Patents by Inventor Ming-Yuah Wu

Ming-Yuah Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Spacer Shape Engineering for Void-Free Gap-Filling Process
    Publication number: 20120025329
    Abstract: A method of forming a semiconductor device includes providing a semiconductor substrate; forming a gate stack on the semiconductor substrate; forming a gate spacer adjacent to a sidewall of the gate stack; thinning the gate spacer; and forming a secondary gate spacer on a sidewall of the gate spacer after the step of thinning the gate spacer.
    Type: Application
    Filed: October 11, 2011
    Publication date: February 2, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Yuah Wu, Yi-Shien Mor, Chih-Tang Peng, Chiung-Han Yeh, Kong-Beng Thei, Harry Chuang, Mong-Song Liang