Patents by Inventor Ming-Yu Wu
Ming-Yu Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240134167Abstract: An optical path folding element includes a main body, a light absorption film layer and a matte structure. The main body has optical surface including an incident surface, a reflective surface and an emitting surface. A light enters into the optical folding element through the incident surface. The reflective surface reflects the light so as to change a traveling direction thereof. The light exits the optical folding element through the emitting surface. The light absorbing film layer is configured to reduce reflectance and provided adjacent to at least part of the optical surface, and the light absorbing film layer is in physical contact with the main body. The matte structure is disposed adjacent to at least part of the optical surface. The matte structure provides an undulating profile on a surface of the optical path folding element, and the matte structure is formed in one-piece with the main body.Type: ApplicationFiled: September 24, 2023Publication date: April 25, 2024Applicant: LARGAN PRECISION CO., LTD.Inventors: Ssu-Hsin LIU, Chen Wei FAN, Chien-Hsun WU, Wen-Yu TSAI, Ming-Ta CHOU
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Patent number: 11953877Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.Type: GrantFiled: October 20, 2022Date of Patent: April 9, 2024Assignee: NILE, Inc.Inventors: Dragan Jurkovic, Patrick Conall Regan, Chih-Chi Chang, Chang-chu Liao, Ming-Feng Jean, Kuo-Hung Lee, Yen-Hsi Liu, Hung-Yu Wu
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Publication number: 20240109152Abstract: The invention relates to a combined dual-wavelength laser light processing device, having two laser light source and a Bessel beam lens, so as to form a Bessel beam with long focal length; Using the coaxial reflecting mirror to achieve deflecting and penetrating to form two coaxial finished light beams; a diffraction optical unit for adjusting the energy distribution of the finished light beam; a work platform; a laser galvanometric scanning module to achieve guiding the finished light beam; a controller electrically connected to the two laser light sources, and controls the projection timing and energy of the first and the second wavelength beams to form at least one rectangular pulse and at least one burst pulse, through the repeated conversion of the dual wavelengths in the composite light wave configuration make the processing of the composite material to be fast and precise.Type: ApplicationFiled: April 19, 2023Publication date: April 4, 2024Inventors: Kun Yu Wu, Ming Tsung Tsai
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Publication number: 20240071776Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.Type: ApplicationFiled: December 2, 2022Publication date: February 29, 2024Inventors: DEI-CHENG LIU, CHIA-SHUAI CHANG, MING-YEN PAN, JIAN-YU SHIH, JHIH-WEI LAI, SHIH-HAN WU
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Publication number: 20240071656Abstract: A circuit protection device includes a first temperature sensitive resistor, a second temperature sensitive resistor, an electrically insulating multilayer, a first and second electrode layer, and at least one external electrode. The first temperature sensitive resistor and the second temperature sensitive resistor are electrically connected in parallel, and have a first upper electrically conductive layer and a second lower electrically conductive layer, respectively. The electrically insulating multilayer includes an upper insulating layer, a middle insulating layer, and a lower insulating layer. The upper insulating layer is between the first upper electrically conductive layer and the first electrode layer. The middle layer is laminated between the first temperature sensitive resistor and the second temperature sensitive resistor. The lower insulating layer is between the second lower electrically conductive layer and the second electrode layer.Type: ApplicationFiled: January 13, 2023Publication date: February 29, 2024Inventors: Chien Hui WU, Yung-Hsien CHANG, Cheng-Yu TUNG, Ming-Hsun LU, Yi-An SHA
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Publication number: 20240072021Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.Type: ApplicationFiled: October 26, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
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Patent number: 11916084Abstract: A transparent display panel with driving electrode regions, circuit wiring regions, and optically transparent regions is provided. The driving electrode regions are arranged into an array in a first direction and a second direction. An average light transmittance of the circuit wiring regions is less than ten percent, and an average light transmittance of the optically transparent regions is greater than that of the driving electrode regions and the circuit wiring regions. The first direction intersects the second direction. The circuit wiring regions connect the driving electrode regions at intervals, such that each optically transparent region spans among part of the driving electrode regions. The transparent display panel includes first signal lines and second signal lines extending along the circuit wiring regions, and each circuit wiring region is provided with at least one of the first signal lines and at least one of the second signal lines.Type: GrantFiled: August 24, 2022Date of Patent: February 27, 2024Assignee: AUO CorporationInventors: Chun-Yu Lin, Kun-Cheng Tien, Jia-Long Wu, Ming-Lung Chen, Shu-Hao Huang
