, and relies on the second relying surface. The first fixing element is for fixing the catadioptric lens assembly to the lens barrel. The second fixing element is for fixing the imaging lens assembly to the lens barrel. The catadioptric lens assembly is for processing at least twice internal reflections of an image light in the imaging lens assembly module, and for providing optical refractive power.

Abstract: The invention relates to a combined dual-wavelength laser light processing device, having two laser light source and a Bessel beam lens, so as to form a Bessel beam with long focal length; Using the coaxial reflecting mirror to achieve deflecting and penetrating to form two coaxial finished light beams; a diffraction optical unit for adjusting the energy distribution of the finished light beam; a work platform; a laser galvanometric scanning module to achieve guiding the finished light beam; a controller electrically connected to the two laser light sources, and controls the projection timing and energy of the first and the second wavelength beams to form at least one rectangular pulse and at least one burst pulse, through the repeated conversion of the dual wavelengths in the composite light wave configuration make the processing of the composite material to be fast and precise.

Abstract: A forming method of a processing curve in a stamping process is provided. The method includes the following steps. A plurality of processing curves are established, and an optimization target is set for the processing curves according to material characteristics of a workpiece, process requirements and a finished product CAD file. At least two of the processing curves are selected and superimposed to form a basic forming curve, wherein each subsection of the basic forming curve corresponds to a selected processing curve. Whether the selected processing curve in each subsection of the basic forming curve matches the optimization target is determined.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: A method, comprising: detecting an outage of at least one functionality in a live streaming; performing an first operation toward a second user terminal; storing data of the first operation in a database of the first user terminal; and displaying an effect corresponding to the first operation during the outage. The present disclosure may store the data of operation performed by the user terminal during outage and process the operation after the outage is recovered. Therefore, the streamers and viewers may feel interested and satisfied, instead of feeling anxious, and the user experience may be enhanced.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A decoding method for low density parity code is provided. The method includes performing an iterative decoding operation for a codeword, wherein a plurality of Log-Likelihood-Ratios correspond respectively to a plurality of data bits of the codeword; determining whether the iterative decoding operation is successful; determining whether a perturbation condition is met if the iterative decoding operation is not successful; performing protect operation for a first Log-Likelihood-Ratio among the Log-Likelihood-Ratios, and performing a perturbation operation for a plurality of second Log-Likelihood-Ratios among the Log-Likelihood-Ratios, wherein the second Log-Likelihood-Ratios are different to the first Log-Likelihood-Ratio; and re-performing the iterative decoding operation for the codeword after finishing the perturbation operation.

Abstract: A decoding method for low density parity code is provided. The method includes performing an iterative decoding operation for a codeword, wherein a plurality of Log-Likelihood-Ratios correspond respectively to a plurality of data bits of the codeword; determining whether the iterative decoding operation is successful; determining whether a perturbation condition is met if the iterative decoding operation is not successful; performing protect operation for a first Log-Likelihood-Ratio among the Log-Likelihood-Ratios, and performing a perturbation operation for a plurality of second Log-Likelihood-Ratios among the Log-Likelihood-Ratios, wherein the second Log-Likelihood-Ratios are different to the first Log-Likelihood-Ratio; and re-performing the iterative decoding operation for the codeword after finishing the perturbation operation.

Abstract: A method for image display of a mobile device includes: determining a backlight intensity parameter according to a user-defined backlight brightness and an ambient light intensity value when the ambient light intensity value is greater than a predetermined threshold value; and providing backlight to a display module of the mobile device according to the backlight intensity parameter.

Abstract: A method for image data compression of a to-be-encoded image block includes: determining one of a plurality of preset encoding modes as an encoding mode based upon attributes of pixels of the to-be-encoded image block; and compressing image data of the to-be-encoded image block according to the encoding mode thus determined so as to obtain encoded data.

Abstract: A method for image data compression of a to-be-encoded image block includes: determining one of a plurality of preset encoding modes as an encoding mode based upon attributes of pixels of the to-be-encoded image block; and compressing image data of the to-be-encoded image block according to the encoding mode thus determined so as to obtain encoded data.

Abstract: A backlight driving circuit includes a scan driver operatively associated with pixel circuits in a matrix formation, and a backlight driver. The scan driver activates the pixel circuits in a row-by-row manner within a frame interval for provision of data voltages to the pixel circuits in each row of the matrix formation, respectively. The backlight driver adjusts a duty cycle of a backlight driving signal for a backlight source such that the backlight source is deactivated when at least one of the pixel circuits is yet to be activated within the frame interval, and adjusts the duty cycle to gradually increase brightness of light output from the backlight source when all of the pixel circuits have been activated within the frame interval.

Abstract: An error reporting method is used for reporting errors in testing a computer system. The error reporting method includes the following steps: testing the computer system to find errors; generating an error code corresponding to a specific error during the test; and displaying the error code. An error reporting system being used for reporting errors in testing a computer system is also disclosed.

Abstract: An error reporting method is used for reporting errors in testing a computer system. The error reporting method includes the following steps: testing the computer system to find errors; generating an error code corresponding to a specific error during the test; and displaying the error code. An error reporting system being used for reporting errors in testing a computer system is also disclosed.