Patents by Inventor Ming-Yu YEH

Ming-Yu YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120854
    Abstract: A triboelectric nanogenerating device is configured for providing an electric power to an electronic device and the triboelectric nanogenerating device includes at least one scaly triboelectric membrane configured for providing the electric power to the electronic device by frictional electrification. The at least one scaly triboelectric membrane includes a keratin and a polyvinyl alcohol, the at least one scaly triboelectric membrane has a first triboelectric surface, and the first triboelectric surface of the at least one scaly triboelectric membrane includes a plurality of scaly layers. Each of the scaly layers is arranged in order and extends along an orienting direction. A distal end of each of the scaly layers has a plurality of saw-tooth structures.
    Type: Application
    Filed: February 6, 2023
    Publication date: April 11, 2024
    Inventors: Zong-Hong Lin, Ming-Zheng Huang, Hsuan-Yu Yeh, An-Rong Chen, Yao-Hsuan Tseng
  • Patent number: 11942385
    Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: March 26, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Sheng-Yu Chen, Chang-Lin Yeh, Ming-Hung Chen
  • Publication number: 20240072021
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Patent number: 11142351
    Abstract: Provided are an earth satellite attitude data fusion system and method, applicable to an earth satellite space environment to estimate attitude data of a satellite. When the earth satellite attitude data fusion system of the present invention is used to perform the earth satellite attitude data fusion method, the first step is to perform a body rates/quaternion attitude data processing operation. Then, the next step is to perform an attitude/rates data fusion processing operation, wherein an attitude data fusion algorithm module receives a first IAE result data from a first EKF, and a second IAE result data from a second EKF, and performs an attitude/rates data fusion algorithm in a subsystem level to evaluate an attitude estimation IAE performance based on the first IAE result data, and the second IAE result data.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: October 12, 2021
    Assignee: NATIONAL APPLIED RESEARCH LABORATORIES
    Inventors: Ying-Wen Jan, Ming-Yu Yeh, Wei-Ting Wei, Yeong-Wei Wu
  • Patent number: 11046462
    Abstract: A satellite attitude data fusion system and method is disclosed, applicable to the earth satellite environment to estimate attitude data of the satellite. When the satellite attitude data fusion system of the present invention is used to perform the satellite attitude data fusion method, the first step is to perform a body rates quaternion attitude data processing operation. Then, the next step is to perform an attitude/rates data fusion processing operation, wherein an attitude data fusion algorithm module receives the first IAE result data from the first EKF, and the second JAE result data from the second EKF, and performs an attitude/rates data fusion algorithm in a subsystem level to evaluate an attitude estimation JAE performance.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: June 29, 2021
    Assignee: NATIONAL APPLIED RESEARCH LABORATORIES
    Inventors: Ying-Wei Jan, Ming-Yu Yeh, Wei-Ting Wei, Jia-Cheng Li, Yeong-Wei Wu
  • Publication number: 20200346789
    Abstract: Provided are an earth satellite attitude data fusion system and method, applicable to an earth satellite space environment to estimate attitude data of a satellite. When the earth satellite attitude data fusion system of the present invention is used to perform the earth satellite attitude data fusion method, the first step is to perform a body rates/quaternion attitude data processing operation. Then, the next step is to perform an attitude/rates data fusion processing operation, wherein an attitude data fusion algorithm module receives a first IAE result data from a first EKF, and a second IAE result data from a second EKF, and performs an attitude/rates data fusion algorithm in a subsystem level to evaluate an attitude estimation IAE performance based on the first IAE result data, and the second IAE result data.
    Type: Application
    Filed: June 28, 2019
    Publication date: November 5, 2020
    Inventors: Ying-Wen JAN, Ming-Yu YEH, Wei-Ting WEI, Yeong-Wei WU
  • Publication number: 20200122863
    Abstract: A satellite attitude data fusion system and method is disclosed, applicable to the earth satellite environment to estimate attitude data of the satellite. When the satellite attitude data fusion system of the present invention is used to perform the satellite attitude data fusion method, the first step is to perform a body rates quaternion attitude data processing operation. Then, the next step is to perform an attitude/rates data fusion processing operation, wherein an attitude data fusion algorithm module receives the first IAE result data from the first EKF, and the second JAE result data from the second EKF, and performs an attitude/rates data fusion algorithm in a subsystem level to evaluate an attitude estimation JAE performance.
    Type: Application
    Filed: December 27, 2018
    Publication date: April 23, 2020
    Inventors: Ying-Wei JAN, Ming-Yu YEH, Wei-Ting WEI, Jia-Cheng LI, Yeong-Wei WU
  • Publication number: 20140267696
    Abstract: A glitch-free data fusion method for combining multiple attitude solutions is disclosed, wherein a star camera is set as the master star camera. After acquiring attitude solutions from the star cameras, a rotation difference is calculated between a master attitude solution acquired from the master star camera and a slave attitude solution acquired from other star cameras. Then, a steady difference is acquired from the rotation difference via a low pass filter for correcting the slave attitude solution. When combining the corrected slave attitude solutions with the master attitude solution, the attitude glitches or attitude jumps, which occur while transitioning between data fusion configurations with different number of available attitude solutions, can be eliminated.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: NATIONAL APPLIED RESEARCH LABORATORIES (NARL)
    Inventors: Ming-Yu YEH, Ying-Wen JAN, Chen-Tsung LIN, Yeong-wei Andy WU