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Patent number: 9964785Abstract: A display device including a frame, a glass light guide plate, an optical film set, a display panel, a reflector, a back plate and an electronic element is provided. The frame has a first connecting surface and a second connecting surface. The glass light guide plate has a first glass surface and a second glass surface opposite to the first glass surface. The first glass surface is connected to the first connecting surface. The optical film set is disposed on the first glass surface. The display panel is disposed on the optical film set. The reflector is disposed under the second glass surface. The back plate is connected to the second connecting surface. The back plate constructs an accommodating space with the frame and the glass light guide plate. The electronic element is connected to the back plate and located in the accommodating space.Type: GrantFiled: August 5, 2015Date of Patent: May 8, 2018Assignee: Young Lighting Technology Inc.Inventors: Chun-Chung Hsiao, Chun-Chi Hsu, Ming-Yu Wu
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Publication number: 20160062173Abstract: A display device including a frame, a glass light guide plate, an optical film set, a display panel, a reflector, a back plate and an electronic element is provided. The frame has a first connecting surface and a second connecting surface. The glass light guide plate has a first glass surface and a second glass surface opposite to the first glass surface. The first glass surface is connected to the first connecting surface. The optical film set is disposed on the first glass surface. The display panel is disposed on the optical film set. The reflector is disposed under the second glass surface. The back plate is connected to the second connecting surface. The back plate constructs an accommodating space with the frame and the glass light guide plate. The electronic element is connected to the back plate and located in the accommodating space.Type: ApplicationFiled: August 5, 2015Publication date: March 3, 2016Inventors: Chun-Chung Hsiao, Chun-Chi Hsu, Ming-Yu Wu
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Patent number: 8896498Abstract: A display includes a frame component, a display module, a first outer frame and a second outer frame. The frame component includes a first side and a second side. The display module is configured on the frame component. The first outer frame is configured at the second side, while the second outer frame is configured at the first side. The length of the second outer frame is shorter than or equal to the length of the first side, so that the two sides of the second outer frame are adapted without exceeding the two ends of the first side. By means of such a design structure, two displays may be connected into a display assembly with a larger display area. When connecting two displays, the first outer frames are able to be removed and the second sides of the two displays are inclined close to each other.Type: GrantFiled: September 7, 2011Date of Patent: November 25, 2014Assignee: AU Optronics Corp.Inventors: Sheng-Bei Huang, Ming-Yu Wu
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Publication number: 20120280891Abstract: A display includes a frame component, a display module, a first outer frame and a second outer frame. The frame component includes a first side and a second side. The display module is configured on the frame component. The first outer frame is configured at the second side, while the second outer frame is configured at the first side. The length of the second outer frame is shorter than or equal to the length of the first side, so that the two sides of the second outer frame are adapted without exceeding the two ends of the first side. By means of such a design structure, two displays may be connected into a display assembly with a larger display area. When connecting two displays, the first outer frames are able to be removed and the second sides of the two displays are inclined close to each other.Type: ApplicationFiled: September 7, 2011Publication date: November 8, 2012Applicant: AU OPTRONICS CORP.Inventors: SHENG-BEI HUANG, MING-YU WU
