Patents by Inventor Ming-Yuang Cheng

Ming-Yuang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for stabilizing plating film impurities
    Patent number: 7481910
    Abstract: A method of stabilizing plating film impurities in an electrochemical plating bath solution is disclosed. The method includes providing an electrochemical plating machine in which an electrochemical plating process is carried out. A by-product bath solution is formed by continually removing a pre-filtered bath solution from the machine and removing an additive from the pre-filtered bath solution. A clean bath solution is formed by removing an additive by-product from the by-product bath solution. An additive bath solution is formed by adding a fresh additive to the clean bath solution. The additive bath solution is added to the electrochemical plating machine. An apparatus for stabilizing film impurities in an electrochemical plating bath solution is also disclosed.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: January 27, 2009
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsien-Ping Feng, Ming-Yuang Cheng, Si-Kwua Cheng, Steven Lin, Jung-Chih Tsao, Chen-Peng Fan, Chi-Wen Liu
  • Method and apparatus for stabilizing plating film impurities
    Publication number: 20060000717
    Abstract: A method of stabilizing plating film impurities in an electrochemical plating bath solution is disclosed. The method includes providing an electrochemical plating machine in which an electrochemical plating process is carried out. A by-product bath solution is formed by continually removing a pre-filtered bath solution from the machine and removing an additive from the pre-filtered bath solution. A clean bath solution is formed by removing an additive by-product from the by-product bath solution. An additive bath solution is formed by adding a fresh additive to the clean bath solution. The additive bath solution is added to the electrochemical plating machine. An apparatus for stabilizing film impurities in an electrochemical plating bath solution is also disclosed.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Inventors: Hsien-Ping Feng, Ming-Yuang Cheng, Si-Kwua Cheng, Steven Lin, Jung-Chih Tsao, Chen-Peng Fan, Chi-Wen Liu