Abstract: A Focal Plane Assembly (FPA) of a remote sensing satellite for receiving a focal plane image provided by an optical lens, comprises a sub-pixel shifting field separator, a first linear image sensor, and a second linear image sensor. The field separator split the focal plane image up into a first half focal plane image and a second half focal plane image, the first linear image sensor, located at an edge of a half focal plane, receives the first half focal plane image to generate a first image, the second linear image sensor, located at an edge of another half focal plane, receives the second half focal plane image to generate a second image, wherein a sub-pixel shifting relation is between the first image and the second image.

Abstract: Systems and methods are disclosed for operating a highly linearized resistance for a switch through use of a bootstrapped features. In one exemplary implementation, there is provided a method and system that implements a method for operating a circuit configured to provide a highly linearized resistance including receiving a signal via a bootstrapped switch, coupling the received signal to a gate if the received signal is high, receiving a signal via a switch control input coupled to a high impedance element. Moreover, the method includes coupling the high impedance element to the gate and turning off the switch via a gate turn off when the gate turn off pulls the gate low.

Abstract: Systems and methods are disclosed for operating a highly linearized resistance for a switch through use of a bootstrapped features. In one exemplary implementation, there is provided a method and system that implements a method for operating a circuit configured to provide a highly linearized resistance including receiving a signal via a bootstrapped switch, coupling the received signal to a gate if the received signal is high, receiving a signal via a switch control input coupled to a high impedance element. Moreover, the method includes coupling the high impedance element to the gate and turning off the switch via a gate turn off when the gate turn off pulls the gate low.

Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.

Abstract: Systems and methods are disclosed for operating a highly linearized resistance for a switch through use of a bootstrapped features. In one exemplary implementation, there is provided a method and system that implements a method for operating a circuit configured to provide a highly linearized resistance including receiving a signal via a bootstrapped switch, coupling the received signal to a gate if the received signal is high, receiving a signal via a switch control input coupled to a high impedance element. Moreover, the method includes coupling the high impedance element to the gate and turning off the switch via a gate turn off when the gate turn off pulls the gate low.

Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.

Abstract: Systems and methods are disclosed for operating a highly linearized resistance for a switch through use of a bootstrapped features. In one exemplary implementation, there is provided a method and system that implements a method for operating a circuit configured to provide a highly linearized resistance including receiving a signal via a bootstrapped switch, coupling the received signal to a gate if the received signal is high, receiving a signal via a switch control input coupled to a high impedance element. Moreover, the method includes coupling the high impedance element to the gate and turning off the switch via a gate turn off when the gate turn off pulls the gate low.

Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.

Abstract: A visual field testing apparatus for scanning the visual field of a human eye in great detail, precision, and clarity so as to detect the smallest blind area whereby allowing users the ability of early detection of glaucoma and other eye diseases of visual loss. The apparatus is small and inexpensive so that anyone can afford to purchase it and self-test without assistance so that the user can test frequently at home which further leads to early detection of eye diseases. Because of its great precision and detail in test results, the present invention is especially useful to doctors and researchers.

Abstract: A visual field testing apparatus for scanning the visual field of a human eye in great detail, precision, and clarity so as to detect the smallest blind area whereby allowing users the ability of early detection of glaucoma and other eye diseases of visual loss. The apparatus is small and inexpensive so that anyone can afford to purchase it and self-test without assistance so that the user can test frequently at home which further leads to early detection of eye diseases. Because of its great precision and detail in test results, the present invention is especially useful to doctors and researchers. One embodiment of the present invention is a visual field tester which comprises: (a) a recording surface having eye fixation means to fixate an eye's visual field relative to said recording surface; and (b) a handheld scanning device which has a test mark for detecting very small blind areas in said eye's visual field and marking means for mapping said detected very small blind areas onto said recording surface.

Abstract: An illuminated card device formed from sheet stock, for use as a greeting card or the like. One or more EL lamps are attached either flat against the card or mounted as pop-up elements. Two wires lead out from the EL lamps to a high voltage driver circuitry that converts a low voltage signal into an AC high voltage signal (approximately 40V to 300V peak to peak.) This circuitry is mounted on a PCB, hidden from view. A sliding tab in the shape of a ‘t’ slides through two slits in the card. Metal elements are mounted to the tab and between the two slits. When the card is opened, the two metal elements make contact, creating an electrical short to allow the battery to supply current to the high voltage conversion circuit. The high voltage driver circuit provides signals to illuminate the EL lamps.