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Patent number: 7305027Abstract: This invention discloses a receiver and a signal compensation method therefor. An adaptive equalizer and a baseline wander compensator are provided on the front end of the receiver to improve the quality of output signals. The signal compensation method enables the adaptive equalizer to use a long T as its observation unit when the transmission cable is idle, and enables the baseline wander compensator for operation and controls both the adaptive equalizer and the baseline wander compensator to use a short T as its observation unit when the transmission cable is transmitting data signals. The disclosed adaptive equalizer can achieve its optimal processing effects, and the efficiency of the baseline wander compensator can be increased.Type: GrantFiled: June 28, 2002Date of Patent: December 4, 2007Assignee: Via Technologies, Inc.Inventors: Chin-Chi Chang, Chu-Yu Hsiao, Yu-En Tzeng, Ming-Yu Wu
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Patent number: 7136421Abstract: A signal compensation circuit and associated method dynamically compensate for signal baseline wandering in a transmission line. The compensation circuit has a detection circuit and a correction circuit. The detection circuit first compares a transmission signal with a reference level and generates a comparison result. The correction circuit then corrects the transmission signal according to the comparison result. The compensation circuit can adjust its compensation over time based on the quality of the transmission signal.Type: GrantFiled: August 8, 2002Date of Patent: November 14, 2006Assignee: VIA Technologies Inc.Inventors: Jyh-Fong Lin, Chu-Yu Hsiao, Chin-Chi Chang, Ming-Yu Wu
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Patent number: 7103123Abstract: This invention discloses an adaptive equalizer disposed on the front end of a receiver to improve the quality of a transmission signal comprising a data signal from a transmission cable. The signal compensation of the adaptive equalizer uses a long T as its observation unit when the transmission cable is idle, and uses a short T as its observation unit when the transmission cable is transmitting data signals. This invention further discloses a baseline wander compensator worked with the adaptive equalizer during the transmitting data period of the transmission cable. The disclosed adaptive equalizer can achieve its optimal processing effects.Type: GrantFiled: July 29, 2002Date of Patent: September 5, 2006Assignee: VIA Technologies, Inc.Inventors: Chin-Chi Chang, Chu-Yu Hsiao, Yu-En Tzeng, Ming-Yu Wu
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Publication number: 20030031263Abstract: A signal compensation circuit and associated method dynamically compensate for signal baseline wandering in a transmission line. The compensation circuit has a detection circuit and a correction circuit. The detection circuit first compares a transmission signal with a reference level and generates a comparison result. The correction circuit then corrects the transmission signal according to the comparison result. The compensation circuit can adjust its compensation over time based on the quality of the transmission signal.Type: ApplicationFiled: August 8, 2002Publication date: February 13, 2003Inventors: Jyh-Fong Lin, Chu-Yu Hsiao, Chin-Chi Chang, Ming-Yu Wu
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Publication number: 20030026354Abstract: This invention discloses a receiver and a signal compensation method therefor. An adaptive equalizer and a baseline wander compensator are provided on the front end of the receiver to improve the quality of output signals. The signal compensation method enables the adaptive equalizer to use a long T as its observation unit when the transmission cable is idle, and enables the baseline wander compensator for operation and controls both the adaptive equalizer and the baseline wander compensator to use a short T as its observation unit when the transmission cable is transmitting data signals. The disclosed adaptive equalizer can achieve its optimal processing effects, and the efficiency of the baseline wander compensator can be increased.Type: ApplicationFiled: June 28, 2002Publication date: February 6, 2003Applicant: VIA Technologies, Inc.Inventors: Chin-Chi Chang, Chu Yu Hsiao, Yu-En Tzeng, Ming-Yu Wu
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Publication number: 20030026334Abstract: This invention discloses an adaptive equalizer disposed on the front end of a receiver to improve the quality of a transmission signal comprising a data signal from a transmission cable. The signal compensation of the adaptive equalizer uses a long T as its observation unit when the transmission cable is idle, and uses a short T as its observation unit when the transmission cable is transmitting data signals. This invention further discloses a baseline wander compensator worked with the adaptive equalizer during the transmitting data period of the transmission cable. The disclosed adaptive equalizer can achieve its optimal processing effects.Type: ApplicationFiled: July 29, 2002Publication date: February 6, 2003Applicant: VIA Technologies, Inc.Inventors: Chin-Chi Chang, Chu-Yu Hsiao, Yu-En Tzeng, Ming-Yu Wu
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Patent number: D1023935Type: GrantFiled: March 18, 2022Date of Patent: April 23, 2024Assignee: Acer IncorporatedInventors: Ya-Hao Chan, Yi-Heng Lee, Ming-Cheng Wu, Chun-Yu Chen