Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: The present invention relates to a method for increasing the useful life of a shape memory alloy (SMA) actuator, wherein the SMA element contracts on heating and elongates on cooling under an applied stress and that property is used as an actuating technique. More specifically, the present invention relates to the cooling aspect of the cycle and maintaining a martensite strain on the actuator SMA element at less than about 3% by limiting the upper stress on the element. In the most preferred embodiment, the element is a ribbon actuator prepared from a nickel-titanium SMA alloy.

Abstract: A high temperature titanium-based shaped memory alloy contains from at least 0.1 at. % hafnium. Articles formed from the disclosed alloy have high transformation temperatures. The alloy of the invention can be successfully hot and cold worked to make articles such as springs and wires.